Senior Anlog/RF Engineer
Resume:
ARUN KUNDU
Phoenix, AZ ****8
Phone: 602 -722 -3387
Cell: 602-***-****
E-Mail: *******@*****.***
Education
Ph. D Electrical & Electronic Engineering
1996 Yamaguchi University ,
M.S Electrical Engineering
Work History
October 2009 to Current
Intel Corporation ,
Senior Power Integrity Engineer
February 2006 to September 2009
Intel Corporation ,
Senior Wireless System Engineer
to
Lead Engineer
to
Senior RF Module/Component Engineer
October 2001 to January 2006
TDK R&D Corporation ,
Senior RF Design Engineer
April 1999 to September 2001
TDK Corporation ,
Senior R&D Engineer
Accomplishments
The Lead System Integration Engineer for Intel Single Package Modem (SPM) technology development that integrates the complete 3G/GSM smart phone system into the smallest volume form factor for the first time in the world.
The Lead Engineer for Intel Wi-MAX module, system design and product development that integrates the RFIC & Front End Module (FEM) in single packaged laminate module for the first time at Intel.
Lead Power delivery Engineer for Jordan Creek Chipset (IVY town product).
Lead validation Engineer for Poulson CRO (Cost reduction opportunity) project.
The Lead Engineer for Intel UMG Comms group for Si-wafer integrated RF Passive Devices technology and product development that implement low cost highly integrated passive components, as inductor and circuits, as filters, on die.
The Lead Engineer for design/development of TDK LTCC (low temperature co-fired ceramic) Wi-Fi FEM (front end module).
TDK has been selected by Intel as the primary supplier of the Wi-Fi FEM.
Hold Nine US patents as lead/sole inventor.
Published 25 papers in peer-reviewed Journal and Symposium digests.
Key Qualifications WiFi/WiMAX/3G Design System Hardware design Signal/Power Integrity Circuit/Module Design Wireless System Optimization Si Integrated Passive devices EM/Circuit simulation Hardware validation/debugging Schematic Capture.
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