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Failure analysis engineer

Toledo, Ohio, United States
November 13, 2017

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Vamsi Borra, 216-***-****


A self-motivated, dedicated and organized researcher with over three years of hands-on experience (with knowledge on underlying physics) in failure analysis, semiconductor device fabrication, characterization, testing, troubleshooting and lasers. Proven skills in problem solving, creative thinking, reliability, collaboration, coordination, and meeting deadlines without compromising on customer relationships. Excellent communication (verbal and written) skills. Education

University of Toledo, College of Engineering- Toledo, OH Ph.D. candidate, Electrical Engineering program, Research Focus Area: Solid-State and RF Devices and Systems Dissertation: Metal Whiskers: The Role of Electric Fields in the Formation Mechanism and Methods for Whisker Growth Mitigation

Current GPA: 3.9/4.0

Youngstown State University, College of STEM- Youngstown, OH Master of Science in Electrical & Computer Engineering, May 2014 GPA: 3.9/4.0

Jawaharlal Nehru Technological University- Hyderabad, India Bachelor of Electronics and Communication Engineering, April 2011 GPA: 3.3/4.0

Characterization / Fabrication Skills

● Transmission Electron Microscopy (TEM) ● Scanning Electron Microscopy (SEM) ● Focused ion beam (FIB) milling and TEM sample preparation● Energy-dispersive X-ray spectroscopy (EDX) ● X-ray powder diffraction (XRD) ● Atomic-force Microscopy (AFM) ● Raman ● FTIR ● Plasma assisted deposition ● High Voltage testing ● I-V and C-V measurements ● Profilometry ● Thin film deposition ● Electroplating ● Lithography ● RF & DC Sputtering ● Thermal Evaporation ● Chemical vapor deposition (CVD) ● Electrospinning (Nano fibers) ● Metal polishing ● Class 10,000 Clean room operations

● Design of experiments (DOE) ● Failure analysis ● Statistical Process Control (SPC) ● Data acquisition setups Technical Skills

● C ● Python ● MATLAB ● ORIGIN ● PSPICE ● Multisim ● LTspice ● RSLogix 5000- PLCs ● EasyPower-ARC flash studies ● AUTOCAD (blueprints) ● REVIT MEP (schematics)● Microsoft Office Suite ● LATEX ● WINDOWS OS ● LINUX (Ubuntu, Fedora) ● Raspbian ● Arduino IDE ● gcc ● HTML Awards & Honors

Recipient, IEEE-EECS Best Graduate Student of the Year (2016 - 2017) award from the University of Toledo Electrical Engineering department, April 2017.

Award based on the service to IEEE student section, academic achievement and campus participation.

Received Young Engineer of the Year award from IEEE Toledo section for outstanding service to the section, Nov 2016.

Recipient, Teaching assistant of the Year (2015 - 2016) award from the University of Toledo Electrical Engineering department for the distinguished support to the department, April 2016. Research Experience

University of Toledo, College of Engineering, Toledo, OH Research Member – Electronic Materials Characterization Lab (Aug 2014 – Present)

Employed DPSS laser to generate Surface Plasmon Polaritons (SPPs) on metal films.

Utilized pulsed laser in conducting accelerated reliability testing experiments.

Developed accelerated failure testing methods for semiconductor / integrated circuit (IC) components reliability.

Fabricated microbumps structures on Ni films using Nd:YAG Q-switched pulsed laser.

Thin film deposition by sputtering, evaporation and electroplating.

Electrospinning of nanofibers, including coaxial electrospinning.

Material characterization by XRD, SEM, TEM, FIB, EDX, AFM, Raman spectroscopy, profilometry, various electrical techniques and data analysis. Trained lab members in using characterization tools and products. Researcher / Characterization tool assistant – Center for Materials and Sensor Characterization (May 2016 – Present)

Material and device characterization assistance (TEM, FIB, XRD, SEM, EDX) to various clients across USA. Worked on several projects with a total value greater than $50K.

Implemented software upgrade to the material characterization machine, resulting in greater usability and 95% reduction in costs.

Troubleshoot and technical support to all graduate researchers in the research center. Youngstown State University-Youngstown, OH

Graduate Research Assistant (Jan 2013 – May 2014)

Designed and modeled a High performance LED Driver with turn-on snubber.

