Engineer Project Manager
Resume:
Kenneth "Craig" Broberg
**** ******* *****, *******, ** 94536
********@*******.***
SUMMARY for Equipment Engineer:
. 25 years of experience working as an equipment / factory support
engineer in the semiconductor industry
. 17 years of experience supporting / troubleshooting thin film and etch
equipment, Lam 9400/9600PTX, Alliance and 2300's, Applied Materials
Endura, Centura, Mattson Suprema, Paradigm pE and XP, Varian PVD 3000
series and MRC Eclipse. This included increased wafer throughput,
particle reduction, uniformity improvements as well as reducing cost
of ownership.
. Complete understanding of new product introduction requirements,
serviceability requirements and the ability to drive process /
hardware improvements.
. 20+ years of experience as a team lead / project manager,
1. Senior Support Manager at Qualcomm responsible for all equipment
within the Thin Films/Etch areas 4 direct reports responsible for
Applied Material Endura's, Centura, Lam etchers and all support
metrology tools.
2. Hardware design engineer, R&D at HP Labs responsible for R&D effort to
develop next generation processing tools within the PVD, CVD and Etch
areas, Centura, Endura, P5000 including all support equipment.
3. Account engineer at Varian TFTD responsible for field engineering
requests, escalations, installations and field upgrades (Responsible
for entire Varian Product Line).
4. 3 years of experience at LAM managing the Lam factory escalation team
and call center. Call center was a 24 x 7 facility with 24 engineers
supporting the global semiconductor industry.
. 3 years of experience at Varian/Torrex as the manufacturing engineer,
evaluated and selected materials, designed, modified and enhanced CVD
equipment for reliability and manufacturability.
. 6 years of experience at Lam with the development, characterization
and qualification of new hardware/materials to improve productivity
for customers worldwide.
. Expertise with a wide variety of LAM equipment including 9400, 9600,
Alliance, 2300'sand CMP.
. Exceptional problem solving and root cause analysis skills for
sustaining, installing, isolating and identifying electro-mechanical
hardware or process failures for PVD, CVD and Etch semiconductor
equipment.
. Excellent hands on capabilities with an outstanding mechanical and
electrical aptitude.
. Exceptional hardware troubleshooting, calibrating, designing,
creating, integrating, enhancing, prototyping, setup, testing, and
repairing of complex semiconductor mechanical and electromechanical
equipment.
. Extensive knowledge and ability to operate sophisticated test
measurement equipment, hand tools, power, and complex machine tools
used in fabricating, assembling, testing and measuring of
electro/mechanical components or systems.
. Proficient with MS Office Applications as well SAP.
Objective: Equipment Engineer with growth potential where my experience,
specialized training and organizational skills will be fully challenged.
Major Strengths: I have proven ability to develop cohesiveness across
multiple departments in resolving technical problems. I work well in team
environments, from member to project leader. I have the ability to
effectively train personnel with troubleshooting, assembly and test
methodology.
I design and implement new semiconductor hardware-concepts with a track
record of producing successful designs with all required mechanical
drawings, SOP's (operation/calibration), electrical schematics, Bill of
materials, assembly integration, and troubleshooting manuals.
I perform very well under pressure exercising independent judgment in
methods techniques and evaluation criteria for obtaining results resolving
difficult challenges in a quick, decisive manner that meets company
expectations.
I have exceptional problem solving and root cause analysis skills for
sustaining, installing, isolating and identifying electro-mechanical
hardware or process failures for PVD, CVD and Etch semiconductor equipment.
Excellent hands on capabilities with an outstanding mechanical and
electrical aptitude. Exceptional hardware troubleshooting, calibrating,
designing, creating, integrating, enhancing, prototyping, setup, testing,
and repairing of complex semiconductor mechanical and electromechanical
equipment. Complete understanding of new product introduction requirements
and the ability to drive process improvements.
