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Application for the position PCB layout design

Location:
Gurugram, Haryana, India
Posted:
August 29, 2017

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Ramkumar.R

No *,Devaraj street,

PATTALAM,

CHENNAI- 600012.

5+ years of experience in PCB Layout design

Career Objective:

To associate with a progressive organization that gives scope to involve my knowledge and skills in the area of development and designing in electronics with the best of my capabilities while working in an innovative and dedicated team . Relevant Professional Experience:

Rejoined as Senior PCB LAYOUT DESIGNER at VVDN Technologies Pvt Ltd. Gurgaon since

(December 2016 to till date)

Worked as Senior PCB LAYOUT DESIGNER at Mando Softtech India Pvt Ltd. Gurgaon since

(Dec 2015 to September 2016).

Worked as Junior PCB LAYOUT DESIGNER at VVDN Technologies Pvt Ltd . Gurgaon since

(FEB 2014 to November 2015).

Worked as Junior PCB LAYOUT DESIGNER at Virya InfoTech Pvt Ltd, Chennai since

(June 2011 January 2014).

Job description:

Designing of double and multilayer PCB boards having mixed signals,RF,Power Boards, Probe cards and high speed boards.

Ability to handle the PCB Project individually

Schematic Drafting and Net-list extraction.

PCB Parts Library Creation.

Major and Discrete components Placement as per customer needs.

Capable to plan the layer structure as per design requirement

Basic Transmission line concepts to pursue PCB design.

Take care of EMI and EMC consideration .

Signal grouping and classification.

Consider prospect of DFA and DFM as per design

Constraints settings.

Blind and buried via concepts ( HDI).

Pin –Pair and Combination-net(X net) Length matching.

Plane splitting & Power dropping.

Routing - Clock Signals, Critical signals, Arc routing, Differential pair, Bus & Single Ended Traces with noise consideration.

DRC checking and clearing.

Gerber files generation and viewing.

E-mail: ac119x@r.postjobfree.com

Phone No: +919677398780

Highlight:

Experience in Multilayer High Speed Printed Circuit Board.

Expertise in High Speed Routing, Length Matching like (DDR2, DDR3 SDRAM, PCI,SATA,HDMI,USB,Rj45,CAN and Uart.

Get opportunity working on ( Off- site) Sanmina Technologies Chennai, since July 2013 to December 2013. Worked for Intel ATE design board.

Design PCB layout for IDB Project (Integrated Dynamic brake system) at Mando Softtech India Pvt Ltd. For Hyundai Genesis car for brakes system went for mass production.

Familiar with following Topology style routing.

Familiar with Arc Routing style for high frequency Mhz signals Skill Set:

EDA (Engineering Design Automation) Tools

PCB Design Tool Cadence – Allegro Familiar with 16.2 version to 17.2. Pads,Altium,and Mentor graphic Expedition Beginner. version

Schematic Design tools Cadence – Orcad version 16.2 to 17.2 version Interface

USB, Ethernet, DDR2-3, SDRAM, PCI,SATA,SPI,I2C,UART,CAN. Cam check tool View mate and cam350

Projects:

1. VEHICLE TRACKING BOARD :

Description:

The Vehicle tracking board delivers high speed network connectivity to vehicles by leveraging the 3G network. It provides a seamless connection regardless how fast you are traveling. This allows users in and around the vehicle to access the Internet using any Wi-Fi enabled device.

Features:

10 Layers stack up with 63mils thickness.

Maximum number of pins in single IC is 2518.

The minimum pitch across pins is 19.6mils with 4 mils trace width & 4mils spacing.

The minimum drill size used in the board is 9 mils. Components:

GSM Module with Built in GPS

MCU 16BIT 128K FLASH 80-QFP

MCU ARM11 400MHZ

DDR2 SDRAM 512MBIT

2. DIGITAL FFT SPECTROMETER : (A/D CONVERTER)

Description:

This project used to convert the high frequency input analog signal to digital LVDS signal. The analog data input signal from SMA connector is given to A/D convertor. The encoded data is DE multiplexed into 16 low-power LVDS signals. Then the 16 LVDS signal is given to two DMUX unit. This unit delivers the 16 LVDS signal to FMC connector from 8 LVDS input. Features:

10 Layers stack up with 63mils thickness.

Maximum number of pins in single IC is 243.

The minimum pitch across pins is 19.69 mils with 4mils trace width &4 mils spacing.

The minimum drill size used in the board is 12 mils. Components:

ASNT7120KMA 10.0 GSPS A/D converter (100 PIN TQFP package)

ASTN2032MBL DMUX with LVDS interface (BGA 243)

ASTN134488-01 FMC connector male with 400 pin

SMA connector

3.GPS BASED TIME AND FREQUENCY RECEIVER WITH IEEE-1588 CAPABILITY (PTP) AND NTP SERVER EQUIPMENT.

Description:

VCLI_NTPS is designed as a GPS based Time and Frequency receiver with Master/Slave IEEE- 1588 capability and NTP server equipment. GPS based time and frequency synchronization solution which can be used to synchronize the time-of-day and frequency across all nodes of the network (IEEE-1588 protocol) from single, highly accurate GPS reference. This unit can be assembled to be used in IEEE-1588 PTP Master with GPS receiver orIEEE-1588 Slave PTP without GPS receiver.

