Engineer Quality Assurance

ADAM WILLIAMS

*********@*******.*** 978-***-**** Lowell, MA

www.linkedin.com/in/adamwilliams3/

Senior Process & Quality Engineer with technical & teambuilding skills

to provide efficient solutions & effective direction in high technology

markets

Team Leadership (Yield, New Products Global Supplier Issues

Metrics) (NPD) (MRB)

Quality Systems Reliability Customer Satisfaction

(ISO 9001, Audits, ECOs) (JEDEC) (RMA, 8D, Reports)

Process Control (SPC, DOE, Six Failure Analysis Corrective Actions (RCCA)

Sigma) (FA)

COMPUTER SKILLS

Proficient with MS Word, MS Excel, MS Visio, PROMIS, SAP, WIPTrack and

Minitab

CERTIFICATION

Lean Six Sigma YB, March, 2013

PROFESSIONAL EXPERIENCE

CHIEF QUALITY ENGINEER 2002 to 2012

THAT Corporation, Milford, MA

Design, Wafer Fab, Package and Test of high-quality ICs for professional

audiophiles

. Quality focus for all company-critical engineering efforts (supplier,

internal and customer)

. Technical, Engineering support in all areas of the company to improve

process efficiency

. both long term, continuous improvement and daily, decision making

. Worked effectively with everyone in the company, from president to

process specialists

. Reported to president, developed strategies and managed projects

. Achieved employee engagement by providing assistance, aligning

priorities and encouraging small wins every day by everyone

. Established Company-wide, comprehensive Quality Systems, saving ~$200K

annually

. Created Documentation, ISO 9001-like, with engineering change

orders (ECO), audits

. created 600+ procedures, 600 drawings, 100 forms, 96 flowcharts,

2500+ ECOs

. Customer relationships: audits, returns and product change

notifications (PCNs)

. Resolved Supplier issues: audits, selection and discrepant material

(MRB)

. New product development (design, processing, documentation and

qualification)

. Control of experiments, developmental lots, configuration + special

processing

. Corrective action assignment, tracking, implementation and review

(RCCA)

. Created a Quality Team for Customer Returns (RMAs using 8D

methodology)

. Rapid response, verification, containment, line stops/starts and

material disposition

. Root cause determination, corrective actions and Failure Analysis

Reports (FARs)

. Performed hands-on reliability testing per JEDEC and IPC standards

. Over 1300 Reliability Qualifications

. Process changes, new product development and new IC packages

. Developed and Qualified Pb-free IC packages per RoHS and REACH

ADAM WILLIAMS, page 2

*********@*******.*** 978-***-**** Lowell, MA

www.linkedin.com/in/adamwilliams3/

SENIOR QUALITY ASSURANCE ENGINEER 1995 to 2002

M/A-COM, Integrated Circuits Business Unit, Lowell, MA

Fabricated GaAs (MMIC) and Glass-on-Si (GMIC) semiconductors for the

wireless industry

1. Developed/ distributed KPI Report with company metrics, Yields and

Customer Returns Rate

2. Achieved ISO 9001 registration for GMIC process

3. Launched a scrap reduction program, 50% reduction in 6 months, saving

>>$200K annually

4. Created and managed the Technology Review Board (TRB)

5. Streamlined change notice system, reduced ECO cycle time by >>100%

6. Dispositioned 2000+ non-conforming wafers in Material Review Board (MRB)

7. Resolved Customer Returns, reduced defective ppm ~50% annually

PROCESS ENGINEER II 1988 to 1995

M/A-COM, Semiconductor Business Unit, Burlington, MA

Fabricated GaAs (MMIC), Si and Glass-on-Si (GMIC) semiconductors

8. Installed, characterized, modified and maintained production GaAs

Epitaxial equipment

9. Supervised technicians in the production of GaAs MOCVD epitaxial layers

10. Encouraged use of DOE and Six Sigma techniques though presentations of

papers:

. "A Designed Experiment To Optimize GaAs Epitaxial Growth"

. "Implementation of Design for Manufacture in GaAs Semiconductor

Fabrication"

11. Formed a Wafer Fab Quality Council and initiated a successful Scrap

Reduction program (50% reduction of wafer scrap in 12 months)

12. In-depth knowledge of semiconductor processes (and equipment): GaAs

epitaxy (Spire), silicon epitaxy (Gemini), ion implantation (Varian),

diffusion (Bruce), plasma etch (Drytek, LAM, Plasmatherm), metal

evaporation (Airco, CHA), metal sputtering (MRC) and photolithography

(Cannon and Ultratech)

COLLEGE EDUCATION

B. S. METALLURGICAL ENGINEERING

University of Pittsburgh, PA

o Teaching Assistant in Metallography and Materials Characterization Labs

o Thesis: "Improving the Yield of GaAs Liquid Encapsulated Czochralski

(LEC) Crystals"

SIGNATURE STRENGTHS

Integrity, creativity, social intelligence, perseverance, perspective and

humor

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