SOMA S. PEROOLY

***** ******** ***** ******, ** *8188 (h) 734-***-**** (c) 734-***-**** acu4a0@r.postjobfree.com . US Citizen

Highly experienced Materials Engineer with broad, in-depth expertise in materials processing and characterization, materials testing, metrology, product development and sales.

Adept at proposing and delivering high quality, complex technical projects on time and under budget.

Keen analyst with proficiency at identifying critical issues and providing quick resolutions.

Demonstrated capability for providing Process Development and leadership to top-quality teams.

Proven ability to effectively manage all aspects of labs and clean rooms. Identified and Installed equipments.

Solid experience in Metallurgy, Non Destructive Testing (NDT), Packaging and Bonding development (including Polymers),Adhesives and Curing, Reliability Testing, Gage R &R and DOE.

Good experience in Sensors, Non Contact and Contact Metrology including Strain Gauges.

Identified heater and Plastic substrate materials for product development to ensure adhesion and reliability. Set up Packaging lab.

Proficient at analyzing and interpreting microscopic (including SEM and EDS), X-ray diffraction, crystallographic, and spectroscopic data on bulk materials and thin films. Failure analysis

Experienced in PVD, E-beam evaporation, DC and RF Sputtering, UHV, Plasma Spray, Electro Polishing, Electrophoretic Deposition, Spin Coating, Spray Pyrolysis, Sol-gel coating and Laser Ablation.

NDT and Stress measurements of Automotive and Aerospace components. Heat treatments

Good knowledge of Glass, Ceramics,Plastics, Composites, and Piezoelectrics . Prepared Glassy Phase by melt quenching. Studied recrystallization.

Good Application Engineering,Sales and Marketing experience, Identified Potential Customers and Increased Sales.

Demonstrations of measurement systems to customers and potential customers. Leads generated total Sales above $1.5M.

Determined to provide significant contributions to both short-and long-term organizational goals

Developed some of the key materials processing and packaging development for Handy Lab Inc, Ann Arbor which was acquired for $275M.

PROFESSIONAL SUMMARY

Precitec (OEM) – Wixom, MI 2014 to 2015 (19 mos)

Technical Sales/Application Engineer

Application Engineering Support in Product Development and Manufacturing, On site Demo of Non Contact Optical and IR Metrology Sensors and Products of Global Manufacturer. Performed measurements on Glass and Automotive parts including Plastics, Technical Presentation and Reports. Evaluated ultra fast 3D surface scanning of metallic surfaces. Total sales above 1.5M $. (Customers included NIST, Corning, Emhart, Philips, Mercedes Benz, Westinghouse and MIT)

ISSYS Inc - Ypsilanti, MI 2012 to 2013

MEMS Scientist/ Process Engineer

Production and Process Development, Bonding, Wet Processing, Chemical Etching, Metallic layer coatings ( Al, Ti, Cr etc), PVD and E-Beam Evaporation, Plasma Etching, Metrology and Annealing as per customer requirements. Investigation of Failure process.

Optimized the in house Plasma tools to reduce production cost.

IMRA America ( AISIN /Toyota Automotive )-- Ann Arbor, MI 2011 to 2012

Senior Materials Engineer

Developed CIS and CZTS Solar cell films and Coatings employing Nanotechnology, Laser ablation, EPD, R.F Sputtering, KCN etching and Wet Chemistry. Characterization by X-ray, SEM, EDS, Dektak. Optimized the process of Thin Film depositions ( Metallic and Oxides) and Annealing. Doubled the efficiency by innovative methods. Installed a new Sulfurization furnace and H2S Scrubber. Assisted other team members in the process development.

UNIVERSITY OF MICHIGAN - MECHANICAL ENGINEERING DEPARTMENT (Additive Manufacturing and Process Lab) and Startup Dearborn, MI 2009 to 2011

Associate Research Scientist

Developed SrAl2O4:(Eu,Dy) Phosphor coatings and films (First time in the world by Thermal Spray) and compared the Microstructural ( XRD, EDS), Tensile Testing and Fluorescent properties.

Studied the effect of different Polymer binders on thick film adhesion on Mo, Al and SS parts..

Invented a new method of Phosphor synthesis by drastically reducing the synthesis temperature.

PROTO MANUFACTURING, INC. ( an OEM company) – Ypsilanti, MI 2007 to 2009

Senior Materials and Application Engineer / Technical consultant

Led the applied research and development of materials and technology development.

Provided significant contributions to sales / marketing of products in emerging domestic and international markets (including India). Leads and sales $1M.

Conducted NDT and residual stress ( Tensile and Compressive) measurements by X-ray on automotive, aerospace, and nickel- based Super alloy components and Electropolishing as per ASTM documents.

Performed stress measurements Shot peened, Welded, Cast and Forged components. Used strain gauges Conducted Fatigue Tests on Al samples.

Prepared measurement reports and project progress reports.

Supervised on-site measurements at client locations (including the U.S. Mint).

Managed vendor relationships to procure samples for stress measurements.

WAYNE STATE UNIVERSITY – ELECTRICAL ENGINEERING DEPARTMENT - Detroit, MI 2004 to 2006

Senior Materials Development Engineer(Smart Sensors / Integrated Microsystems)

Directed R&D and production ( $ 8M Project ) of thin film depositions of Piezoelectric Aluminum Nitride by low temperature Plasma Source Molecular Beam Epitaxy (PSMBE) in Ultra High Vacuum.

