Process Engineer
Resume:
Ronald J. Spence
Muskogee, OK ****3
Email: *********@*****.***
EMPLOYMENT:
Staples, Inc., Muskogee, OK (2011 – present)
Easy Tech Expert/Key Holder/ Manager
- Full time sales position at an office supply store. Duties included product sales, providing customer satisfaction, stocking, cash office management, key holder responsibilities, managing of hourly employees, and opening/closing the store.
FMW Composite Systems, Bridgeport, WV (2010-2011)
Project Engineer
- Lead engineer responsible for overseeing the design, purchase, and installation of a bank of SiC fiber reactors for a new production plant to support production of titanium matrix composite (TMC) aerospace parts. Also responsible for overseeing the design, purchase, and installation of a chemical recycling (distillation) system for the plant. Worked with various vendors to install building facilities, design and build equipment mezzanines and support structures, and design and develop equipment control systems.
Connors State Community College, Warner/Muskogee, OK (2006 – 2010)
Math Instructor
- Full time position teaching College Algebra, Trigonometry, and Developmental Math. All courses taught using Course Compass as a teaching aide. Various classes taught via ITV between both campuses. Math classes also taught at Jess Dunn Correctional facility located in Taft, OK. Served as the team leader for the HLC criterion 2 self-study assessment team and as a member of both the HLC Steering Committee and the Academic Assessment Committee.
Staples, Inc., Muskogee, OK (2008 – 2011)
Closing Manager/Sales Associate/Key Holder
- Part time sales position (20-39 hrs/wk) at an office supply store. Duties included product sales, providing customer satisfaction, stocking, cash office management, key holder responsibilities, managing of hourly employees, and opening/closing the store.
Texas Instruments, Inc., Semiconductor Group, Dallas, Texas (1993 - 2006)
Process Engineer (1993-2000, 2002-2006)
- Responsible for sustaining various metal, poly, and nitride etch processes in a high volume production wafer fab. Duties included process development and qualification, SPC process control and improvement, defect monitoring and reduction, scrap reduction, yield improvement, and providing mentoring and training to engineering peers, technicians, and specialists. At various times, co-supervised up to 8 engineering technicians. Specific achievements include:
* Project Leader for a Contact/Via Scrap Reduction Team. Duties included driving team strategies, running meetings, assigning actions to team members, publishing team minutes, and making presentations to upper management. The team successfully reduced scrap from 2237 DPPM to 1097 DPPM.
* Fan out and implementation of a NCS (nitrogen clean system) on all 8” metal etch tools for defect reduction. Implementation resulted in 3x increase in Mean time between cleans (MTBC), 90% reduction in backside helium errors, 75% reduction in ABEDD (angular blocked etch defects), and a 1.5% to 5% increase in yield (die size dependency).
* Co-chaired a Nitride Loop Defect Reduction Team. The team successfully determined the root cause of and eliminated various nitride defects at deposition, pattern, etch, and cleanup.
* Setup and qualified a poly/nitride stack etch over patterned poly on a LAM4420 poly etch reactor. Two previous engineering groups in two different fabs had attempted developing this process without success.
* Eliminated the high scrap rate at p.o. nitride deposition due to arcing contamination caused by early graphite boat wear out. Optimized boat etch back to reduce wear, and increased boat replacement frequency. Created graphite boat building specifications and training for technicians to increase boat availability and reduce boat building errors.
* Eliminated the high scrap rate for voids in p.o. nitride films after etch caused by resist coverage problems over underlying metal topography. Optimized the p.o. etch process to minimize erosion, worked with the photo engineer to increase resist coverage, and set up monitoring and containment specifications.
Process Development Engineer (2000-2002)
- Process development engineer supporting the 150mm to 200mm Digital Micromirror Device (DMD) superstructure conversion. Responsible for generating lot plans, analyzing yield and parametric data on pilot and production material, centering final product parametric data and operating characteristics, and relating parametric data back to production processes. Investigated and solved various process and design problems associated with new products and scale-up. Served as the process engineering representative to various cross-functional integration, product development, and defect reduction teams for various 200mm DMD device qualifications and characterizations.
EDUCATION:
M.S. in Chemical Engineering, University of Arkansas, Fayetteville, Arkansas (1990)
GPA = 3.92
B.S. in Chemical Engineering, University of Arkansas, Fayetteville, Arkansas (1987)
GPA = 3.80
PROFESSIONAL AFFILIATIONS:
American Institute of Chemical Engineering
• student member from 1986-1991, President of student chapter in Spring 1988.
• national member from 1991-1993
Tau Beta Pi
•Initiate instructor – 1987
REFERENCES:
Available upon request
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