MICHAEL A. AWAAH, PH.D. Chandler, AZ 479-***-**** acv2ys@r.postjobfree.com

SUMMARY OF SKILLS

Highly motivated and results driven experienced electrical/process engineer with multidisciplinary engineering background applicable to both manufacturing and R&D environments.

Extensive semiconductor industry experience. Analytical and technically experienced professional with extensive understanding of semiconductor device physics, semiconductor devices design, fabrication and integration techniques.

o Experience with processing of III-V compound semiconductor devices particularly Gallium Nitride and Gallium Arsenide

o Research relating to GaN/AlGaN films, along with the fabrication and characterization of AlGaN/GaN HEMTs structures

o Analysis and characterization of GaN based blue LEDs o Design, fabrication and characterization of AlGan/GaN HFETs

Extensive experience with process and process integration, statistical process control methods and lean manufacturing methods in order to improve product yield and quality while also reducing rework and scrap.

• Design of Experiment (DOE) –JMP & Scripting JSL, screening models, prediction profiler, 2 level fractional and full factorial designs, well demonstrated use of model-based problem solving

Support process improvements, cost reductions/savings, scrap reductions, etc. through the implementation of LEAN concepts.

o Initiate corrective actions and improvement plans as needed

Reducing Cost of Consumables – increasing consumable lifetimes and reducing erosion rates of chamber parts, increase Mean Time Between Clean (MTBC)

Process development, characterization, troubleshooting, technology transfer, factory start ups and ramp to full capability

o Prepare and validate technology transfer packages containing module recipes, equipment set up conditions, configurations, process flow, training document and success criteria o Transfer and verify process and test recipes, initiate and analyze engineering lots. Get technology qualified and submit for approval.

o Develop control plans, update FMEA’s and ensure process capabilities o Manage product transfer projects to and /or from foundries or internal Fabs and release product for manufacturing and submit all product transfer documents to document control o Develop control plans, update FMEA’s and ensure process capabilities

Demonstrated leadership and project management.

o Recognized leadership qualities that have resulted in placement into developing technology (14nm) engineering positions.

o Managed several funded grants (NSF, DoD)

o Initiate project plans with schedule time-line and budget (Microsoft Project) and manage this budget and time-line for the project

Superior written and oral communication.

PR O F E S S I O N A L E X P E R I E N C E

GRAND CAYON UNIVERSITY JANUARY 2016 – PRESENT

Adjunct Faculty

Teach and advise undergraduate students along with mentoring students. HUMANA PHARMACY ENGINEERING JANUARY 2016 – JUNE 2016 PROJECT LEAD ENGINEER

Installed and wired PLC components, control switches, optimized pharmacy sorting systems. Process implementation and optimization of pharmacy dispensing system

Interact with manufacturing, suppliers and customers to drive improvement activities and ensure product and processes meet or exceed customer expectations

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MICHAEL A. AWAAH, PH.D. 479-***-**** acv2ys@r.postjobfree.com Page 2

Participate in the improvement of the manufacturing process for existing products. Conduct studies to stabilize, validate and improve product and process capabilities. Perform capability studies to identify problems, provide solutions and/or recommendations for improvement, and implementing corrective/preventive actions. INTEL CORPORATION, CHANDLER, AZ JANUARY 2012 – SEPTEMBER 2015 Senior Process Engineer

Worked on 14nm Back-End Dry Etch as a Senior Process Engineer and was Tool set Owner.

Drove critical process window determination, process recipe optimization, and trained engineers and technicians in the 14nm technology node as a Technology Development Engineer at Intel’s Oregon facility. o Transferred and implemented all required manufacturing and process engineering systems to support equipment and fab qualifications with 100% performance to schedule and costs below budget.

Supported the 14nm and 22nm Virtual Factory Matching exercise; oversaw the process, hardware change control and matching process control metrics for Fab12/32.

Maintained a stable high equipment availability of 90%, along with consistent product cycle times, and high product yields.

Sustained state of the art equipment and materials in dry etch process for 14 nm and beyond as Backend Process Engineer; reduced costs by 50% and delivered continuous improvements in safety, quality, yield, reliability, process stability/capability, and productivity while maintaining rigorous copy exactly and best tool matching factory wide.

Achieved a record-breaking shipment of 6K+ 14nm wafers to meet customer needs; reduced defects/excursions, performed equipment qualification/maintenance, managed equipment upgrades/availability, cost reduction, and technician training and certification.

Interacted with manufacturing, suppliers and customers to drive improvement activities and ensured product and processes met or exceed expectations.

Participated in improvement of the manufacturing process for existing products. Conducted studies to stabilize, validate and improve products and process capabilities. Perform capability studies to identify problems, provided solutions and/or recommendations for improvement, and implementing corrective/preventive actions.

Analyzed defective product and/or processes to determine root cause of defect and provided input on corrective/preventive actions to prevent future failures. Implemented solutions to improve yield.

Prepared process guidelines and procedures for new equipment, products and processes.