Grew thick films of Piezo Electric AlN (up to four microns) by applying a buffer-layer technique and multi-layer depositions on various substrates for fabricating SAW based MEMS devices.

Performed Insitu monitoring by RHEED, Interferometry, Pyrometry, and Mass Spectrometer.

Determined Modulus of composite coatings by Laser Vibrometer.

Collaborated on project to evaluate modulus of AlN and surface conditions of Welded joints.

Developed Plastic Microfluidic cells for Biosensor application ( Army Project).

Provided chemical safety management and training to students and technicians.

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Lab Manager

Oversaw lab with multiple vacuum deposition systems, including PSMBE, RF Sputtering.

Coordinated and maintained various UHV chamber depositions.

Supervised activities of 8 students and technicians; Advised students on thin film depositions and device development. Interacted with multi-disciplinary teams, including those from Medical School.

Implemented process monitoring experiments and generated run-sheets for production and quality testing. Conducted DOE.

Identified challenges in AlN production and quality( XRD) for the development of SAW devices.

Conducted meetings on materials development and updated status.

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HANDY LAB, INC. (a BioMEMS company) - Ann Arbor, MI 2001 to 2004

Process Lead / Microfabrication Engineer / Microfluidic Device Engineer

Responsibilities included microelectronic fabrication, photo lithography (Karl Suss and EV), mask-making, lift-off, coating (metals and dielectric) by E-beam and magnetron sputtering on Si and Glass, LPCVD and PECVD of SiO2, plasma, and wet etching.

Coordinated with team to determine and facilitate objectives of prototype chip development; process integration, managed project costs, schedules, and quality. Provided significant contributions to achieve on-time completion and identified vendors with GMP for production.

Identified heater and plastic substrate materials for product development to ensure adhesion and reliability. Selected Adhesisves and optimized Curing

Bonded plastic and quartz substrates, developed screen printing with conductive pastes, and conducted Flip Chip bonding with In Solders.

Quickly and efficiently resolved materials and packaging issues.

Conducted failure analysis and surface characterization.

Oversaw thermal imaging and optical measurements by SP and Nanospec.

Led micro fabrication process for Handy Lab devices at University of Michigan clean room.

Increased device yield to virtually 100% by re-engineering and improving processes.

Solved several critical material challenges and reliability issues.

PURDUE UNIVERSITY - West Lafayette, IN 1996 to 1999

Research Associate

Established well-equipped synthesis facility for metallic oxides and chalcogenides; facility included conventional solid-state synthesis, CVD, single crystal growth (in Fused Quartz tubes in Vacuum), and specialty annealing techniques in Vacuum and custom ambient.

Conducted High temperature processing of Ni, Cu, Se, Te and Ir powders; performed chemical and mechanical polishing of single crystals, and made electrical and magnetic measurements.

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EDUCATION & PROFESSIONAL DEVELOPMENT

Ph.D. in Material Science Indian Institute of Science - Bangalore, India

Major: Structural and Electronic properties of High Tc Cuprates

M.S. Material Science and Engineering Indian Institute of Technology – Varanasi.

Major: Mechanical properties of Alumina-Zirconia ceramic composites

M.S. Solid State Physics Benares Hindu University - India

Major: Structural Verification of SiC by optical density measurements and X-ray diffraction)

HONORS AND AWARDS

National Merit Scholarship throughout high school and college

Council of Scientific and Industrial Research Fellowship during graduate studies

Among top 5% in India in Engineering Graduate Aptitude Test

ASSOCIATIONS & AFFILIATIONS

Materials Research Society

Reviewer of Journal of Solid State Chemistry (Academic Press - San Diego)

Other Key Qualifications / Keyword Summary

Thin Films Semiconductor Microfabrication Wet Chemistry Techniques and Coatings Ultra High Vacuum III-V Nitrides Optical Coatings Mechanical Properties Non-Destructive Testing (NDT) X-ray Diffraction Metrology, Electrical, and Thermoelectrical Measurements Solid State Chemistry Ceramics MEMS BioMEMS Bonding and Packaging Development (Including Polymers) Material Synthesis Facility Development U-V Radiation, and Thermal Curing of Epoxies and Polymers Packaging and Bonding Development with Nonconductive / Conductive adhesives, Brazing and Solders High-strength ceramic Bonding for Alumina-Zirconia Joining Low-temp Pb-free solders for Hermetic Sealing Electronic Doping Chemical Stability and Mechanical Properties of Complex Inorganic Oxides Metal Alloys and Bi-based Glasses Micro Cracking by Acoustic Emission Technique Residual Stress Fracture Toughness Strain Field Measurement Hardness Measurements Micro-Indentation Heat Capacity Measurement of Metallic Oxides and Single Crystals Photolithography, Wet Chemical, and Plasma Etching SEM (JEOL 35CF) EDS Optical Microscopy Metrology of Multilayer Oxide Films with FilmTek 4000 and Nanospec X-ray Diffractometers (Siemens D-500, JEOL 8P, Philips PW1150, Proto iXRD, Rigaku and STOE) in High and Low temperature Modes.

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