Technician Manufacturing

Sylvia Caudillo

Accomplishments

* ** years of process control experience in the area of disk

manufacturing and hybrid packaging.

* Proficient in Microsoft Office including Excel, Power Point, Word, and

Microsoft Project,

* Self taught programming, set-up and maintenance of H & K Bondject-820

AL 1.25 mil wire bond for new product line. Created bond programs for

the OE 3600 Al 5mil wire bonder

* Developed manufacturing specifications for H & K Bondject-820 Tool and

UV Oven maintenance.

* Maintained 3.5 GPA for six years while attending college and working

40 + hours at VLSIP Technologies Inc.

* Member of Phi Theta Kappa International Honor Society and Alpha Sigma

Lambda National Honor Society

Professional Experience

Engineering Technician March 2005 -

Present

VLSIP Technologies Inc, Richardson, TX 75081?

* Responsibilities include daily set-up and maintenance of equipment

used for Wire Bond.

* Drafted documentation and trained of key operators for operating and

troubleshooting of Gold Ball Wire Bonders, and AL Wedge bond

equipment.

* Monitored QC Inspection and measurements using RVSI, Nikon, and Koh

Young equipment.

* Maintained K&S-8060, H&K Bondjet 820, and Orthodyne 3600 Al wedge bond

equipment

* Performed preventative maintenance on K&S-1488 and K&S Max-um Gold

ball bonders.

* Created initial wire bond programs for new product line of all wire

bond equipment

* Programmed and edited wire bond program for K&S-1488 and K&S Max-um

Gold ball bonders.

* Monitored, tabulated, and analyzed SPC charts for wire bond area

* Assisted manufacturing with production scheduling and status reports.

* Inspected all devices processed using Nikon 40X visual inspections

microscope.

* All work performed in class 10,000 clean room Medical Department using

Military STD 883

* Proficient in Microsoft Office including Excel, Power Point, Word, and

Microsoft Project,

* Technical Writing of manufacturing production and maintenance

specifications,

Manufacturing Specialist May 2003 -

December, 2004

Texas Instruments, Sherman, TX 75090 ?

* Manufacturing Specialist for Chip Interface Department

* Used SAP to sell wafers to customers' world wide

* Organized Inventory control and wafer pick

* Prepared Shipping and Receiving

* Retrieved inventory, pick and pull

* Proficient in SAP and all Microsoft applications

* Operated Wafer Fabrication wet etch equipment

Engineering Process Control Technician March 1994 -

October, 2002

IBM, San Jose, CA 95135

* Process Control and Data Analysis for Test Department.

* Ran Engineering experiments thru Sputter, Lube, FTP, Test and Final

Inspection. Presented data results in weekly meetings.

* Maintained all Inspection and Robotic Sort Equipment per engineering

specifications.

* Trained QC test and QA inspection operators.

* Responsible for maintaining all certification records for Test

department.

* Authored Production Specs, Training checklists, and certification

exams for Test Department

* Process technician for back end of the disk manufacturing line.

Including QA, Inspection, conveyors, packaging and shipping.

* Authored three line-end manufacturing operating procedures.

* Trained all lead operators on set procedures.

* Conducted Safety and ISO 9001audits.

Programming and Software Skills

* Proficient in programming of H & K Bondjet, K & S 8060, K & S 1488 and

Orthodyne 3600 wire bonders.

* Microsoft Office 2003, 2007 and 2010; including Power Point, Word,

Excel, and Microsoft Project.

* Adobe PhotoShop, CAD 2007

Education

* Bachelor of Applied Arts and Science

* In Applied Technology and Performance Improvement

* University of North Texas, Denton, TX August 2009

- May 2012

* Electronic Engineering Technician Certification

* Collin College, Plano, TX, 75074 August 2007 - May

2009

[pic]

Contact this candidate