Lenny C. Anderson

Email- qfohdu@r.postjobfree.com

Phone 757-***-****

SKILLS AND EXPERTISE

Technical Expertise

•Lean/Six Sigma Analysis

•Business Process Improvement

•New Product Introduction

•Systems Assembly/Board Level Test Analysis

•Design for Manufacturing Analysis

•Semiconductor Assembly

•Printed Circuit Board Assembly

•Project Management

•Operations Analysis

•fg.pplication Software Deployment Management

• ISO 9000/9001 Documentation

• ISO 9000/9001 Internal Audits

• AS9102

Lean/Six Sigma Tools

•DMAIC Problem Solving Methodology

•8 D Problem Solving Methodology

•Kaizen Facilitation

•Waste Reduction

•Error Proofing

•Statistical Process Control

•Design of Experiments

• Set-Up Reduction

• Predictive Maintenance

• Value Stream Mapping

• Cross Functional Process

Flow Charting

Manufacturing Equipment

• Disco Automatic Wafer Saw

• Mitsubishi Wire Bonder

• Mitsubishi Die Bonder

• Mitsubishi Encapsulation Mold

• Fuji, Panasonic , MyData SMT Placement Heller Reflow Ovens

• DEK & MPM Solder Printer

• SRT BGA Rework Equipment

Software Tools

• JD Edwards Enterprise

• Agile PLM Software

• SSA Global ERP Software

• Baan

• Valor Trilogy DFM Analysis

• Visio, PowerPoint, Word, Excel

• Microsoft Project Management

• Minitab Statistical Analysis

Electronic Manufacturing Engineering Skills Overview

• Developed, maintained and improved manufacturing process for high and mixed volume PCB and microelectronics assemblies employing six sigma methodologies.

• Developed BGA Rework process(SRT) and BGA placement capabilities(Fuji,Panasonic,MyData).

• Provided engineering support to the manufacturing floor when issues arise in board and systems level test processes.

• Responsible for creation, management and analysis of process performance metrics driving process improvements to maximize performance on system velocity through out the process.

• Analyzed and reviewed new product designs concurrently with design team, manufacturing operations, and supply chain to ensure robust and optimized manufacturing process (DFM). Integral member of new product introduction teams from product inception to transfer to mass production.

• Procurement of parts, fixtures, software or capital equipment to assist manufacturing.

• Provided timely and effective communications to manufacturing technicians and test engineers on issues, their root cause, and resolution.

• Documented the manufacturing process and associated tools used both for ISO compliance and as a reference by manufacturing technicians.

• Monitored down stream testing and reliability data providing root cause analysis and feedback to upstream processes.

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WORK EXPERIENCE & ACCOMPLISHMENTS

Independent Contractor

March 2006 - Present

Lean Six Sigma Contract Engineer

Eaton Corp. (Raleigh, NC) – June 2008 – December 2008

Facilitated cost reduction activities with the “Operational Excellence” group. Conducted Green Belt and Business Process Improvement projects to drive process and productivity improvements. This was an ISO certified assembly & test manufacturing environment. The product was large scale UPS systems.

• Lead a cross-functional team focused on improving the Material Review Board process for non-conforming material. Implemented transactional process improvements (Information Systems) resulting in annualized cost savings of $150k.

• Successfully lead a cross-functional team responsible for implementing improvements to “Just in Time Inventory”. Project resulted in the implementation of a “Two Bin Kanban System” which reduced the inventory at the work center.

• Facilitated weekly Kaizens focused on “error proofing” and “waste reduction”.

• Periodically conducted LEAN training classes for shop floor personnel

• Held periodic LEAN Six Sigma presentations for office personnel primarily focusing on Business Process Improvement methodologies.

• Completed Six Sigma project to reduce the number of scrapped circuit boards at systems test process.

• Supported 5S program at three plant locations with training and periodical auditing.

Sr. New Product Introduction Engineer-Contract

Flextronics, Inc (Durham, NC) - Feb 2007 - May 2007

Supported new product introduction of printed circuit boards with process development activities including equipment set-up, process validation and process capability studies. This was an ISO 9000 contract manufacturing environment.

• Analyzed process defects and metrics using statistical methods to reduce variations and identified. opportunities for improvement of new products before transition to mass production

• Maintained reflow oven profiles and supported test and QA failure analysis with oven profile analysis.

• Re-engineered component prep area including evaluation of all tool and equipment parameters and developed process documentation.

• Worked with machine shop and vendors to design or purchase new tooling as needed.

Project Engineer- Contract

Harris Corporation (Raleigh, NC)-July 2006 - Feb 2007

Supported ROHS Compliancy transition for a telecommunications manufacturing division. Provided support to design engineers on selection of alternative components and Agile MRP issues.