I have an in-depth background of analytical metrology equipment, RGA, SEM,
Surface Profilometer, Alpha-Step, Four Point Probe and Leak Detection to
name a few. Extensive knowledge and ability to operate sophisticated test
measurement equipment, hand tools, power, and complex machine tools used in
fabricating, assembling, testing and measuring of electro/mechanical
components or systems.
Excellent communication skills including power point presentations. A do
what it takes attitude to complete any task.
Experience:
Mattson Technologies (2011-Current, 1 year)
Technical Support Engineer/Trainer, Staff: Trainer, both customers and
field engineers in maintenance, troubleshooting and repair of all Mattson
product lines. Duties also included responsibility for global escalated
down tools, first in region installs and quality improvement. I
characterized proto type products in-house as well as customer sites.
Recommended, designed, created and released new hardware or procedures to
improve performance for etch customer install base production tools. I
interacted with Manufacturing, Engineering, Software, Marketing, Product
Support, Field Service and the global customer install base from concept
and review to product release.
Qualcomm MEMS Technologies 2010-2011
Senior Support Engineer/ Manager: 4 Direct reports, responsible for all
Thin-Films/Etch proto-type production equipment performance, upgrades and
repairs. Administrative duties included; training, organizational
development for assigned technicians and scheduling and planning to support
3 shift operations. Responsible for determining and maintaining department
budget, spare parts, equipment upgrades, repairs and service support
contracts. Presented internal customer equipment status reports for any
planned shutdown or down tool recovery. Engineering support for any down
production tool within thin-films/dry etch.
Lam Research, 11 Years 1994-1996 and 1999-2009
Etch Product Support SPOC: Factory Focal Point responsible for customer
escalations or quality issues worldwide. I was responsible for worldwide on-
site support, hands-on, for unresolved escalated tool/hardware failures.
This included process related failures. Responsible for root-cause analysis
and corrective actions related to both customer and OEM suppliers for any
reported failure due to improper usage, defective material or incorrect
manufacturing procedures. Responsible for generating, executing, and
supporting daily recovery plans to recover down production equipment.
Equipment included 9400/9600PTX, Alliance and 2300 etch tools.
Product Engineer, Staff: Service Engineering: Responsible for global
escalated down tools, first in region installs and quality improvement.
Recommended, designed, created and released new hardware or procedures to
improve performance for etch customer install base production tools. I was
responsible for serviceability assessments for new product hardware,
interacted with Manufacturing, Engineering, Software, Marketing, Product
Support, Field Service and the global customer install base from concept
and review to product release. I was responsible for writing/generating all
document specifications, mechanical drawings, electrical schematics, BOM's,
customer beta agreements or beta reports at completion. Expectations and
results presented to both internal and external customers. I was a member
of ECR and EPL Review board responsible for ECN's, ECR's, BKM's, Safety
Notices, and customer requested retrofits.
Escalation Manager, Technical Support Center: I successfully managed the
24X7 technical support call center, 24 engineers and 2 managers, for
worldwide escalations, documentation requests, troubleshooting, installing,
and repairing complex semiconductor process equipment. Responsible for
tracking performance metrics, call types, volume, response time and time to
closure. Other administrative duties included training, organizational
development and scheduling on-sight support. I established a central data
base containing undocumented procedures, part number search, BOM's for
undocumented engineering proto types, best field known methods, OEM
manuals, calibration procedures and specifications.
Technical Support Engineer: Metal Escalation Team Regional Product Support
North America, Europe and Taiwan supporting field service and the customer
install base. I was the factory support for any down tool exceeding
escalation time limit policy. I was responsible for troubleshooting,
installing, and repairing of all equipment offered by Lam. I planned and
scheduled customer partnership meetings, driving corrective actions or
design issues with internal factory engineering support. Managed weekly
regional conference calls communicating account information with field
management, identified priorities; managing beta sites, critical
installations, multiple escalations and field projects.
