Douglas A. Coggeshall

**** **** ****** *****

St. Petersburg, FL 33173-1220

CEAI @ Engineering-Excellence.US Telephone: (727) 485 - 6220 OBJECTIVE

Challenging Electro-Mechanical Design Engineer position, specializing in complex Electronics Packaging and/or Electro-Mechanical systems, utilizing an impressive CAD-FEA skill set, successful project management experience, excellent communication skills, all effectively focused with a “can do” attitude. PROFESSIONAL ACHIEVEMENTS

Project Management success using leadership, organization and communication skills

Mechanical Engineering (BSME) degree earned over ten (10) years while working full-time.

Design and fabrication of complex parts using casting, sheet metal, and CNC-machining processes.

Excellent knowledge of Circuit Card Assemblies (CCAs), Electrical and RF-Connectors, Flex Cables and Wire Harnesses, EMI Shielding, Plastics, Machining, Casting and Sheet-Metal.

SolidWorks CAD experience (10,000 hours).

FEA experience includes Ansys and SolidWorks software packages. Mathcad applications.

Electronics Packaging design for FLIR Night Vision Systems (Airborne and U.S. Army M1A2 Tank)

RF-Components and Electronics Packaging for Sat-Com Systems (Ø 1.20M and 0.85M Reflectors)

Opto-Mechanical Electronic Packaging design for Spectrometer Systems

Military Portable Electronics and Vehicle High-Voltage Systems PROFESSIONAL EMPLOYMENT

Oct 2011 to Oct 2015 SENIOR MECHANICAL ENGINEER : MILITARY SAT-COM TERMINALS Tele Communications Systems, Inc. (Tampa, Florida) Mechanical Engineering responsible for New Designs and Sustaining engineering for Military Satellite Terminals with Ø 1.20M and 0.85M Reflectors in Ka-Ku-X-Band. Included mechanical design of Feed Horn Assemblies and OMTs. Project Mechanical Engineer for the “Ultra-Tarpon Program” Ø 0.85M man portable System. Design and fabrication of complex parts using casting, sheet metal, and CNC- machining processes.

Exceptional success in bringing Assembly and Production teams into the design process, resulting in a genuine effect of project ownership by production teams. Initiated a highly praised Electronic Interconnect Diagram (E-ICD) in first year at TCS, whose example was later used in other TCS design projects. Developing the E-ICD with the help of Assembly and Production teams revealed several discrepancies between the “official” design and what TCS was actually shipping to it’s customers. March-2008 to Sept-2011 MECHANICAL ENGINEERING MANAGER : OPTO-ELECTRONIC SPECTROMETERS Ocean Optics, Inc. (Dunedin, Florida)

Mechanical Engineering Manager responsible for New Designs and Sustaining engineering for Optical-Electronics packaging for Spectrometers and Light Sources. Increased business profitability with significantly reduced rework and scrap of mechanical assemblies, most importantly for the prominent JAZ product line. Excellent relationship with Sales and Marketing for new product development. Contributed to development of new product lines such as NIRQuest, STS and TORUS spectrometers.

Aerospace mechanical engineering design and drafting standards introduced, including Templates to increase drawing clarity and drafting productivity. Successfully restored an excellent working relationship with Assembly, Production and Procurement operations.

March-2006 to March

2008

MECHANICAL ENGINEER : AIRCRAFT INSTRUMENTATION

Aerosonic Corporation (Clearwater, Florida)

Mechanical Design for commercial aircraft instrumentation systems. May-2002 to March-2006 SENIOR MECHANICAL DESIGN ENGINEER : AEROSPACE NAVIGATION SYSTEMS Honeywell Defense (Clearwater, Florida)

Mechanical Analysis and Design for various Aerospace Navigation Electro- Mechanical packaging systems. Thermal, Shock and Vibration analysis. Project Lead Mechanical Engineer for the successful F-35 Inertial Navigation System. Nov-1998 to Jan-2001 ELECTRONIC PACKAGING MECHANICAL ENGINEER : RF-SYSTEMS Harris Corporation (Melbourne, Florida)

Lead Mechanical Design Engineer for the MIDS program (seven months) from Program Kick-Off to release of LRIP drawing package to produce fifty MIDS terminals. Responsible for all mechanical engineering schedules and budgets, from initial proposal throughout program execution.

Supervised five (5) designers to modify an existing “build-to-print” system to achieve component and manufacturing cost reductions.

Oct-1995 to Oct-1998 ELECTRO-MECHANICAL DESIGN ENGINEER : MILITARY NIGHT VISION SYSTEMS Raytheon TI Systems (Dallas, Texas)

Mechanical Design and System Integration with military FLIR (night vision) systems

(Abrams M1A2 CITV-HTI program).

EDUCATION

1977 - 1989 B.S.M.E. degree, University of New Orleans Senior year GPA of 3.20

Graduate level courses in Vibration Analysis and Mechanics of Composite materials. PROFESSIONAL AND PERSONAL REFERENCES AVAILABLE UPON REQUEST Douglas A. Coggeshall

Analysis and Design Portfolio : Electro-Mechanical Packaging

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