Jean (Lou) Jarvis

** ******** ****.

Owego, NY **827

607-***-****

607-***-****

acukci@r.postjobfree.com

Work Experience:

Owego Treadway Inn, Owego NY March 2013 – Present

Front Desk Clerk

Responsibilities:

Customer service care providing an enjoyable and quality atmosphere to customers staying at our Hotel.

Taking reservations, room scheduling, verification of customer credit cards, checking in and checking out of customers.

Responsible for taking payment for Banquets and Conference rooms.

Ensuring all charges, cash, gift certificates, and checks are put in the system correctly for the night auditor.

Shift deposits.

Best Buy Warehouse, Nichols NY October 2012 – December 2012

Packer

Responsibilities:

Seasonal Packaging of merchandise for upcoming Christmas Holiday.

Pulling merchandise from conveyor lines.

Preparing correct size shipping containers, amount of packing material, and packaging merchandise.

Double checking labeling to invoice and placing correctly for bar code scanner.

NanoMas Technologies, Endicott, NY June 2011 – March 2012

Production Technician

Responsibilities:

Perform synthesis of metal nanoparticles in a chemical reactor.

Remove solvent using a rotovap.

Harvest the metal nanoparticles through filtration.

Prepare ink samples from harvested nanoparticles.

Perform quality control on samples using resistivity testing and profilometry.

Sanmina-SCI, Owego, NY 1986 – 2011

Laboratory Technician IV 2009 – 2011

Responsibilities:

Perform analysis on all chemical manufacturing processes, including: sample collection, perform analysis (including AA, UV/VIS and titration), enter results, notify Process Engineers of out-of-control parameters.

Prepare reagents, reference and standard solutions required for analysis.

Monitor lab supplies and place orders as required.

Automatic dosing pump calibration for plating processes.

Interact with chemical vendors for analytical procedures implementation on new processes.

Manufacturing Technician 2004 – 2009

Responsibilities:

Meet customer quality requirements 100%.

Testing and qualification of plating chemistry (cost savings).

Track and expedite New Product Introduction (NPI) product.

Initiate timelines and ensure all processes, movement, and movement issues are resolved.

Produce and evaluate testing vehicles for NPI product in all operations.

Initiate introduction to high technology processes and materials...i.e. sequential lamination, tri-plate, via fill, selective gold LGA using different materials such as polyimide, Rogers, and Arlon.

Process Technician IV 1997 – 2004

Responsibilities:

Buried Via Cores:

Tooling development.

Materials testing.

Vertical plating options, including rack design.

Produce scaling factors for various dielectrics (core thicknesses).

Nodule removal procedure.

Monitor core alignment through plating line using clipped corners.

Monitor core yields and working on improvement.

Blind Vias:

Work on plating/laser drilling databases for parameters.

Implement spacing of blind via panels on the desmear and electroless copper line for qualification.

Implement cross sectioning documentation for blind drill approval.

Tooling, using blinds as targets for registration alignment.

Subcomposites:

Work on tooling, plating, and process routing.

Create coupon sectioning to prevent unnecessary scrap.

Operator presentations for better understanding of subcomposites, blinds, and buried vias.

Training of subcomposite routing.

Create a process for removal of resin in the subcomposite for accurate registration.

Equipment:

Bring in second Automatic Phototool Registration (APR) unit for soldermask artwork alignment.

Upgrade unit, modify the punch for APR, and revise specifications.

Work on polarization filters as a better way to read blind targets.

Finish paper work and sign offs (green tag) for new outer layer multiline punch.

Qualify punch through Mitutoyo and punch locations sent from Multiline.

Projects:

Qualify the Direct Metallization Horizontal Copper Plating Line (HP).

Technical support for HP capacity.

Perform study of different prepreg such as -2lrc, -7, and -6 fast cure.

Perform peel strength testing and data reporting.

Set up test vehicles for sister plants for troubleshooting purposes.

Evaluate defect levels (ppm).

Laboratory Technician II ` 1997 – 1990

Responsibilities:

Train myself and others how to do failure analysis on printed circuit boards, assembled and non assembled.

Develop customer specification system to combined customer specifications and in house cross section results.

Support all customers testing including quality cross sections, impedance testing, surface insulation resistance (SIR) and solderability testing.

Test gold line such as gold purities and gold hardness, etc…

Ionic contamination calibrations.

Electrical Test Operator 1986 – 1990

Responsibilities:

Learn Wang computer system.

Perform electrical test on printed circuit boards, on all available testers (all now out dated).

Perform hi–pot testing on required customers.

Failure analysis, pinpointing/tracing out defects and reworking shorts and opens.

Education:

Broome Community College Binghamton New York

AAS degree in Chemical Engineering Technology

Alfred University Alfred, New York

Dual Major in Chemistry and Environmental Science

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