DAT PHUNG

*** ******** ****** **.

San Jose, CA *5123

805-***-**** Cell

acux7h@r.postjobfree.com

Objective:

To obtain a position in Process/Manufacturing Engineer that will allow me to utilize my education, experiences, and personal skills.

Education:

● B.S. degree Candidate

San Jose State University, San Jose, CA

Industrial Technology, concentration in manufacturing; minor in business

● A.A. degree

Santa Barbara City College, Mechanical Drafting

Experience:

Flip-Chip Bonding Specialist/Process Engineer

Adecco onsite @Google

September 2014 to March 2016

● Involved in research and development of biomedical wearable device.

● Led engineer for assembly of ASIC, capacitors, and other microsystems chip-level components onto a variety of substrates using flip-chip and die-attach techniques.

● Designed and executed of DOE for new components, substrates, and/or materials used in bonding and assembly processes to verify a robust bonding strength and electrical connection.

● Improved flip-chip bonding in quality and quantity throughput.

● Managed and controlled incoming/outgoing chip inventory including logistics of shipping/receiving and communication with external vendors.

● Designed tooling/fixture and lab layout using Solidworks and AutoCad software.

● Used in-house fabrication tools to make custom test substrates for flip-chip bonding.

● Worked with silicon wafer and flexible substrates (PET).

● Experienced with lithography processes, electroplating, coating and etching.

● Solved several problems of the processes and significantly increased the yield.

● Familiarity with pick-n-place, profilometer, microscope, electroplating, dispensing, spray coater and ICP equipment.

Sr. Process Specialist/CAD Engineer

Broadcom Limited (Formerly Avago Technologies)

Jan. 2010 to Sep. 2014

● Generated PCB stencil file and SMT coordinate placement program using GC-PowerPlace software.

● Generated Bondmaster, Die layout, Package layout, Strip Layout and Land pattern drawings using Cadene SIP software and Autocad.

● Created and organized documents using Agile PLM software.

● Expert in Pick-n-Place and die sorting with reticle map and wafer map.

● Expert in epoxy die attach with different adhesive material.

● Expert in flip chip bonding, including Cu Pillar and Fbar.

● Experienced with laser marking machine.

● Expert in DPE for tape&reel machine

● Generated work procedures and equipment maintenant procedures.

● Designed tooling jigs and fixtures

● Supported design engineering team to build and to ensure a robust products.

● Worked with Datacon, reflow oven, paste printing, SMT, X-ray and dicing saw.

Manufacturing Engineer

Renco Encoders Inc., Goleta, CA (Subsidiary of Heidenhain GmbH)

2005-2009

● Planned, organized, maintained and commissioned production lines.

● Incorporated new processes and methods, improved existing operations.

● Resolved any complex problems involving tooling, fixtures, part manufacturing, and equipment utilization and production techniques.

● Designed products packaging, utilized Pro-E and MasterCam.

● Expert in die placement, flip chip bonding and pick –n-place.

● Worked with Datacon, Micron II, CMM measurement, CNC machine and tolerancing (GD &T)

CAD Designer

Kirby Morgan Diving Systems International,

Santa Barbara, CA

2002 -2005

● Involved with engineers team to design and build up a new Superlite Helmet and Full Mask products

● Created detail drawings and assembly drawings, utilized Pro-E, Mechanical Desktop, SolidWorks, AutoCad.

● Inspected technical parts for quality control, document control and ECO.

● Experienced with 3D printing.

● Experienced with silicon molding and die casting.

● Experienced with HAAS CNC Mill & Lathe setup, utilized MasterCam for programming.

Contract Engineer

New United Motor Manufacturing Inc.,

Fremont, CA

2000- 2002

● Worked on project that involved mechanical design of tooling, jigs, fixtures and dollies for the new Model launch project.

● Designed ergonomic tooling to assist team members in building vehicles.

● Calibrated torque wrenches and program torque monitors.

● Coordinated a project groups, redesigned plant layout, installed equipment.

SKILLS:

● Proficient knowledge of geometric dimensioning and tolerancing.

● Mechanical Desktop: 6 years

● Pro/E Wildfire: 6 years

● Solidworks: 3 years

● Datacon/Finetech flip-chip bonding: 10+ years

● CMM and CNC : 4 years

● Fluent in English and Vietnamese.

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