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Engineer Test

Location:
Teaneck, New Jersey, United States
Posted:
March 13, 2018

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UTTAM KUMAR CHALAMALASETTY

Professional Summary:

Experience with testing devices functionality and characterization on bench using the datasheet (specifications and limitations of the device) of the device.

Technical expertise in designing and test planning, debugging on electrical and electronic/embedded devices

Experience on Silicon On Chip SoC consist of Digital, Mixed Signal and targeted to with 15GhZ processor and High Speed interfaces such as HSIO, USB with DDR2, this chip was tested for Manufacturing tests such as SAF, TDF, PDF and Logic BIST.

Ran IC validation/characterization/production test on bench and ATE Environment for RF and Transceiver devices.

Debugged patterns of High speed block (USBHSPHY). Bring up and development of Modem blocks.

Debugged patterns/vectors generated based on DFT – Design for testability design using Verigy Tools.

Familiar with oscilloscopes, network / spectrum analyzers, signal generators, and logic analyzers.

Hard working team player with excellent communication skills and can deliver assigned work on time.

Technical Skills:

Languages C, C ++, Shell and Perl scripting

Verilog, VHDL, MATLAB, Mutlisim

Windows and LINUX operating systems, Microsoft Word/PowerPoint and Excel

Tester platform : ADVANTEST, Verigy 93K

Debugging Tools: JTAG, Shmoo, Error Map, Pin margin, Timing diagram, Pattern editor

Professional Experience:

Tessolve Semiconductors Pvt Ltd, Bangalore, IND

Post Silicon Validation Engineer May 2013 - Apr 2014

Created a test plan for silicon validation from wafer level to package level

Debugged patterns/vectors generated based on DFT – Design for testability design using Verigy Tools

Performed correlation of devices from wafer to package level across temperatures and Voltage corners

Worked with different teams during the project for successful validation.

Gained experience on Silicon On Chip SoC consist of Digital, Mixed Signal and targeted to with 15GhZ processor and High Speed interfaces such as HSIO, USB with DDR2, this chip was tested for Manufacturing tests such as SAF, TDF, PDF and Logic BIST.

Tessolve Semiconductors Pvt Ltd, IND

Client: Qualcomm Inc.

Test Engineer Intern Dec 2012 – Apr 2013

Created and integrated test program by collecting updated individual block owners test program and or supporting files

Accompanied senior test engineer in validation of test programs

Supported lead in creation test plan for silicon validation from wafer to package level

As a part of internship Tessolve trained us on testing devices functionality and characterization on bench using the datasheet (specifications and limitations of the device) of the device.

At the end of our internship we did bench characterization on a shift register for our understanding about bench characterization and we did check its functionality.

Academic Projects:

MSM-mobile processor (mobile processor28nm chip) Mar- May 2013

As associate test engineer in validation of test programs

Correlated test program on volume parts across corners and temperatures

Evaluated devices across corners and presented effectively using Macros

Application processors for network products (data modem device 28nm chip) Jun- Oct 2013

Assisted lead in creation of test plan for silicon validation from wafer to package level

Debugged patterns of High speed block (USBHSPHY) by working very closely with Bangalore SIM (simulation team)

Brought up and debugged pattern for Functional blocks

Executed program on volume parts across corners and temperatures before releasing program to SATS (Semiconductor assembly and test service)

Backed up in creation of Final Tests Production Program, Integration

FSM SoC (28nm chip) Dec 2013 – Mar 2014

Created an integrated test program by analyzed data from updated individual block owners test program and other supporting files

Facilitated integration with SVN (Sub version repository) and mfh (master file handler)

lifted up program based on customer requirement for structural blocks and broughtup the patterns

Academic Projects:

Travel Mobile Charger Jun 2011 – Dec 2011

Constructed a portable travel mobile charger which can be charged using batteries

Built a circuit on a temporary circuit board and used basic electric components such as Resistor, Diodes and IC555

Used the property of IC555 as a Multi vibrator and constructed a portable travel mobile charger

Spy car Jan 2012 – May 2012

Constructed a toy car using H bridge circuit and DC motors

Used RF-232 a radio frequency transmitting device to control the directions of the car

Programmed the inputs to H-bridge circuit to move the car in all the directions

Used the Samsung Note 2 and app Smart Cam to Stream video by connecting the surveillance device to Phone using either Wi-Fi or Bluetooth connectivity

Voting machine Aug 2015 – Dec 2015

Created a VHDL code to count the number of people voting

Simulated VHDL code in the Xilinx simulation tool and executed it without flaws

Evaluated VHDL code in the Spartan 3 FPGA board and checked the output

Submitted a detailed report on the project and presented with a power point presentation

Education:

Master of Science Electrical Engineering Aug 2015-May 2017

Fairleigh Dickinson University, Teaneck, NJ

Courses:

oLogic system design: Detailed study of Digital circuits and did our final project on Xilinx

oDigital signal processing: Latest signal processing techniques and Matlab

oComputer and communication networks: Networking and constructed Lan Networks in Riverbed tool

oMicroprocessor and Design: Assembly language and detailed study on Microprocessors and Micro controllers

oEmbedded systems: interfacing the electronic devices and software programs and worked on basic programs on Kyle embedded development tool

oIntegrated circuits and devices: Detailed study of semiconductor devices fabrication and packaging

oComputer aided analysis design: Pspice and Matlab evaluation of electronic circuits

Bachelors of Technology in Electronics and Communication Engineering Jun 2009 - May 2013

Koneru Lakshmaiah University, AP, INDIA



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