Engineer Project

**** *. *** ***., ****, AZ *****

Phone 480-***-**** . E-mail ************@*****.***

Ruben Fernandez

Summary of Qualifications

Product Development - ~ 8.0 Design for Manufacturability and

years Reliability

Knowledge with the Understanding of Product

build/processes associated Financial Analysis

with building a pacing/defib

type device - ~ 8.0 years

Hybrid/Device/IC test Project Schedule Training &

releases - 8 years Experience

Yield/Process improvement, Strong Communication Skills

bench analysis - 16 years

Medtronic returned product Performing Medtronic Hybrid, IC,

process experience and Device Product Engineering

responsibilities - 8.0 years

Education

Bachelor of Science, Electrical Engineering, Arizona State

University, 1996

U.S. Air Force Academy, Colorado Springs, Colorado June 1988 -

Aug 1989

Professional Experience

TGCM Technician, Air Liquide, Chandler, AZ (Fab22 Intel

Ocotillo Location)

Aug 2010 to Dec 2010

Maintain and install gas and chemical equipment during the

upgrade of Fab22 at the Intel Ocotillo site in Chandler AZ.

Coordinate equipment availability to meet project and customer

demands.

Support contractors during equipment installations as per Intel

SOP.

Product Engineer, Medtronic Microelectronics Center, Tempe, AZ

Sep 2002 to July 2010

Performing Product Engineering responsibilities for multiple

Medtronic hybrid development activities including Test release

and new hybrid releases (including all associated IC and

components).

Hybrid/IC Product Engineering responsibilities for multiple

Medtronic development projects.

Established multiple product hybrid failure analysis

dispositions for test failures and transferred to released

product engineering.

Perform root cause analysis down to component level for all

development build test failures through development cycle to

production release (IC, hybrid and final device).

Communicate between MMC and multiple sites for product releases

and also drive for yield improvements and corrective actions at

all IC, Hybrid and device levels..

Performed Product engineering responsibilities for numerous

hybrid, IC (microprocessor, SRAM, EEPROM, and Flash), and final

device test releases.

Drove Fully Allocated Product Cost (FAPC) development

opportunities along with Continuous Improvement and lean

opportunities across all levels of the project.

Performing multiple hybrid development activities with

corporate offices in Rice Creek.

Coordinating and managing multiple projects, hybrid, IC and

device development builds.

Functional Analysis Test Engineer, Motorola Computer Group,

2900 S. Diablo Way, Tempe, AZ Nov 1996 to Nov 2001

Develop and maintain Final Assembly functional test equipment

for a number of computer architectures including and not

limited to the following: VME, PCI, Intel, CompactPCI, & RF

architectures.

Troubleshoot failures down to component level and drive

recommendations for Test yield improvements, corrective and

preventative actions.

Train new Analysis technicians on troubleshooting skills for

established product.

Design Engineering Assistant, Adflex Solutions, 2001 W.

Chandler Blvd, Chandler, AZ Mar 1992 to

Oct 1996

Coordinate and establish the release of Flex circuit product in

the Production environment ranging from prototype to final

product at both the Chandler plant and the final assembly plant

in Aqua Prieta, Mexico.

Establish production yield improvements/cost reductions to meet

customer demands.

Develop circuit designs and processes to meet customer

requirements/schedules.

CoMputer Skills

Extensive knowledge of general office software tools, MAC OS &

Windows

Programming languages: BASIC, C++, LabView

Project management tools: MS Project

AutoCad, MiniTab, SpotFire, Designsync, Zuken

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