| Resume alert | Resumes 61 - 70 of 591 |
Assistant Design
Stony Brook, NY
... GPA: 3.53/4.0 Xi’an University of Posts & Telecommunications (XUPT) Xi’an, China B.E., Microelectronic Science and Engineering; GPA: 3.24/4.0; Ranking: 5/104 08/2019-Present 09/2017-03/2019 09/2013-07/2017 SKILLS Design: Low-power, LDO, ADC, OTA, ... - 2021 Feb 24
... GPA: 3.53/4.0 Xi’an University of Posts & Telecommunications (XUPT) Xi’an, China B.E., Microelectronic Science and Engineering; GPA: 3.24/4.0; Ranking: 5/104 08/2019-Present 09/2017-03/2019 09/2013-07/2017 SKILLS Design: Low-power, LDO, ADC, OTA, ... - 2021 Feb 24
IT, Testing, DATABASE, SQL
Houston, TX
... Lyshevski, Professor of Electrical Engineering, Department of Electrical and Microelectronic Engineering, Rochester Institute of Technology, Tel: 585- 475-4370, E-mail: adj7cm@r.postjobfree.com, adj7cm@r.postjobfree.com Janar Yermekbayeva Page4 - 2021 Feb 15
... Lyshevski, Professor of Electrical Engineering, Department of Electrical and Microelectronic Engineering, Rochester Institute of Technology, Tel: 585- 475-4370, E-mail: adj7cm@r.postjobfree.com, adj7cm@r.postjobfree.com Janar Yermekbayeva Page4 - 2021 Feb 15
Design Power
Atlanta, GA
... Microelectronic Circuits: Semiconductor devices with study not just the equations, but the basic principles in electrochemistry. Mostly covered microelectronic circuit elements such as diodes, field-effect transistors, operational amplifiers, and ... - 2021 Feb 10
... Microelectronic Circuits: Semiconductor devices with study not just the equations, but the basic principles in electrochemistry. Mostly covered microelectronic circuit elements such as diodes, field-effect transistors, operational amplifiers, and ... - 2021 Feb 10
digital design, embedded security, asic, fpga
Flagstaff, AZ
... in Microelectronic and Microsystems Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland - Dissertation Title: Microwave integrated electronics for ESR spectroscopy 2004 – 2007 M.Sc. in Electrical and Electronic Engineering ... - 2021 Feb 04
... in Microelectronic and Microsystems Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland - Dissertation Title: Microwave integrated electronics for ESR spectroscopy 2004 – 2007 M.Sc. in Electrical and Electronic Engineering ... - 2021 Feb 04
Data Engineer
Kennesaw, GA
... The focus of the research was on fabrication and optimization of microelectronic sensor that detected chemical composition of gases. • Directly contributed to sensor design, fabrication and performance evaluation. Developed data pipelines which ... - 2021 Jan 13
... The focus of the research was on fabrication and optimization of microelectronic sensor that detected chemical composition of gases. • Directly contributed to sensor design, fabrication and performance evaluation. Developed data pipelines which ... - 2021 Jan 13
Sr Chemist
Olney, MD
... Solder metallization interdiffusion in microelectronic interconnects. IEEE Transactions on Components and Packaging Technologies (2000), 23(2), 383-387. 15. Zribi, A.; Chromik, R. R.; Presthus, R.; Clum, J.; Teed, K.; Zavalij, L.; De Vita, J.; Tova, ... - 2020 Dec 27
... Solder metallization interdiffusion in microelectronic interconnects. IEEE Transactions on Components and Packaging Technologies (2000), 23(2), 383-387. 15. Zribi, A.; Chromik, R. R.; Presthus, R.; Clum, J.; Teed, K.; Zavalij, L.; De Vita, J.; Tova, ... - 2020 Dec 27
Assistant Engineering
Maryland Heights, MO
... Academic work experience Taught ‘Microelectronic Circuits’ for undergraduate students and prepared quiz questions Class Size: 30. Worked as a Lab Assistant for the ‘Semiconductor Devices and Electronics’ course. Size: 15. Done Lab Assistance for ... - 2020 Dec 26
... Academic work experience Taught ‘Microelectronic Circuits’ for undergraduate students and prepared quiz questions Class Size: 30. Worked as a Lab Assistant for the ‘Semiconductor Devices and Electronics’ course. Size: 15. Done Lab Assistance for ... - 2020 Dec 26
Manufacturing Engineer Electrical
Kissimmee, FL
... Skills: - - Physical Electronics - Power Electronics - Microelectronic Processing - Electronic Devices Digital Electronics - Digital Signal Processing - Aviation Regulation - SAP System - Time Management for Maximum Productivity - Total Quality ... - 2020 Dec 23
... Skills: - - Physical Electronics - Power Electronics - Microelectronic Processing - Electronic Devices Digital Electronics - Digital Signal Processing - Aviation Regulation - SAP System - Time Management for Maximum Productivity - Total Quality ... - 2020 Dec 23
Engineering Plant
Hyderabad, Telangana, India
... 2013-2014 9.3 GPA PROJECT WORK: Project on Microelectronic Mechanical Systems(MEMS) using COMSOL Multiphysics Software STRENGTHS : • Self motivated and confident on my work • Enthusiastic in learning new skills • Patience • Has ability to tackle the ... - 2020 Dec 18
... 2013-2014 9.3 GPA PROJECT WORK: Project on Microelectronic Mechanical Systems(MEMS) using COMSOL Multiphysics Software STRENGTHS : • Self motivated and confident on my work • Enthusiastic in learning new skills • Patience • Has ability to tackle the ... - 2020 Dec 18
Business Unit/Operation & Plant Management
Naperville, IL
... MICROELECTRONIC MODULES CORPORATION, New Berlin, WI April 1986 – February 2002 PHILIPS ELECTRONICS, New Berlin, WI VICE PRESIDENT OF OPERATIONS P&L responsibilities for business unit being positioned for eventual sale or IPO. Managed Materials, ... - 2020 Dec 10
... MICROELECTRONIC MODULES CORPORATION, New Berlin, WI April 1986 – February 2002 PHILIPS ELECTRONICS, New Berlin, WI VICE PRESIDENT OF OPERATIONS P&L responsibilities for business unit being positioned for eventual sale or IPO. Managed Materials, ... - 2020 Dec 10