Sumanth Krishnamurthy

682-***-**** acviw6@r.postjobfree.com www.linkedin.com/in/sumanthkrishnamurthy

Summary

Experience in Research and Engineering in Mechanical Design, FEA/FEM, Automotive Engineering and Electronic Packaging.

Proficient in CATIA, SolidWorks, ANSYS, and adept in solving variety of engineering problems.

Working knowledge of DFM, FMEA, GD&T, Sheet Metal and Material Testing/Characterization.

Education

M.S in Mechanical Engineering (GPA 3.62/4), University of Texas at Arlington, USA August 2014-May 2016

B.E in Mechanical Engineering, Visvesvaraya Technological University, India August 2009-June 2013

Skills

Tools: CATIA, SolidWorks, PTC Creo, AutoCAD, ANSYS, ICEPAK, MATLAB

Characterization: Dynamic Mechanical Analyzer, Thermo Mechanical Analyzer, Instron MicroTester, Digital Image Correlation Technique

Programming & Database Systems: C, JAVA, MySQL

Other Skills: GD&T, Sheet Metal, Injection Molding

Work Experience

Graduate Research Assistant, EMNSPC, University of Texas at Arlington December 2014- May 2016

Performed thermo-mechanical modelling and life predictions using ANSYS and conducted experimental tests in a lab environment.

Optimized QFN package design for improved board level reliability.

Instructor, University of Texas at Arlington December 2014-June 2015

Taught a full credit course, CATIA V5, for undergraduate students.

Responsibilities included proctoring and evaluating examinations, assignments and projects.

Thesis

Experimental and Computational Board Level Reliability Assessment of Thick Board QFN Assemblies under Power Cycling

Successfully characterized thick PCB to determine Young’s Modulus and CTE for performing FE analysis.

Performed Power Cycling using ANSYS and identified the critical solder joint.

Studied the effect of varying CTE of thick PCB on the critical solder joint.

Projects

Birth-to-death Modeling Methodology for the Optimization of Custom Board-Level Reliability, a Semiconductor Research Corporation project sponsored by Texas Instruments December 2014-May 2016

Successfully characterized materials for different package components using Instron MicroTester, DMA and TMA.

Achieved 15% reduction in plastic work in QFN packages on thick board.

Design of Support System for F600, UTA Racing (FSAE) June 2015-August 2015

Designed and analyzed rear uprights, sprocket and sprocket hub for F600 using SolidWorks and ANSYS.

Designed Mumford Linkage mountings on the upright tubes.

Achieved weight reduction by 70% in the rear uprights by optimizing the model.

Design and Analysis of a Hinge Fit of a Basic Jet Trainer, Hindustan Aeronautics Ltd. February 2013-May 2013

Designed and analyzed a Hinge Fit using SolidWorks for a Basic Jet Trainer at the Wing and Empennage division of the Aircraft Research and Design Center (ARDC).

Achieved uniform load distribution and significant weight reduction in the hinge fit.

Awards And Activities

EMNSPC (Electronics, MEMS and Nano Electronics Systems Packaging Center) Scholarship Award – University of Texas at Arlington.

Secured ‘A+’ in a certified course on CATIA V5 from Electronics Corporation of India Ltd. (ECIL).

Professional Affiliations - American Society of Mechanical Engineers (ASME) and Surface Mount Technology Association (SMTA).

Publications

Krishnamurthy, S., Deshpande, A., Islam, M., Agonafer, D., “Multi Design Variable Optimization of QFN Package on Thick Boards for Enhanced Board Level Reliability”, ITherm, Las Vegas, May 2016.

Graduate Course Work

Advanced Finite Element Methods, Fundamentals of Electronic Packaging, Application of Computational Techniques to Electronic Packaging, Control System Components, Thermal Conduction, Engineering Analysis, and Analytical Methods in Engineering.

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