Engineer Process

DER-JIN WOAN,

** ********* *****, ********, ** **760

Email: **********@*****.*** Tel: 607-***-****

Skills Profile

• 10+ years as PCB/PWB/LCC lamination process engineer, with experience in cleanroom, hydraulic presses, materials supplier quality, yield improvement, product failure analysis, and process-material-product performance analysis.

• DOE (Design of Experiment), SPC, lean/6-sigma green belt, 5S, Kaizen.

• 2 years new products and process development. As a member in a new organic chip carrier product implementation team responsible for the initial equipment setup and qualification for various equipment, processes and materials qualification

• 8 years as Analytical Materials Scientist with hands-on experience in analytical materials characterization, thermal analysis (DSC, TGA, TMA) FTIR, Mechanical Testing, Rheology, Taber Abrasion and SEM.

• 4 years as Plastic Engineer with in-depth understanding of structure-property relations of materials. Engineering Plastic Materials selection, application and failure analysis. orking knowledge on polymer processing, injection molding and extrusion.

• Proficient in Microsoft Word, Excel, Access, Power point, SAP, Minitab, Photoshop, Agilent workbench. Working knowledge with HTML, Dreamweaver, and AutoCAD.

Education

Ph.D. May 1984. Rutgers University, Piscataway, NJ

Mechanics and Materials Science- Specialize in Polymer Science.

Master, Aug., 1980 Rutgers University, Piscataway, NJ

Mechanics and Materials Science

B.S. Jun., 1976 National Cheng-Kung University, Taiwan

Engineering Science -Major: Fluid mechanics and heat Transfer. Minor: Computer Science.

Experience

Nov. 2002- Jan. 2013 Lamination Process Engineer, Endicott Interconnect Technologies, Inc. Endicott, NY. Responsible for:

• The operation, calibration, optimization, troubleshoot, operator training and safety of hydraulic presses, cleanroom, edge trim and stamp ID processes.

• Product yield improvement (consumer, medical and defense industries), cost reduction, layup diagrams and lamination recipes.

• Raw materials (PTFE, RCC, Prepreg, CIC and copper foils) quality and tests (DSC, TMA, Rheology, adhesion, hardness and tensile).

• Achievements:

1. Eliminated the use of Invar release sheets resulted in 500k annually saving.

2. Developed test plans (adhesion, tensile, rheology and thermal (DSC & TMA) on critical raw materials to minimize product yield loss and reliability issues.

3. US Patent 7059049, Electronic package with optimized lamination process.

4. Developed, jointly with suppler, optimum processes for PTFE green sheets and surface treatment for copper foils to improve the adhesion between the two materials through DOE and results in better product yield and reliability.

5. Setup companywide FOD/FOE program to comply with medical and defense industries requirements when company first expanded into these industries.

6. Visited and worked with a single-sourced supplier in Japan to overcome production issues and avoided the potential disruption of production.

Nov. 1998 - Oct. 2002, Advisory Engineer, IBM, Endicott, NY

A member of a new product (HyperBGA®) production implementation team responsible for the startup of the following processes

• Vacuum lamination of dry film solder mask and vacuum bake operations.

• Chemical Micro-etch and electrochemical polish of laser drilled PTH’s.

• End of line Electrical (IP Opens and shorts) tests.

• High temperature lamination of PTFE and RCC (Resin coated copper.

• Raw material quality control and testing (DSC, TMA, Rheology and Mechanical).

Dec.1996 – Nov. 1998, Advisory Engineer, IBM, Endicott, NY

• Engineering support to processes and materials for solder mask coating, white ID and HASL (Hot Air Solder Leveling) processes for PCB manufacturing. Establish Clean Room Operation specification.

• Install and qualify a new chemical assisted aqueous wash tool for yield improvement.

• ISO14001 and Chemical Waste Management committee.

Oct. 1988- Dec. 1996, Senior Material Scientist, IBM, Endicott, NY

Responsible for material characterization, failure analysis and OEM analytical services and in charge for the following analytical instruments:

• Thermal analysis (DSC, TGA, TMA, DMTA), FT-IR and IR microscope.

• Mechanical testing: Instron (static), MTS (dynamic) and Impact Testers.

• Melt Indexer, Tabor abrasion tester and UL Flammability Test.

• Manufacture support on Fracture/Failure Analysis and material characterization.

Jul 1984 – Oct. 1988, Plastic Engineer, IBM, Endicott, NY

Responsible for design verification, material selection, mold approval and failure analysis on injection molded plastic components in high speed printers and:

• Setup polymer material specifications.

• Setup Person Computer and train department member.

• Development of MOCA Free Polyurethane, jointly with University of Detroit.

• EMI shielding testing on plastic components.

Sep 1979 – May 1984, Research Assistant, Rutgers University. Research Projects include:

• Pressure effect on dielectric and dynamic mechanical relaxation in polymer blends.

• DSC and Wide Angle X-ray Study of Crystallinity in Polymer Blends.

• Mechanical Property and SEM Fractographic Study of Polymer Blends.

• Fatigue Characteristic of High Impact Polystyrene.

• Computer Modeling of Compress Behavior of Cheese.

Citizenship: US Citizen

Contact this candidate