Features:

This board has 6 Layers stack up with the board size of 12.2”x 9.64” with 63 mils thickness.

PowerQUICCTM II Pro Integrated Host Processor of 689 pin.

The minimum pitch across pins is 39.37 mils with 5mils trace width &5 mils spacing.

The minimum drill size used in the board is 10 mils.

Design consists of 30 ohms, 50 ohms, 75 ohms, 90 ohms, 100 ohms. Components:

DDR2, 64Mb, x16bit, 333MHz, BGA-84.

Module, GPS, UART+I2C, 50-channel.

Conn, SFP Cage, 2x1, Four Light Pipe, RA, TH

IC, NOR Flash, 256Mb, x16bit, 90ns, TSOP-56

IC, NAND Flash, 512MB, x8bit, 25ns, TSOP

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4.FAX over LTE (LONG Term evlution )4g Adapter:

Description:

It is a Fax Adapter working on LTE IMS Network (USA standard) which includes antenna, SLIC Device & LTE module.

Features:

This board has 6 Layers stack up with the board size of 5.11”x 5.11” with 63 mils thickness.

Maximum number of pins in single IC is 369.

The minimum pitch across pins is 31.49 mils with 4.5mils trace width &4.5 mils spacing.

The minimum drill size used in the board is 8 mils. Components:

Module, GPS/GSM, USB+SIM+UART, Dual-band, SMD-144

SLIC110, Smart Subscriber Line Interface Circuit, VQFN-48

Conn, SMA JACK, 1x1, 50E, 18GHz, RA, SMD

DDR2, 128MB, x16bit, 800MHz, BGA-84

5.Designand implementation of T4240 Based Multi-Function Communication Server Board:

Description: A dual T4240 communication server, offering a powerful unified communication solution with High speed of external network connectivity, SRIO inter-chip connectivity. Product will be designed with flexibly to make three different applications which are Communication Server, Communication Server Scale-out option and Datacenter Storage Appliance. Design consists of 6 backplane cards.

Features:

This board has 20 Layers stack up with the board size of 12”x 13” with 3.4 mm thickness.

This board has 10 Layers stack up with the board size of 4.48”x 5.51” with 1.6 mm thickness.

This board has 6 Layers stack up with the board size of 8.79”x 1.47” with 2.5 mm thickness

Design consists of 50 ohms, 90 ohms, 100 ohms

Design consists of 1G, 5G, 10G Ethernet signals.

Design consists of Arc routing for high speed signals. Component:

BGA19324, 1 mm pitch.

DDR3, Flash memory.

PCI, Mini-SAS connector

USB, Rj45,DB9

C29PCI card, SATA

UART, RGMI

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6. BIB (Burn in Board):

Description :

I have designed a process (BIB) done to components prior to regular use in which the components are stressed to detect failure and ensure component reliability. Features:

This board has 12 Layers stack up with the board size of 22.67”x 11.04” with 63 mils thickness.

Used 40 Socket of BGA with the pin count of 225.

The design consist of blind & buried via (6/12) for bga fan-out.

The design consist constrains 5mil trace width and 5 mil spacing, via used 15/30 5. ATE Boards:

Description:

Features:

Automated Test Equipment’s PCB used to by silicon vendors to check their DUT ics Device under test for functionality .

32 Layers stack up with 293mils thickness.

Maximum number of pins in BGA is 2808.

The minimum pitch across pins is 39.37 mils with 5.5mils trace width & 4.9mils spacing.

The minimum drill size used in the board is 14 mils. 7. General Boards and Power Boards:

I have designed various non-high speed boards types of Power supplies, General purpose and Industrial boards such as Transmitter, Receiver, Sensor,Adapter boards and for automobile parts design for ECU .

Features:

2 layer to 6 layers of 63 mils thickness.

The minimum pitch across pins is 25.5 mils with 5mils trace width & 5mils spacing.

The minimum drill size used in the board is 10 mils. Component:

Microcontroller 1mm pitch

Motor section

ASIC

USB, Rj45,DB9

CAN and Lyn

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Personality Traits:

Positive attitude towards life.

Openness towards learning new skills.

Ability to work hard in adverse circumstances.

To meet the targets without losing patience.

Honesty with a sense of purpose.

Academic Profile:

BSc in Electronics ( 2007-2010)

C.Abdual Hakeem Arts & Science college,

Melvishram,

Vellore-632509

Personal Information:

Name : Ram Kumar. R

Father’s Name : Mr. C.Ravi

Age & Date of Birth : 27 years, 13th October 1988. Languages known : Tamil, English.

Nationality : Indian

Permanent address : No H-29 Palar Garden,

Sathuvachari,

Vellore-632009

Landline No : 0416-2257851

Declaration:

I hereby declare that information furnished above is true to best of my knowledge and belief. Place: Chennai yours faithfully

Date: (RAM KUMAR.R)



Contact this candidate