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Engineer Quality

Location:
Richardson, Texas, 75082, United States
Posted:
May 25, 2010

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**** ******** ****** *****

Ct. 469-***-****

Richardson, TX Home Phone

***** 972-***-****

E-mail

*********@**.**.c

om

******* ******

Summary of [ Oct 2004 - Feb 2009 ] Packaging Development

qualificatio Texas Instruments - External Development and Manufacturing - IC

ns Packaging Development Engineer.

and work Worked with contract manufacturing companies for the design,

experience development, qualification and production of wafer chip scale

packages and flipchip devices. Continuously work with off shore

contract manufacturing companies such as ASE, AMKOR, STATS in

establishing production processes to pass qualification

requirements on various devices requiring fast production ramps.

This involves resolving various issues on qualification failures,

production line quality and manufacturing process issues, and

defining course of corrective actions in determining root-cause(s)

of problems and implementing short term solutions as well as long

term permanent corrective actions. This includes application of

DOE, FMEA and monitoring the progress of corrective actions to its

completion as defined within 8D (Corrective Action Reports)

submitted by the subcon quality organization.

Also carry out periodic on-site process assessment and quality

audits to ensure subcontract companies are in compliance to TI

quality and ISO9001, TS16949 standards, expectations and

requirements.

Evaluate and recommend subcontract requested process changes to

various internal business groups and liaise qualification and

implementation of such changes.

[ June 2003 - Sept 2004 ] East Building Test QRA

Texas Instruments - Dallas Test (EBT) Outgoing Quality and AVI

Engineer

Experienced in Electrical Probe Quality, Reliability and Assurance

(QRA) providing Automated Visual Inspection (AVI) support for

outgoing inspection activities. Worked on automotive device

inspection improvements in implementing screening programs to

ensure 100% compliance to probe marks within the bond-pad area.

Also responsible for evaluating a new auto inspection machine

(Camtek Falcon). Worked for a zero value Purchase Order in order

to evaluate the equipment thoroughly and eventually recommending

it to be the equipment of choice over August AVI.

Work with off-shore A/T's as liaison between EBT-QRA group and

world wide Assembly/Test sites resolving various IC packaging

quality issues. Chairing weekly teleconferences with overseas

Assembly/Test Sites such as Philippines, Taiwan and Japan to

resolve IC packaging related quality issues between asian assembly

sites and Dallas wafer Fabs.

[ April 2002 - June 2003 ]

Dallas Bump

Texas Instruments - Dallas BUMP Product Engineer

1 year experience on new product introduction at Dallas bump

facility (DBUMP). Responsible for the timely qualification and

production of new products ranging from DSP's, Sun

microprocessors, ASIC's, and BOAC (Bond Over Active Circuits).

Responsible for the successful qualification of the first BOAC

devices at Dallas Bump facility.

[ March 1995 - April 2002 ]

Dallas Flipchip Assembly

Texas Instruments - Dallas FlipChip Assembly Operations

7 years of operations management of flipchip and BGA assembly,

development and production. Managed a team of 40 operators and

technicians and 3 engineers. I was responsible for the process

design and successful production start-up of the ceramic flipchip

assembly line in TI Dallas (DFCA). Developed the initial process

and production line and subsequently matured the initial

production line from a single shift operations to a full 7x24

production facility supporting Sun Microprocessors, DSP and ASIC

products. Responsibilities includes package/process engineering,

production/capacity planning, overhead cost management,

yield/productivity improvements, management reports/presentations.

[ Feb 1991 - Mar 1995 ]

Texas Instruments, Philippines Inc.

TI Philippines Process & Equipment Engineer

Strong knowledge base in assembly and test operations . Process

engineering manager for PDIP and PLCC products providing yield

enhancement programs, process controls and improvements, new

product introduction and qualifications, daily production support,

lead quality improvement teams, automotive product liaison between

TI Philippines and Japan/US counterparts, representing TI

Philippines on world wide quality improvement teams and

interfacing with different Assembly/Test sites such as Taiwan,

Malaysia, Singapore, Japan, Sherman.

