GEET VARGHESE
*** ** ****** ***** • Hillsboro, OR 97124
503-***-**** • ****.********@*****.***
SUMMARY
Expertise in product planning, requirements management, and feature set definition.
Solid understanding of the product life cycle and capturing the voice of the customer.
Fluent in supply chain management, and managing multiple projects effectively.
Strong analytical and financial modeling skills along with process improvement acumen.
Strong teamwork, interpersonal, negotiations, and written/oral communication skills.
E XPERIENCE
INTEL CORPORATION HILLSBORO, OR
M a teria ls Pro g ra m Ma n a g er 2 0 1 2 - P resent
Managed material readiness of Knights Corner (Xeon Phi coprocessor) board for Intel’s high performance computing
(HPC) initiative.
Achieved approximately $7M Bill of Materials (BOM) cost savings over lifetime production volumes as result of cross-
collaboration with external contract manufacturer, engineering design/validation team, finance, and commodity
management.
Identified $250K annual packaging savings by driving qualification of alternate packaging vendor.
Executed component qualification efforts and ensured compliance with product ecology requirements to support Knights
Corner product launch.
C o mmo d ity S p ecia list - I n teg ra ted Circu its 2007-2012
Obtained $12M Design for Cost (DFC) savings by selecting alternate supplier for server platform motherboard power
management solutions and for replacing oscillators with clock solution.
Negotiated with integrated circuits (IC) vendors on netbook clock royalty agreements that would potentially
contribute@$500K in incremental revenue for Intel.
Achieved $700K in total cost savings which comprised of quarterly component cost reductions, pre-production savings,
and free samples savings as well as price increase avoidances.
Mitigated video chip supply line constraints for use on high-runner desktop board (@10K per week board builds) by
collaborating with the video chip vendor, motherboard contract manufacturer, and with multiple Intel stakeholders such
as Legal, board engineering team, and supply analysts.
Drove alignment with server motherboard design team on implementing best practices on IC component selections,
qualification plan, and risk assessment of power management IC suppliers.
Improved existing motherboard bill-of-materials (BOM) review process which increased the efficiency and quality of
commodity feedback to server design team and material managers.
C o mmo d ity S p ecia list - Pa ssive Hea tsin ks 2005-2007
Negotiated 7% annual savings on thermal mechanical parts for optical platform business unit and also achieved design for
cost savings of $500K by identifying alternate manufacturing method for an optical transceiver plastic component.
Awarded division recognition for efforts in managing thermal interface material supply constraint that impacted the bui ld
of 500K Intel desktop motherboards at four global contract manufacturing sites.
Conducted annual spends analysis (on heatsink parts amounting to $24M in annuals spends) that facilitated visibility for
commodity management to plan procurement and cost reduction strategies.
Devised strategic sourcing plan that outlined the tactical and strategic action items to ensure a competitive thermal
heatsinks supply line over a 3-year horizon.
Performed pricing and manufacturing capabilities benchmarking of 17 thermal industry suppliers that was used to
validate thermal solutions pricing from existing supply base.
NORTHROP GRUMMAN BROOK PARK, OH
1998 –2003
H a rd wa re S ystems En g in ee r
Managed a cross functional team for the assembly and hardware integration of a $20M microgravity science facility
prototype, and successfully completed system level tests on schedule.
Facilitated the first integrated testing between experiment package and microgravity science facility within NASA’s
stipulated time frame.
Increased the marketability of the microgravity science facility by updating the collateral outlining the baseline design
and features into an easily understood format for a varied audience consisting of the science community, NASA, and
internal design teams.
Improved robustness of the system design by translating ambiguous customer requirements into concrete design and
product specifications.
Monitored the science facility’s weight and volume metrics and trending over its development cycle to ensure compliance
with International Space Station’s requirements.
Accelerated the new product development process by influencing management to purchase requirements management
software.
U .S. A R M Y A V I A T I O N & M I S S I L E C O M M A N D HUNTSVILLE, AL
1996 –1998
A ero sp a ce En g in eer
Maintained and processed quality deficiency reports for OH-58 and UH-1 Army helicopters.
Completed Department of Defense certification in acquisition logistics and systems engineering.
E DUCATION
U N I V E R S I T Y O F M A R Y L A N D, R O B E R T H . S M IT H S C H O O L O F B U S IN E S S COLLEGE PARK, MD
Master of Business Administration (MBA), Marketing and General Management Concentrations 2003-2 0 0 5
Activities: InForum 2004 Business Technology Conference Chair
C O R N E L L U N I V E R S I T Y, C O LLE GE O F E N GIN E E R IN G ITHACA, NY
Master of Engineering: Mechanical Engineering, Manufacturing Concentration 1995-1 9 9 6
U N I V E R S I T Y O F M I C H I G A N, C O LLE GE O F E N GIN E E R IN G ANN ARBOR, MI
Bachelor of Science in Engineering: Aerospace Engineering 1991-1 9 9 5
C S
OMPUTER KILLS
Proficient in MS Word, Excel, Power Point, Project, and Visio.
Versed in IBM Rational DOORS, VBA, SPSS, Minitab, JMP, SAP, Microstrategy, Ariba Sourcing, Expert Choice, and
Clementine.