Performed internal and external audits on product/processes to ensure compliance to specifications.

Maintained existing practices and continue to implement improvements in clean room.

Drove process control improvements and reduce process variation through the application of lean concepts. o Organized Lean Events (Kaizen) for engineers and technician in the etch area to reduce process variation.

Provided guidance and resources to engineers interested in pursuing a technical leadership path or developing their technical skills set as an Instructor at Intel’s Fab Sort/Manufacturing College of Engineering (FSM COE). o Supported, advised, mentored, and graded Intel’s COE’s Science of Semi Manufacturing class in Fall 2014. AZ STATE UNIVERSITY, TEMPE, AZ MAY 2011 – AUGUST 2011 Research Professor (Summer), Solar Power Laboratory at the School of Electrical, Computer and Energy Engineering

Appointed to the NSF Quality Education for Minority (QEM) Leadership Development Institute Cohort II.

Improved Si Solar Cell efficiency using PVD and CVD and worked on Next Generation Photovoltaics II: High Efficiency InGaN Solar cells.

TUSKEGEE UNIVERSITY, TUSKEGEE AL MAY 2007 – DECEMBER 2011 Assistant Professor, Electrical Engineering Department

Taught and advised undergraduate and graduate students along with mentoring undergraduate and graduate student researchers; increased the total number of graduate and undergraduate researchers by 240%.

Instructed multiple lecture and laboratory classes including Linear Network and Circuits I/II, Semiconductor Devices, Energy Conversion Laboratory Session, Fundamentals of Microsystems and Nanotechnology, Electronic Device Design and Fabrication, Advanced Solid State Devices, and CMOS Digital Integrated Circuit Design.

Research in next generation photovoltaic material (II-IV/ III-V compound semiconductor materials for high efficiency photovoltaic application using PVD and CVD), along with the growth of Ge on Si/SOI for silicon photonic integration, and high dielectric material for device application.

Maintained and coordinated laboratory use by various members of the faculty.

Demonstrated leadership and project management - Managed sponsored research grants MICHAEL A. AWAAH, PH.D. 479-***-**** acv2ys@r.postjobfree.com Page 3 o 2010 Recipient: National Science Foundation Major Research Instrumentation (NSF MRI)

$234,000.00 for 1 year, coPI with Drs. Li Jiang and K. Das. o 2008–2013 Recipient: Engineering Research Center for Integrated Access Networks

(NSF ERC CIAN), $516.484.00 for 5 years, PI.

o 2009-2010 Recipient: NSF HBCU-RISE; Strengthening the Ph.D. Program in Materials Science and Engineering at Tuskegee University Tuskegee University's first Ph.D. program in MSE,

$40,000.00 for 2 years, coPI.

o 2010: DoD MSI (The Department of Defense Research and Education Program for Historically Black Colleges and Minority Serving Institution), $556,230.00 for 3 years, coPI o 2010: NSF EPSCoR (Alabama Experimental Program to Stimulate Competitive Research Program), $100,000.00 for 2 years, coPI.

EXCELLATRON SOLID STATE LLC, ATLANTA, GA MAY 2007 - AUGUST 2007 Senior Scientist

Developed and optimized a proprietary, cost-effective, and commercialized process to help manufacture solid state and thin film batteries for energy storage technology. INTEL CORPORATION, SANTA CLARA, CA OCTOBER 2005 – AUGUST 2006 Process Technology Development Engineer

Tasked with the integrated development of lithography processes for flash and microprocessors technologies which involved sustaining technologies across all stages of the development cycle as the Technology Development Process Engineer.

Monitored, sustained, and improved lithography processes and improved yield as Process Engineer.

Enhanced processes by auditing process recipes regularly while improving run-rates, reducing costs, and resolving complex and high-level production and defect issues.

Optimized and improved process window determination. TUSKEGEE UNIVERSITY, TUSKEGEE, AL AUGUST 2000 – OCTOBER 2005 Research/Teaching Assistant

Conducted daily scientific research relating to GaN/AlGaN films, along with the fabrication and characterization of AlGaN/GaN HEMTs structures.

Maintained laboratory equipment including a photolithographic machine, Auto 306 sputtering system, microprobe station, semiconductor parameter analyzer, precision LCR meter, and automated measurement system.

Taught and organized a Linear Networks, Circuits I and II, and Electronics I tutorial; conducted laboratory sessions and graded laboratory reports.

ALTX INC., ALBANY, NY MAY 2001 – AUGUST 2001

Summer Intern

Coordinated and implemented a real-time RF application to collect pertinent data in production processes to aid in the production of industrial tubing for use in the airline, auto, and other construction industries. OI ANALYTICAL, COLLEGE STATION, TX JANUARY 1998- AUGUST 2000 Field Technical Specialist

Repaired, serviced and maintained liquid analyzers (LAN) and specific air monitors (SAM) that use infrared absorption techniques to identify and quantify materials.