• Verified ROHS compliance of electronic components

• Documented ROHS compliant parts in Agile MRP System.

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Manufacturing Engineering Supervisor

Barcoview America, September 2002- March 2006, Duluth, Ga.

Developed and managed product industrialization process to introduce new products from design to mass production. Supported concurrent engineering functions early in design the life-cycle to develop assembly and test processes for high mix-low volume production. Manufacturing environment was an ISO 9001 & AS9102 certified shop designing high end graphic software. Shop floor processes included printed circuit board assembly and test , systems assembly/test and reliability testing. Baan MRP software was used for product configuration and resource planning.

• Completed Green Belt project to improve the new product introduction cycle time in systems assembly production. Solutions included reducing surface mount process defects through Design of Experiments (ANOVA) and transaction analysis (Information Systems) of developing assembly data from design data

• Ownership of the process delivering optimal new product introductions of electronic products

from design inception to pilot production to mass product.

• Coordinated test plan development at board and system level for new product introductions.

• Served as the project manager for development of sub-assembly supplier outsourcing.

• Supervised process technicians, manufacturing and test engineers in providing New Product Introduction activities for transition to mass production.

• Successfully completed business process improvement project to reduce machine program development cycle time. Solution included automation of some IT services and eliminating some non-value added tasks

• Implemented an engineering change request system using access data base to reduce test and assembly process and product problems reported.

• Conducted “Introduction to LEAN” presentations in a corporate initiative to employ LEAN practices plant wide.

Design for Manufacturing Engineer

Solectron Technologies, October 2000 - September 2002, Charlotte, NC

Analyzed customer printed circuit board designs with respect to optimizing manufacturing processes, product quality, and cost.

• Provided feedback to the customer and served as the technical point of contact for the customer's new product introductions.

• Manipulated various CAD data formats for input to Valor DFM Tool. Recommended any jigs/tooling to create a more robust process.

• Provided customer design services as needed.

New Product Engineering Supervisor

Ericsson, Inc. January 1998 - April 2000, Lynchburg, Va.

Introduced new products and optimized pilot productions for transfer of high mix printed circuit boards to mass production. Responsible for SMT program generation and process documentation. ISO certified manufacturing environment employing Fuji and Panasonic SMT equipment.

• Provided shop floor support for new and existing products.

• Supervised 3 quality supervisors and 40 plus operators/technicians in ownership of three customer-focused teams. (high mix, high volume production).

New Product Engineering Supervisor(continued) Page 4

• Evaluated supplier material quality as needed, relating to quality problems or product failures.

• Using 8 D problem solving methodology reduced the number of supplier related failures and developed a process for supplier quality accountability.

• Developed and implemented BGA rework process using SRT rework machine.

• Developed sampling plans and inspection methods for BGA inspection.

Business Process Improvement Consultant/New Business Development

Bi-Tech Consultants, December 1993 - December 1998, Raleigh, NC

Co-owner and consultant of a small IT and Engineering company. Provided turnkey business solutions in IT and manufacturing industries.

• Employing six sigma process improvement methodology, reduced 1st time failure rate of new workstations connecting to recently installed fiber backbone network on the campus of East Carolina University

• Completed project to reduce the number of marketing “cold calls” before reaching a decision maker of a prospective client. Reduced the process sigma level from an estimated 4.3 sigma to 1.5 sigma.

• Successfully completed six-sigma project to reduce human resources recruitment time. Problem solution included using business process improvement tools resulting in the elimination of non-value added tasks and implementation of a resume data base software solution.

Senior Manufacturing Engineer

Mitsubishi Semiconductor, December 1983 - June 1993, Durham, NC

Provided process development and improvement solutions for semiconductor integrated circuit assembly.

• Provided failure analysis and determined root cause for test and reliability failures.

• Monitored product quality and developed quality assurance procedures.

• Set up and managed maintenance of highly automated manufacturing equipment.

• Supervised process technicians providing floor support and preventative maintenance.

• Completed Design of Experiments (DOE) to optimize wire bonding process parameters.

• Completed Analysis of Variance (ANOVA) testing to introduce a more efficient cutting tool for the wafer saw process.

• Facilitated monthly “Quality Circle” (Kaizens) meetings with machine operators and quality inspectors support continuous improvement.

• Completed one year of semiconductor fabrication and assembly training in Japan. Training included Japanese process improvement and quality assurance techniques; 5S, Kaizen, Taguchi problem solving methods and other design of experiment (DOE) methodology.

EDUCATION

Bachelors of Science, July 1983 Industrial Engineering

North Carolina State University, Raleigh, NC

CERTIFICATIONS

Six Sigma Green Belt -March 08

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