Used Cadence P SPICE simulation software in designing the LED drivers.

Used LEVEL-3 MOSFET (IRF034) for more accuracy and less convergence problems.

Implemented LED modelling using P SPICE Model library editor. Teaching Experience

University of Toledo, College of Engineering- Toledo, OH Part-time Instructor – Engineering Technology (Aug 2015 – May 2017)

Developed and taught the following courses (including lab experiments) to sophomores, juniors and seniors.

Fundamentals of Electricity-ENGT 3050 (Fall 15 & Spring 16)

C programming-EET 3150 (Fall 16)

Electronic Devices Apps-EET 2020 (Spring 17)

Graduate Teaching Assistant (Aug 2014 – Aug 2015)

Taught electric circuit labs (Electronics 1 & 2 – 3400 & 3220). Graded midterms and home works. Youngstown State University-Youngstown, OH

Graduate Teaching Assistant (Aug 2012 – May 2013)

Digital and Computer Circuits –, (Jan 2013 – May 2013). Linear Control Systems, (Aug 2012 - Dec 2012).

Designed and tested combinational and sequential logic circuits. Used LogicAid & SimUaid for analysis.

Designed PD and PID controller on ECP products (2-mass systems).

Root locus controller design using MATLAB’s SISOTOOL.

Assisted students on their PLC (Micrologix1000) projects.

Conducted the experiments prior the lab session and troubleshot equipment. Industrial Experience

Valley Electrical Consolidated Inc. - Girard, OH

Electrical Engineer (May 2013 – August 2014)

Arc Flash Studies (IEEE-1584 standards).

Control and Automation for well pads using SCADA pack 334.

PLC programming/Control and Automation using RSLogix 5000.

Electrical service designs (Commercial and residential).

Power Distribution using Revit MEP (produced schematics and blueprints).

Analyzing data of power and harmonic readings. Lighting Analysis using AGI-32 and REVIT MEP.

Provided Return of Investment studies to clients on energy efficient investments.

Collaborated with multi-disciplinary and cross-cultural teams for successful execution of challenging projects on time.

Patent Applications

V. Borra, S. Itapu, and D. Georgiev, “Whisker mitigation using a semiconductor sublayer”, Nov 2017, U.S. Provisional application, pending.

Publications and presentations

V. Borra, S. Itapu, and D. Georgiev, “Sn whisker mitigation using a NiO underlying layer”, Journal of Physics D: Applied Physics, 2017.

V. Borra, D. G. Georgiev, and V. G. Karpov, “Cultivating Metal Whiskers by Surface Plasmon Polariton Excitation,” MRS Adv., vol. 1, no. 12, pp. 805–810, Feb. 2016.

M. Killefer, V. Borra, et al “Whisker growth on Sn thin film accelerated under gamma-ray induced electric field”, Journal of Physics D: Applied Physics, 2017

V. Borra, D. G. Georgiev, and C. R. Grice, “Fabrication of optically smooth Sn thin films,” Thin Solid Films, vol. 616, 2016.

V. Borra, D. G. Georgiev, and V. G. Karpov, “Modification of Metal Surfaces by Surface Plasmon Polariton Excitation (In preparation)”.

S. Itapu, V. Borra, and D. Georgiev, “Fabrication of Ni bumps using laser irradiation (In preparation)”

V. Borra et al., “Gamma-ray induced growth of metal whiskers”, Poster presentation 59th American Association of Physicists in Medicine, Denver, CO, 2017.

V. Borra, D. Georgiev and V. Karpov “Cultivating Metal Whiskers by Surface Plasmon Polariton Excitation”, Poster presented at Material Research Society Fall 2015 meeting, Boston, MA, 2015.

V. Borra et al., “Electric field stimulated growth of Zn and Sn whiskers”, 9th International Symposium on Tin Whiskers, CALCE, Essen, Germany, 2015.

Professional affiliations and services

Chair of IEEE Young Professionals Toledo Section (Jan 2015 – Present).

Member: IEEE, American Physical Society (APS).

Active member Graduate Student Association (GSA)-University of Toledo (Aug 2014 - Present).

Founder, Electrical Engineering class SMS Club (2010 - 2011).

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