Andrew Kim

*** ***** **. *** ****. CA ***** 858-***-**** ad42uy@r.postjobfree.com

Meta Platforms (Sunnyvale) - Display Mechanical Engineer (contract via H10 Capital) May 2022 - Present

• Lead mechanical integration for display modules on a wearable device with given design constraints and form factors per product definition based on PDEs, System EE design inputs and vendor capabilities.

• Lead mechanical characterization and DOEs for OLED, LCD display modules with mechanical tests (HTHH test, Drop-impact, PS Mura test, Push-Bend, FA studies) and provide learnings to optimize system integration for Pre-P0 ~ EVT.

• Lead Z-gap tolerance analysis for module stack-up to mitigate drop impact near SIP, PMIC, T-IC, ALS, NFC Shield and DDIC area.

• Lead statistical tolerance analysis to define Display Stack-up and VA-AA gap on a Cover Glass to improve MFG yields.

• Design a thermal test chamber for LCD module to evaluate thermal effect and provide learnings for Optical module team.

• Design a fixture to allow manually assembling BLU + Display panel controlling tolerances under 20 um for rapid in-house evals.

• Design a representative impact test dummy model to evaluate and down-select PSA thickness and material performance.

• Establish SOPs and ERS workbooks for vendors to guide JDM/CM process while defining R&R and KPIs. Lam Research (Fremont) - Mechanical Engineer Jan 2020 – Apr 2022

• Drive development of Etch process upper chamber module components for a new platform with 20+ engineers and PMs.

• Conduct PDR, DDR, CDR, FMEA and testing while establishing design requirements for program work scopes.

• Design test fixtures with alignment features, a machined housing and 4DOF optic sensor kinematic mount to validate a multi- channel Plenum performance under wide temperature swing and fluid pressure drops.

• Design Air tubes and Plenum NX model to control Etch Chamber window’s azimuthal temperature uniformity for RF sensitive application based on flow studies for platforms and Process modules.

• Design a Dynamic Wafer Temperature Control manifold unit for cryogenic application on Dielectric tool.

• Work with vendors for injection moldings and 3D print parts for manufacturability study with cost impact analysis.

• Design PCBA enclosures for retrofit/HVM based on NX conjugate heat transfer FEA with validation process collaboratively.

• Design Heat Exhaust and packaging for the platform providing multiple design options and design impact.

• Minimize NRE cost for injection moldings, addressing manufacturability issues, and delivering project feasibilities.

• Rapid prototyping with 3D printing using various materials for fit-check, testing, and rapid design iteration via hands-on lab testing with various in-house tools.

EKK Eagle Industry (San Jose) - Mechanical Product Design Engineer Dec 2018 – Jan 2020

• Design custom test fixtures to characterize performance of polymers under high temperature and corrosive chemistry.

• Design guiding pin features for vacuum chamber sub-assembly used in CVD, PVD, and Etch test fixtures.

• Reverse engineer to retrofit a semiconductor robot wafer blade assembly to enhance positioning control ability.

• Create FEA models of FFKM elastomers, mechanical assemblies, and customized magnetic fluid vacuum seals to provide optimized performance under a wide thermal range. Model validated through empirical testing.

• Conduct helium leak tests and identify failure modes of various sealing designs operating at high vacuum/temperature.

• Visit manufacturers/vendor sites to conduct factory audits and conduct FAI for new products for customers. UC San Diego Design Project – Material Lead Jan 2018 - June 2018

• Design test fixtures used for the curing of carbon fiber prepregs and optimized the number of Carbon fiber composite layers and orientation of composite laminates to maximize stiffness and to minimize weight of a wing for an electrically propelled airplane.

• Modeling structural and modal behavior of the airplane wing with custom MATLAB FEM code and proposed enhancements to reduce areas of stress concentrations and structural performance. University of California, San Diego Class of 2018

B.S. Structural Engineering – Aerospace structure

SKILLS

• Software: NX, Team Center, SolidWorks, ABAQUS, ANSYS, MATLAB, JMP, LabView, Python.

• Tools: DIC/HS camera, FLIR, 3D printings, Keyence metrology tools, Korean language.

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