Manager Design
Resume:
Resume: Frank Rossi
Burlington, Vermont 05408
Phone 802-***-****
email ******@*****************.***
WORK HISTORY
IBM Burlington Vt o ASIC Noise Analysis Eng 1/11 to 06/12
IBM Burlington Vt o Application Eng SerDes 2/05 to 12/08
IBM Burlington Vt o Retired from IBM 10/00 to 6/03
IBM Burlington VT o DIMM Design/Applications 4/98 to 9/00
IBM Burlington VT o Graphics Card Design 8/97 to 4/98
IBM Burlington VT o Dram/Vram Applications 5/90 to 8/97
IBM Burlington VT o Manager VLSI Card Design 4/86 to 5/90
IBM Burlington VT o Program Office Manager 12/84 to 4/86
Int'l Assignment Germany o Memory Chip Development 10/82 to 12/84
IBM Burlington VT o Managed 288K DRAM Device 10/78 to 10/82
Int'l Assignment Germany o Memory Card Development 10/76 to 10/78
IBM Burlington VT o VLSI Memory Design 6/71 to 10/76
IBM Poughkeepsie NY o Bi-Polar CFET Design 6/64 to 6/71
RCA Somerville NJ o Bi-polar Design/Test 2/59 to 6/64
Military USA Signal Corp o Electronics Instructor 1/57 to 1/59
TECHNICAL VITALITY: Proven ability to direct VSLI products from design to
manufacture including design, test, analysis and customer quality.
MANAGEMENT
o Manager of High Dense Memory array cards 4/86 to 5/90
o Manager of Product Program Office-Marketing Business 12/84 to 4/86
o Manager of High Density DRAM chip design team 10/87 to 10/82
EDUCATION
o Marist College, Poughkeepsie, NY BS Math June 1970
o DeVry Technical Institute, Chicago, ILL Electronics May 1955
o High School Academic June 1953
EXPERIENCE
o Directed and coordinated world's first 256K DRAM chip into full production
o Memory interface between card/system organizations
o In-depth knowledge of VLSI hardware debug and characterization.
o International technical Leadership roles between VLSI design/mfg.
o VLSI Product applications to KEY customer accounts
o High Speed SerDes 10Gbit ASIC Products/Package Design + HSPICE Analysis
o Expert using IBM Analysis tools to ensure ASIC products meet Customer Desing
Noise Specifications.
CREATIVITY
o Patent - Modular photonic wave guide distribution system
o Patent - Digital Storage
o IBM Division Award - Management/Technical Contribution to VLSI
o Invention Achievement Award
o Patent - High Speed ASIC SerDes Wire Bond Package
PUBLICATIONS
o Advanced Multi Chip Memory Interconnections/Nepcon West Conf Feb 1987
o 512K-bit FET Memory Module/Eurcon 80 Conf in Stuttgart Ger. March 1984
o 288K-bit DRAM - A designers viewpoint/Midcon 82/Dallas Tx April 1982
MARTIAL STATUS
Married/Four Children/Fifteen Grand Children
Date: August 8th, 2012
Resume: Frank Rossi
142 Pleasant Ave
Burlington, Vermont 05408
Phone 802-***-****
email ******@*****************.***
WORK HISTORY
IBM Burlington Vt o ASIC Noise Analysis Eng 1/11 to 06/12
IBM Burlington Vt o Application Eng SerDes 2/05 to 12/08
IBM Burlington Vt o Retired from IBM 10/00 to 6/03
IBM Burlington VT o DIMM Design/Applications 4/98 to 9/00
IBM Burlington VT o Graphics Card Design 8/97 to 4/98
IBM Burlington VT o Dram/Vram Applications 5/90 to 8/97
IBM Burlington VT o Manager VLSI Card Design 4/86 to 5/90
IBM Burlington VT o Program Office Manager 12/84 to 4/86
Int'l Assignment Germany o Memory Chip Development 10/82 to 12/84
IBM Burlington VT o Managed 288K DRAM Device 10/78 to 10/82
Int'l Assignment Germany o Memory Card Development 10/76 to 10/78
IBM Burlington VT o VLSI Memory Design 6/71 to 10/76
IBM Poughkeepsie NY o Bi-Polar CFET Design 6/64 to 6/71
RCA Somerville NJ o Bi-polar Design/Test 2/59 to 6/64
Military USA Signal Corp o Electronics Instructor 1/57 to 1/59
TECHNICAL VITALITY: Proven ability to direct VSLI products from design to
manufacture including design, test, analysis and customer quality.