Installed and commissioned liquid analyzers (LAN) and specific air monitors (SAM) at costumer sites. PRIOR PROFESSIONAL EXPERIENCE

ROLAND-BRYAN ELECTRICAL CONTRACTORS, LOUISVILLE, KY JANUARY 1996- DECEMBER 1997 Engineering Aide

Installed and wired PLC components, control switches, and wired compressor machines under the Bull Frog Sorting System along with the installation of electrical motors, scanners, sensors, and electrical fixtures. ELECTRICITY COMPANY OF GHANA, ACCRA, GHANA SEPTEMBER 1993- AUGUST 1995 Electrical Engineer / Maintenance Engineer / Control and Operations Engineer MICHAEL A. AWAAH, PH.D. 479-***-**** acv2ys@r.postjobfree.com Page 4

Managed the planning, maintenance, and installation of 11/33kV Substation Equipment; issued work permits and isolated 11/33kV networks for system upgrades, maintenance, and daily switching operation.

Tested transformer/switchgear oil screenings, substation backup battery systems, and earth resistance. E D U C A T I ON

PhD. In Material Science and Engineering (G.P.A. 4.0/4.0) TUSKEGEE UNIVERSITY, TUSKEGEE AL MAY 2002 – MAY 2006

Relevant Courses: Electronic Material processing II, Special Topics in Advanced Semiconductor Devices, Microstructural Analysis, Physics of Material, Structure of Materials, Special Functions. Microelectronic Fabrication, Advanced Plasma Engineering, Technology CAD, VLSI Testing, VLSI Design.

Dissertation Title: Fabrication and Electrical Characterization of AlGaN/GaN Heterostructure Devices. M.S. in Electrical Engineering (G.P.A. 3.78/4.0) TUSKEGEE UNIVERSITY, TUSKEGEE AL AUGUST 2000 – AUGUST 2002

Relevant courses: CMOS Analog Integrated Circuit Design, CMOS Digital Integrated Circuit Design, Advanced Digital Design, Advanced Solid State Devices, Electronic Devices and Fabrication, Complex Variables, Partial Differential Equations, Probability and Random Variables, Computer Networks, Wireless communication, Optical Fiber Communications, Parallel Processing, C++ for Engineers.

M.S. in Electrical Engineering Thesis: Electrical Measurement of Recombination Lifetime in Blue Light Emitting Diodes along with Fabrication and Characterization of Sputtered Au, Cu and Cr Contacts on Semiconducting GaN Sample.

M.Sc. in Electrical Engineering BELARUSIAN NATIONAL TECHNICAL UNIVERSITY, MINSK, BELARUS SEPTEMBER 1988 – MAY 1993

Relevant courses: Power Generation, Transmission and Distribution, Protection and Control, Transient in Power Systems, Power Electronics, Electrical Machines, Automated Electrical Drives and Controls, Industrial and Municipal Power Supply, Installation of Industrial Electrical Equipment, Illumination and Lighting, Industrial Organization, Planning and Management.

M.Sc. in Electrical Engineering Design Project: Design of Electrical Power Supply to a Vegetable Product Industry.

R E V I EWE D PA P E R S

1. R. Nana, P. Gnanachchelvi, M. A. Awaah, M. H. Gowda, A. M. Kamto, Y.Wang, M. Park, and K. Das, Effect of deep- level states on current–voltage characteristics and electroluminescence of blue and UV light-emitting diodes, Phys. Status Solidi A 1-8, 2010.

2. M. Murthy, A. Kamto, M. A. Awaah, D. Wang, M. Park, F. J. Walker, and K.Das, “Electrical Characterization of Blue Light Emitting Diodes as a Function of Temperature”, pp. 251- 256 Mater. Res. Symp. Proc. Vol. 892. 2005. 3. M. A. Awaah, R. Nana and K. Das, “Electrical Measurement of Recombination of Lifetime in Blue Light Emitting Diodes” Mater. Res. Symp. Proc. Vol. 829. 2005.

4. M. A. Awaah, R. Nana and K. Das, “Electrical Characterization of GaN Based Blue Light Emitting Diodes” IEEE proceeding of Southeastern Conference 2005, pp 17-22, April 2005 5. M. A. Awaah, R. Nana and K. Das, “Analysis and Electrical Characterization of Blue Light Emitting Diodes” IEEE proceeding of the Thirty-Seventh Southeastern Symposium on System Theory, pp 73-77, March, 2005 6. H. P. Hall, M. A. Awaah, and K. Das, Deep-Level Dominated Rectifying Contacts for n-type GaN, Physica Status Solidi (a) 201, No. 3, 522 – 528 (2004) / DOI 10.1002/pssa.200306748. 7. H. Hall, M. Awaah, A. Kumah, and K. Das, “Ohmic and rectifying contacts to n and p-type GaN films”, pp. 813 – 818 Mater. Res. Symp. Proc. Vol. 743. 2003.

8. H. P. Hall, M. A. Awaah, and K. Das, Sputter-Deposited Metal Contacts for n-type GaN, Semiconductor Science and Technology, issue 2, Vol. 19 pp. 176 – 182, 2004.

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