Hewlett Packard ULSI LABS, 3 Years 1994-1995 and 1997-1999
R&D Hardware Design Engineer: Thin Films, CVD Responsible for all Thin
Film/CVD R&D production equipment purchases, modifications, and upgrades
for HP's production tool requirements. I was responsible for enhancing the
availability, reliability and processing parameters maintaining a leading
edge for microchip fabrication at the lowest cost of ownership. Duties
included writing acceptance, testing and qualification criteria for all
equipment or upgrades. I collaborated closely with maintenance and process
engineering in executing installations as well as research experiments.
Wrote all preventative maintenance schedules-procedures based on production
usage. I provided counsel/support to equipment technician's on equipment
procedures, operations, troubleshooting and repair. Equipment sets included
Applied Materials Endura, Centura, P5000's, Novellus Concept II and all
support metrology.
Xicor, 6 Years 1988-1994
Equipment Engineer: Thin Films, CVD Responsible for equipment uptime within
the Thin Films / CVD area. This included troubleshooting down equipment,
tool modifications and installations. Managed the spare parts inventory for
each tool set as well as provided training and technical assistance to Fab
technicians. I collaborated with Process Engineering qualifying tools and
processes on all equipment tool sets. Wrote all preventative maintenance
schedules-procedures based on production usage. Equipment sets included
Applied Materials P5000's, MRC Eclipse, Varian 3280's and all support
metrology.
Varian Associates, 8 Years 1980-1988
Manufacturing Engineer: CVD - Etch; Ensured new equipment met all
functional specifications. I designed, modified or enhanced all CVD
equipment to improve productivity for customers worldwide. Identified and
corrected all manufacturing failures, hardware, software and control
systems. I was responsible for all field upgrades and training at remote
customer sites. I trained manufacturing personnel with assembly and test
requirements for tool acceptance. Tools sets included the 5101 and 5150 CVD
processing tools.
Factory Field Representative; Thin Films, (Sputter, Evap & E Gun I was
responsible for onsite support, assisting customer install base with the
repair of any down tool. I provided classroom instruction and technical
support for both customer and field service personnel. Initiated and
maintained an overall product service plan for the Thin films product line.
Liaison for field service, factory and customer install base. Equipment
sets included all 3000 series thin films processing equipment.
Field Account Support Specialist/Engineer: Thin Films, (Sputter-Evap-E
Gun): West Coast Account Support Specialist for Field
Service/Sales/Marketing. I was responsible for improving tool performance
through best known methods. I resolved any customer issue, field service,
marketing, management, engineering, manufacturing or software through
monthly onsite meetings. Supported worldwide field engineers with
troubleshooting and repairing thin film vacuum equipment. West coast
Factory support for troubleshooting hardware and or process. Factory field
RGA and leak check expert.
Education: Chabot College - Engineering Technology (3.7 GPA)
US Air Force - Electronics Specialist
Awards: Lam, Fab Award, Worldwide Escalation Support 2006
Lam, Above and Beyond Exceeding expectations 1999- 2006
Hewlett Packard, Star Award Smart Fab Equipment Program 1999
Specialized Training: Supervisor Decision Analysis, PVD/CVD Process
Techniques, Varian PVD Field Engineering, RF Magnetron Sputtering,
Statistical Quality Control, RGA Analysis, Plasma Etch Physics
Lam Research; 9400/9600 PTX, Alliance 2300 and CMP On-Track.
Applied Materials; P5000, Endura, Centura and PZT.
All Varian 3000 series thin films/5101 CVD tools, MRC, Perkin Elmer, BTU
Furnace and Semitool.
Canon Stepper 3000IW, MKS RGA
Matson Technologies, Suprema, Aspen, Alpine, Paradigm Etch
Personal Accomplishments: Instructor, High Tech University, Basic
Electronics, 2004 - 2007
ERT Member Hewlett Packard, Xicor and Qualcomm
Service Record: US Air Force -- Honorable Discharge
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