Quality Assurance Engineer
Resume:
Yudong Ming
Hoffman Estates, IL 60192
Email: *******@*******.***
SUMMARY
Accomplished professional with proven expertise in Manufacturing
Engineering, Quality Assurance, Micromachining (MEMS), Nanotechnology and
Semiconductor industries. Member of numerous teams that improved
throughput, product quality and customer satisfaction. Led or participated
in capital projects, engineering and new product development teams. Worked
well with both internal and external suppliers and customers. Effective
collaborator with major strengths in developing production processes,
identifying and implementing quality and yield improvements,
troubleshooting and problem solving using structured and effective methods.
PROFESSIONAL EXPERIENCE/ SELECTED ACCOMPLISHMENTS
Nanoink, Inc, Skokie, IL
2010 - 2013
NanoInk, Inc. is a nanotechnology company specializing in nanometer-scale
manufacturing and applications development for the life sciences,
engineering, pharmaceutical, and education industries.
Manufacturing Engineer
. Developed and improved manufacturing processes for NanoGuardian and
NanoFabrication product lines.
o Developed and improved epoxy stenciling process, reduced failure to
0% from 20%.
o Investigated root cause and reduced die leveling failure to 0.6%
from 10%
o Reduced 40% of cycle time and 50% of materials for micromachining
process.
. Developed and implemented inspection tests and methods for
nanofabrication.
o Established and implemented inspection tests and methods for
incoming electrical and mechanical components.
o Developed and conducted electrical, mechanical and operational in-
process tests and inspection methods including adhesion,
planarization, stenciling processes and load cell operations.
o Extensive use of microscopy methods for problem and cause
identification.
. Initiated and enhanced procedures for operation of micromachining,
nanofabrication processes, instrument assemblies and production testing.
. Introduced new products, processes, assemblies from engineering phase to
production.
. Worked with suppliers and customers to improve process and product
quality.
o Significantly improved laser cut uniformity for dicing process.
o Identified root cause and improved process to prevent recurrence
for die adhesion failure.
. Processes, assembly, test and analysis involved: silicon etch, gold etch,
critical cleaning of components, stenciling, dicing, pick & place, die
attach, fixture assembly, instrument assembly, surface analysis
(profilometry, SEM, SIMS), EDX analysis, adhesion strength test, laser
die leveling test, contact angle.
. Trained and certified manufacturing personnel in micromachining and
nanofabrication.
Continental Automotive System, Northbrook, IL
2006 - 2009
Motorola, Inc, Northbrook, IL
1997 - 2006
Continental is one of the world's top automotive suppliers. Northbrook
facility (Sensor Element Manufacturing) supports the business
by providing elements for the pressure sensor products. This facility was
a former division of Motorola, Inc until its spin-off in 2006.
Senior MEMS Process and Manufacturing Engineer
. Designed, developed and maintained micromachining (MEMS) equipment, tools
(etch fixtures) and etch processes for ECE (electro-chemical etch stop)
and HF strip.
Yudong Ming
. Improved and sustained micromachining process, quality and yield.
o Improved discrete product yield to over 99% from 70%.
o Saved $1.2 million annually with new front protect process for IC
product.
o Reduced low span fallouts to 4000 PPM from 20000 PPM on IC product.
. Documented and updated procedures for operation, inspection and
maintenance of micromachining process.
. Launched production on several new products and worked closely with new
suppliers to qualify existing products.
o Ensured documentation complete, staff trained and materials,
processes and quality assurance measurements communicated and
followed throughout launch of new production.
. Processes involved: wafer clean, coat, align, develop, RIE, plasma
photoresist strip, wet chemical etch, HF strip, fixture assembly, thin
film measurement, wafer and diaphragm thickness measurement (FTIR),
defect inspection and failure analysis.
. Worked with suppliers and customers to address product quality.
o Reduced fallout of PECVD silicon oxynitride to 2% from 40%.
o Improved nonlinearity to 0.5% from 2-8% for discrete DPF Ford
product.
. Implemented cost reductions; improved quality and yields by 30%, reduced
cycle time by 10% and decreased chemical usage by 60%.
. Set up models for machine capacity and labor calculation; provide
information to management for budget forecast of capital and labor.
. Trained and certified operators in completion of job duties.
University of Illinois at Chicago, Chicago, IL
1994 - 1996
Chartered in 1867, the Chicago campus opened in 1965. The Nanotechnology
Core Facility (NCF was
called MAL, Microfabrication Applications Laboratory) is a versatile
MEMS/Nano facility.
Research Assistant (Microfabrication Applications Laboratory, Electrical
Engineering Department)
. Researched growth and morphology of ultrathin metal film immunosensor for
detection of toxins in food using Atomic Force Microscope (AFM) imaging.
o Defined platinum and gold deposition conditions. Documented
stability of morphology of films evaluated by electrical resistance
changes on films.
o Processes involved wafer clean, dry and wet oxidation, diffusion,
photolithography (coat, develop, align, photo resist strip), metal
wet etch, metal lift-off, metal deposition (e-beam evaporation,
sputtering), annealing, AutoCAD (mask design) and AFM.
. Other projects involved: Design project for CMOS devices (Cadence used),
Pressure sensor (bulk micromachining including wafer bonding), Comb drive
and microstage (surface micromachining) and Mucus sensor.
. Coursework: Introduction to VLSI design, Integrated circuit engineering,
Semiconductor physics and Microelectronic fabrication devices.
The University of Central Oklahoma, Edmond, OK
1992 - 1993
Founded in 1890, the oldest institution of higher learning in Oklahoma. UCO
is a thriving, metropolitan university with a current enrollment of
approximately 16,000 students.
Research Assistant (Physics Department)
. Investigated light scattering by spherical particles for the purpose of
understanding how a laser beam refracts when hitting rounded tissue.
o Research included calculation of angular distribution functions of
light scattered by spherical particles as a model for light
propagation in tissue using mathematical and physical methods.
Yudong Ming
The results used to calculate attenuation in the light intensity
due to scattering of light in any direction.
Shanghai Radio Factory, Shanghai, China
1988 - 1991
A wafer fabrication manufacturer producing low to medium power bipolar
transistors.
Assistant Wafer Fabrication Engineer
. Completed assignments in sustaining wafer fabrication processes (wafer
clean, oxidation, diffusion, and photolithography) which affected yield
and product quality.
o Tested common-emitter current gain and breakdown voltage after
processing and ensured product specifications met and
maintained.
PROFESSIONAL DEVELOPMENT
8D Problem Solving (Root cause investigation)
Process: MEMS, Nanotechnology and Semiconductor
Quality System: Process Flow, Control Plan, FMEA, CARs, TS16949, ISO9001
Statistics: Basic Statistics (ANOVA, regression and so on), Six Sigma,
Process Capability (Cpk, Ppk), Statistical Process Control (SPC),
Measurement System Analysis (GR&R and Gage BLS), Design of Experiments
(DOE)
Statistical Software Tools: Minitab and JMP
Others: MS Word, Excel, PPT, ImageJ, Cadence, Silvaco, Cycle Time, Machine
Capacity, Labor Calculation
EDUCATION
Master of Science in Electrical Engineering from the University of Illinois
at Chicago
Master of Science in Applied and Industrial Physics from the University of
Central Oklahoma
Bachelor of Science in Semiconductor Physics and Device, Shanghai
University of Science and Technology
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