Assembly or Packaging or Printed jobs in Ashburn, VA, 20149

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Microelectronics Packaging

HEPCO, Inc.  –  Rockville, MD, 20849
... such as organic PWBs, multilayer ceramic packages, flip chip, 2.5D/3D packaging, MCM, QFN, IMA, etc) Proficient with AutoCAD software Proficient with design and routing of high density Printed Wiring Boards (PWBs) Able to communicate and collaborate ... - May 28

Assembly Worker

ROCS  –  Ashburn, VA
Assembly Operator Ashburn, VA $14.00-15.00/hr Depending on Shift (Morning or Evening) AM Shift: 5:30am-1:30pm PM Shift: 2 ... line and push batches to the next step of the process for packaging Verify that each finished item meets the quality ... - May 22

Structural Engineer: Electronics Packaging for Space Systems

Northrop Grumman Corporation  –  Dulles, VA
... assess random vibration fatigue life -Recommend electronic packaging design improvements based on the results of analysis ... • Familiar with IPC or NASA standards for circuit card assembly and Printed Wiring Board (PWB) design and fabrication ... - May 07

Structural Engineer: Electronics Packaging for Space Systems

Northrop Grumman  –  Dulles, VA, 20189
... assess random vibration fatigue life -Recommend electronic packaging design improvements based on the results of analysis ... • Familiar with IPC or NASA standards for circuit card assembly and Printed Wiring Board (PWB) design and fabrication ... - May 09

Structural Engineer: Electronics Packaging for Space Systems

Northrop Grumman  –  Dulles, VA, 20104
... assess random vibration fatigue life -Recommend electronic packaging design improvements based on the results of analysis ... • Familiar with IPC or NASA standards for circuit card assembly and Printed Wiring Board (PWB) design and fabrication ... - May 12

Associate Director, Packaging Engineering

AstraZeneca  –  Gaithersburg, MD, 20877
The incumbent will fulfill a strategic role within the Process Engineering and Packaging (PEP) organization. The PEP function develops clinical and commercial fill/finish processes, device/combination product assembly processes, and packaging for ... - Jun 01

Principal Structural Engineer: Electronics Packaging for Space Systems

Northrop Grumman  –  Dulles, VA, 20189
... * for circuit card assembly and Printed Wiring Board (PWB) design and fabrication • A **background in vibration, shock, and thermal testing** of space based electronic assemblies **Preferred Qualifications:** • A background in electronics packaging ... - May 14

Principal Structural Engineer: Electronics Packaging for Space Systems

Northrop Grumman Corporation  –  Dulles, VA
... assess random vibration fatigue life -Recommend electronic packaging design improvements based on the results of analysis ... • Familiar with IPC or NASA standards for circuit card assembly and Printed Wiring Board (PWB) design and fabrication ... - May 07

Principal Structural Engineer: Electronics Packaging for Space Systems

Northrop Grumman  –  Dulles, VA, 20104
... assess random vibration fatigue life -Recommend electronic packaging design improvements based on the results of analysis ... • Familiar with IPC or NASA standards for circuit card assembly and Printed Wiring Board (PWB) design and fabrication ... - May 12

Associate Director, Packaging Engineering

AstraZeneca  –  Gaithersburg, MD, 20877
The incumbent will fulfill a strategic role within the Process Engineering and Packaging (PEP) organization. The PEP function develops clinical and commercial fill/finish processes, device/combination product assembly processes, and packaging for ... - May 11
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