MANAGEMENT
o Manager of High Dense Memory array cards 4/86 to 5/90
o Manager of Product Program Office-Marketing Business 12/84 to 4/86
o Manager of High Density DRAM chip design team 10/87 to 10/82
EDUCATION
o Marist College, Poughkeepsie, NY BS Math June 1970
o DeVry Technical Institute, Chicago, ILL Electronics May 1955
o High School Academic June 1953
EXPERIENCE
o Directed and coordinated world's first 256K DRAM chip into full production
o Memory interface between card/system organizations
o In-depth knowledge of VLSI hardware debug and characterization.
o International technical Leadership roles between VLSI design/mfg.
o VLSI Product applications to KEY customer accounts
o High Speed SerDes 10Gbit ASIC Products/Package Design + HSPICE Analysis
o Expert using IBM Analysis tools to ensure ASIC products meet Customer Desing
Noise Specifications.
CREATIVITY
o Patent - Modular photonic wave guide distribution system
o Patent - Digital Storage
o IBM Division Award - Management/Technical Contribution to VLSI
o Invention Achievement Award
o Patent - High Speed ASIC SerDes Wire Bond Package
PUBLICATIONS
o Advanced Multi Chip Memory Interconnections/Nepcon West Conf Feb 1987
o 512K-bit FET Memory Module/Eurcon 80 Conf in Stuttgart Ger. March 1984
o 288K-bit DRAM - A designers viewpoint/Midcon 82/Dallas Tx April 1982
MARTIAL STATUS
Married/Four Children/Fifteen Grand Children
Date: August 8th, 2012
Resume: Frank Rossi
142 Pleasant Ave
Burlington, Vermont 05408
Phone 802-***-****
email ******@*****************.***
WORK HISTORY
IBM Burlington Vt o ASIC Noise Analysis Eng 1/11 to 06/12
IBM Burlington Vt o Application Eng SerDes 2/05 to 12/08
IBM Burlington Vt o Retired from IBM 10/00 to 6/03
IBM Burlington VT o DIMM Design/Applications 4/98 to 9/00
IBM Burlington VT o Graphics Card Design 8/97 to 4/98
IBM Burlington VT o Dram/Vram Applications 5/90 to 8/97
IBM Burlington VT o Manager VLSI Card Design 4/86 to 5/90
IBM Burlington VT o Program Office Manager 12/84 to 4/86
Int'l Assignment Germany o Memory Chip Development 10/82 to 12/84
IBM Burlington VT o Managed 288K DRAM Device 10/78 to 10/82
Int'l Assignment Germany o Memory Card Development 10/76 to 10/78
IBM Burlington VT o VLSI Memory Design 6/71 to 10/76
IBM Poughkeepsie NY o Bi-Polar CFET Design 6/64 to 6/71
RCA Somerville NJ o Bi-polar Design/Test 2/59 to 6/64
Military USA Signal Corp o Electronics Instructor 1/57 to 1/59
TECHNICAL VITALITY: Proven ability to direct VSLI products from design to
manufacture including design, test, analysis and customer quality.
MANAGEMENT
o Manager of High Dense Memory array cards 4/86 to 5/90
o Manager of Product Program Office-Marketing Business 12/84 to 4/86
o Manager of High Density DRAM chip design team 10/87 to 10/82
EDUCATION
o Marist College, Poughkeepsie, NY BS Math June 1970
o DeVry Technical Institute, Chicago, ILL Electronics May 1955
o High School Academic June 1953
EXPERIENCE
o Directed and coordinated world's first 256K DRAM chip into full production
o Memory interface between card/system organizations
o In-depth knowledge of VLSI hardware debug and characterization.
o International technical Leadership roles between VLSI design/mfg.
o VLSI Product applications to KEY customer accounts
o High Speed SerDes 10Gbit ASIC Products/Package Design + HSPICE Analysis
o Expert using IBM Analysis tools to ensure ASIC products meet Customer Desing
Noise Specifications.
CREATIVITY
o Patent - Modular photonic wave guide distribution system
o Patent - Digital Storage
o IBM Division Award - Management/Technical Contribution to VLSI
o Invention Achievement Award
o Patent - High Speed ASIC SerDes Wire Bond Package
PUBLICATIONS
o Advanced Multi Chip Memory Interconnections/Nepcon West Conf Feb 1987
o 512K-bit FET Memory Module/Eurcon 80 Conf in Stuttgart Ger. March 1984
o 288K-bit DRAM - A designers viewpoint/Midcon 82/Dallas Tx April 1982
MARTIAL STATUS
Married/Four Children/Fifteen Grand Children
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