CHITLAPALLY RAMMOHAN
Email ID : *******@*****.***
Mobile No: 950-***-****, 809-***-****
OBJECTIVE
To be engaged in an organization that specializes in the development,
design, testing and manufacturing of Printed Circuit Boards for various
applications.
SYNOPSIS
> B Tech in Electronics & Communications engineering with 2.9 Years of
Experience in the PCB DESIGN .
> My Extensive Experience includes Schematic Design with Mentor Graphics
PADSlogic, Orcad9.0. And PCB Designing of Multi Layer Boards & Single
Side Boards with Mentor Graphics (PADS9.3), Cadence (Allegro16.2) and
Zuken (Cadstar12.0).
> Designed PCB layouts of small to medium complexity for most of the
Defense and research organizations and Telecom and Power Organization.
> Maintained symbol libraries for schematic tools and footprint libraries
for various PCB design tools as per IPC 7351, IPC 2221 and IEEE
standards.
> Accustomed to designing PCB's with an awareness of "Design for
Manufacturing, Assembly and Test" requirement.
> Hands on expertise with circuit boards containing Blind and Buried
Vias, BGA Component (289pins, pitch-1mm, Pad-0.6mm, Via Drill-0.3mm),
Digital, Analog and mixed signal designs CPLDs and FPGAs.
> Generation of all documents for PCB Design & Development, Fabrication &
assembly needs and debugging, testing and component specifications,
Debugging and testing and component specifications. .
> Strong at planning and execution skills along with a systematic
approach.
CAREER GRAPH
> Working as a PCB Designer at VMC SYSTEMS Ltd from DEC 2012 to Till
Date, Maheswharam, Hyderabad.
> Worked as a PCB Designer at ANALOGIC CONTROLS INDIA Ltd from NOV 2011
to NOV 2012, Medchal, Hyderabad.
> Worked as a trainee PCB Designer in NeoChip Technology from AUG 2010 to
Nov 2011 at Hyderabad.
EDUCATION QUALIFICATION
> Bachelor of Electronics and Communication Engineering from JNTU
University,
Hyderabad, India.
TECHNICAL SKILLS
> Cadence : Orcad Schematic capture, Allegro 16.2
> Mentor Graphics : Pads Logic, Pads Layout,Pads Router 9.3
> Zuken : CadStar 12.0
WORK EXPERIENCE
Project title : Controller Card
Organization : Analogic Controls India Limited.
Tool Used : Oracd9.0 for Schematic, Zuken Cadstar12.0 for Layout,
Cam350 for Gerber verification.
Project Description: This is a 8 layer card containing components of
BGA(1mmpitch,0.6 Pad,0.3mm drill),Euro 96pin Connector, and SOIC,0805,1206
and QFP Packages, and this Boards Contains Blind and Buried Vias.
Contribution: Discussed with the Manufacturer about micro vias drill
details and blind buried vias values and Stack Up Details, Complete
Schematic entry and optimized logic for layout, Placement of Components,
routing of BGA components and QFP Components and generation of Gerber,
verifying of Gerber.
Project title : Signal Conditioner Package
Organization: Analogic Controls India Limited.
Tool Used : Cadence Oracd9.0 for Schematic, Allegro16.2 for Layout,
Cam350 for Gerber verification.
Project Description: The Signal Conditioner Package provides an Interface
between Sensors/Transducers and Sensors/Transducers it serves. It provides
Excitation to passive Transducers or Sensors and effects isolation,
amplifies the signals, And shifts the signals levels to desire levels. And
it contains a 6 layers and containing components of SOT, SOIC,DIP,TQFP,
PLCC Packages and it contains 3Power planes.
Project title : EM MK_II Microcontroller Card
Organization : Analogic Controls India Limited.
Tool Used : Mentor Graphics pads logic9.3 for Schematic, Pads layout9.3
for Layout, Cam350 for Gerber verification.
Project Description: This is a 4 layer card containing components of DIP,TQFP, PLCC Packages and M-MK2 CONNECTOR-12pin-m-ARDE, AND 2512 PACKAGES
and it contains 2Power planes.
ROLES AND RESPONSIBILITIES
> Taking Inputs from the Client.
> Responsible for Hardware analysis Symbol creation & Schematic
capturing using Or CAD and Pads Logic for the above boards.
> Library Development as per the IPC 2221 standards & PCB Design, and
Foot print Creation as per IPC 7351 Standard, & Layer Stack, Board
creation, Database creation, Placement, Routing.
> Responsible for routing of High speed Signals of differential Signals,
clock signals and impedance controlled signals.
> Also responsible for Bill of Materials and Components Properties and
attributes Update in Schematic drawing and Bill of Materials
generation from Schematic and Debugging and testing and component
specifications.
> Modification of completed PCBs to reduce cost and performance, &
Component selection with mechanical, electrical and sourcing team.
> Responsible for Gerber files generation in RS 274x format and Gerber
verification using CAM 350.
PERSONAL DETAILS
Date of birth : 04-10-1988.
Languages known : Telugu, Hindi, English.
Marital status : Single.
Gender : Male.
Address : 9-1-1/c/26 Defence Colony, Langer House,
Hyderabad.
I hereby declare that the above information and particulars are true
and correct to the best of my knowledge and belief.
Place: Hyderabad (Ch.Rammohan)
Date: