Varinder Dhami

***** **** ******; Fremont, CA ***39

510-***-****; acuv3h@r.postjobfree.com

OVERVIEW

●Over 15 years of experience in high technology electro mechanical and manufacturing assembly

●Flexible, functional, and punctual as a high volume quality worker

●Detail oriented and always willing to work overtime

●Able to use all types of electromechanical tools

OBJECTIVE

Seeking a dynamic position where I would have adequate opportunity to contribute my extensive experience, talent; and assertiveness can be most effectively and profitably utilized.

EXPERIENCE

Western Digital, Device Manufacturing Tech 2008 - December 2015

Worked in the FIB (Focused Ion Beam) area:

●Ran the 6-in/8-in wafers in WAFER FAB by using the following Metrology tools

a.ZYGO Unifire tools - To measure the film thickness per process

b.MPG (MetaPULSE-G) tools

-To measure the metal film thickness on device and monitor wafers

c.AFM (Atomic Force Microscope) tools - both auto and manual tools

-To measure the step height of each layer

-To measure the fencing height

-To measure the surface roughness

d.OCD (Optical Critical Dimensions)

-Thin film thickness reflectance critical dimensions

●Checked to make sure the data for all the wafers measured transferred successfully to the SPC (Statistical Process Control) charts.

●Followed the Process SPECs and the OCAPs (Out of Control Action Plans) if the wafers had SPC warnings.

●Ran the Working Standard wafers on the AFM, ZYGO, and the MPG tools during my shift. Checked to make sure the Working Standard data transferred to the SPC charts. If there were SPC warnings, followed our OCAPs.

●On the manual AFM tool, when the AFM scans did not come out good, changed the AFM tip, aligned the laser and located the tip.

●Duties included visual inspection in clean room environment, identifying accept and reject

●Criteria per customer specification. (6 inch / 8 inch substrate)

Medical Device Assembler, Boston Scientific; Fremont, CA 2005-2008

●Assembly of inner and outer layer of Neurovascular catheter.

●Lamination of outer and inner layer,

●Inspection of inner and outer layer of Neurovascular catheters using a microscope.

Medical Device Assembler/Laser Machine Operator, NDC; Fremont, CA 2003-2005

●Performed inspection of stents accurately as per quality control procedures, visual inspection of lot, manually debur and deslug, usage of mandrel to test stent

●Utilized heat treatment to test stent in salt pot, cleansed further in sulfuric acid, completed polishing of stent,

●Tested the stent under various heat temperatures to check diameter and completed another round of visual inspection under a microscope to meet various industry standards

Operation’s Associate- Elo Touch Systems (Tyco Electronics), Fremont, CA 1998-2003

●Sub assembly of production

●Product inspection

●Testing linearity and audit

Electromechanical Test Operator-Smart Modular, Fremont, CA 1993-1998

●Sub assembly of mother board

●Testing Polaris, Saturn, 3U Jupiter, Vicker, cyclone, Ethernet, DE520, DSC

●Functional to final testing

EDUCATION

Graduate of Government Girls High School Kashipur - UP, India

Government Girls College Kashipur - UP, India

LANGUAGES - English, Hindi, Punjabi

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