Makoto Harada ZIP: *****

***** ******* ** *, ****, MI, USA

+01-586-***-****

ad48dr@r.postjobfree.com

Objective

To get a position of senior embedded software engineer. Technical skills

Experience Summary

• Over 11 years Embedded Software/Embedded Linux Software Engineer, 7 years Application Engineer and 1 year Field Application Engineer experience in ARM based Application Processor. 5 years Design Engineer experience in module and SoC level.

• US Green Card Holder (Used to work with H1B visa) Area of Strength

• Very self-managed and self-motivated person

• Ethernet AVB/TSN knowledge and stack development experience.

• Linux device driver development, kernel porting and boot loader development experience.

• Windows application development using C++ and C#, Linux application and tool development using C, C++, shell script and python, iOS/macOS application development using swift. Basic knowledge of web programming including html, css, javascript, nodejs. Now have interest on rust and learning it.

• SoC design and verification experience.

• Detailed knowledge of operating system internals, assembly/C/C++ language, SOC architecture.

• Various application knowledge including Ethernet AVB/TSN, Car Infotainment, Tablet and V2IP.

• Software/Hardware/Board debugging and problem-solving skill by utilizing various tools including ARM debugger, gdb, oscilloscope, logic analyzer.

• Familiar with the hardware interface/modules supported by Application Processor including DDR, display interface (LVDS, RGB parallel, HDMI), camera interface, audio interface (I2S), serial interface (SPI, I2C, UART, USB), Ethernet interface (MAC, MII), Storage (NAND, NOR, SD/emmc, SATA), Multimedia(Image processing unit and video processing unit) and GPU. Experience

Senior Software Engineer, Intrepid Control Systems, US 2016 Jan – Present Develop the vehicle network engineering tools, especially Automotive Ethernet portion, as a senior software engineer, including embedded software, windows app and python library development using c/c++/C# and python.

Provided the technical seminar of AVB/TSN standard to Japanese customers at private seminar. Attend at CES and IEEE automotive ethernet events all of the world as exhibitor. Served as technical leader and representative of AVB/TSN technology in Intrepid Control Systems. Highlight

• Responsible for Automotive Ethernet switch products, supporting gPTP, FQTSS, TAS, SRP, etc and NVIDIA Jetson integrated. Worked for board bring up, software development for firmware, windows app, windows and python libraries, with hardware, DFT and QA team.

• Responsible for Ethernet AVB endpoint product as a main developer including function definition, board bring up, software development including device driver, video and audio application and enhancement.

• gPTP(IEEE802.1AS) stack development from scratch and implemented it to all of ICS products. Collaborated with FPGA engineer to implement the hard assist feature required for gPTP. Worked with tier-1 Japanese customer to implement their requirement.

• Various embedded Linux development experience including OpenWRT, Jetson Linux for NVIDIA Jetson series, QuecOpen for Quectel 4G modem and Wifi devices, Yocto, buildroot, etc. Embedded Linux Software Engineer, Atmark Techno, Japan 2013 July – 2015 Dec Contribute to new product development as a Linux embedded software engineer. Provide pre- and post-sales technical support to FAEs and customers. Highlight

• ATB-A800NTSC board evaluation, NTSC device driver development including gstreamer v4l2src plugin support. H264 custom gstreamer plugin bug fix.

• Linux 3.14 kernel porting experience to Armadillo-4x0 and Armadillo-IoT (Freescale i.MX25 based).

• Developed snow level monitoring demo using OpenCV using Armadillo-840 (Runesus R- mobile A1 platform) which was shown in ESEC 2014.

Senior Field Application Engineer, Freescale, Japan 2012 Apr – 2013 June Provide pre- and post-sales support to customer as technical representative of FSL i.MX application processor in automotive and consumer market, including requirement definition and product proposal by closely working with Sales, marketing and disty FAE. Application Engineer, Freescale, Japan 2005 Oct – 2012 March Provide post-sales support to customer as a technical specialist of FSL i.MX application processor (especially MX31, MX51 and MX6x series), including HW and SW Q&A, schematic review, power consumption optimization, benchmarking, driver customization and sample application development. Debugged various kinds of customers issue, find out the root cause and provided the solution by collaborating with Design and BSP team in worldwide. Provided the technical training to FAE, 3rd party and customers. Contributed the various business win by developing attractive demos as a sales tool.

Highlight

• “Surround view” demo development (Automotive parking assist system)

- Using i.MX6 Quad Cortex A9 1.2GHz Application Processor.

- Receive the multiple MJPEG encoded streaming data as UDP stream from Ethernet camera, use VPU (Video Processing Unit) to decode MJPEG, pass the data to GPU for further graphic processing including lens distortion correction and stitching, then output to LCD. The demo was shown to various customers in various situations including FTF Japan 2012.

- Awarded by Freescale Japan tech department.

• Contributed various product launch including SHARP Netwalker (powered by FSL i.MX51 Cortex A8 Application processor - Awarded by the Freescale US headquarter for the success of this project.), SONY VAIO Photo frame (powered by FSL i.MX31 ARM11 Application Processor) - Awarded by the Freescale Japan headquarter for the success of this project. Design Engineer, Freescale (Motorola semiconductor division), Japan 2001 Apr – 2005 Sep Module level design and verification. SoC-level integration and verification for digital circuit portion. Familiar with Verilog-HDL, synthesis, timing and logic verification. Much experience of C/C++ based embedded code development for SoC-level verification. Highlight

• SoC level module integration and verification. Developed and maintained the test code and test bench for USB 2.0 Device, IEEE 1284 printer parallel port. Static and Dynamic timing analysis for whole SoC.

• Module level module design, synthesis, logic and timing verification, documentation. Responsible for SRAM controller, SPI, AD converter (digital logic portion). Education

University of Electro- Communications, Tokyo, Japan 1999 – 2001

• M.S., Electronics and Communication Engineering

University of Electro- Communications, Tokyo Japan 1994 – 1999

• B.S., Electronics and Communication Engineering

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