EDUCATION:

[ 1971-1976 ] University of East Manila, Philippines

Bachelor of Science in Electronics

PATENTS:

Power Die Flip Chip BGA. Feb 2008

Patent No. 7005752 - Direct Bumping on Integrated Circuit Contacts

Enabled by Metal-to-Insulator Adhesion. Dec 2005

Patent No. 6657311 - Heat Dissipating Flip-Chip Ball Grid Array.

Dec 2003

Patent No. 5960262 - Stitch-bond Enhancement for hard to bond

materials, Sept 1998

TRAININGS:

DATE Training Title

4/2/2008 Second-Sourcing: Legal Risks, Ethical Standards and Maintaining

TI's Competitive

11/12/2007 Orange Belt - Managing a Single Project with Microsoft Office

Project 2003

8/21/2007 Leadership Foundations

7/19/2007 The 4 Disciplines of Execution

2/14/2007 Technology Transfer - Compliance to Export Control Laws

4/13/2006 Working Globally: Skills for Working Across Borders

4/6/2006 Windows SharePoint Svcs 2003: Building Collaborative Solutions

w/Team Web Site

10/6/2005 Getting Things Done Across Organizational Boundaries

10/3/2005 Corrective Action/Preventive Action Overview

10/3/2005 QC Tools Overview

8/1/2005 Flip Chip, WLCSP, & Microvia Technologies

6/8/2005 Advanced Project Management

4/5/2005 Win-Win Negotiations

3/3/2005 Getting Things Done Across Organizational Boundaries

7/12/2004 ISO/TS16949:2002 - Overview Training

2/6/2004 TS16949 Awareness Training

9/12/2003 Preventing Workplace Violence and Employment Law Fundamentals

8/6/2003 Measurement Systems Analysis (MSA)

8/5/2003 FMEA-Failure Mode & Effects Analysis

8/4/2003 Advanced Product Quality Planning Overview (APQP)

10/8/2001 Project Management Symposium 2001

9/12/2001 AUDITING TECHNIQUES

7/19/2001 ISO9000 MID-MANAGEMENT

8/27/1998 COST OF OWNERSHIP

3/25/1998 SURFACE CONTAMINATION AND CLEANING

3/23/1998 ADHESION SCIENCE AND TECHNOLOGY

1/23/1998 Market Planning - SCTD

8/15/1997 MARKETING: PRODUCT MANAGEMENT

7/18/1997 MARKETING STRATEGY: MARKET SELECTION

6/13/1997 MARKETING: UNIQUE VALUE PROPOSITION

5/16/1997 MARKETING: DIAGNOSING VALUE CAPABILITIES

4/18/1997 MARKETING: COMPETITOR ANALYSIS

3/21/1997 MARKETING: UNDSTDNG CUSTOMER DECISION

9/22/1996 UNDERSTANDING & APPLYING ISO 9000

8/28/1996 INFLUENCE AND LEADERSHIP

8/22/1996 LEADING THROUGH CHANGE

8/21/1996 CREATIVE LEADERSHIP

8/20/1996 ENGINEERING MANAGEMENT TODAY (PART II)

11/15/1995 Theory of Constraints I (JONAH) - SCTD

11/14/1995 CONTINUOUS FLOW MFG (CFM): TOOLS/TECHNIQ

11/14/1995 INV MGMT TECHNIQUES/TOOLS CLUSTERING

11/13/1995 OPERATIONS FUNDAMENTALS (JONAH TRAINING)

11/6/1995 Principles of Cycle Time Reduction - SCTD

10/5/1995 Valuing/Managing Diversity in the Workplace - SCTD

9/27/1995 BREAKTHROUGH RESULTS WITH BENCHMARKING

References:

Bing Viera

President, Texas Instruments Philippines Inc.

Office: 63-2-845-0927

George Apigo

Director, Worldwide Procurement and Logistics

Texas Instruments

Office: (972) ***-****

Mobile: (214) ***-****

Ezra Pekas

Manager, Worldwide Business Planning

Texas Instruments

Office: (214) ***-****

Mobile: (972) ***-****



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