VIKAS JANGRA
(C) +91-962******* acthbc@r.postjobfree.com
Professional summary
Design engineer who has worked on several new products in semiconductor equipment manufacturing industry, including the Multi-wafer ALD (Atomic Layer Deposition) systems and Single wafer metal-ALD systems recognized for industry excellence.
Skills
Mechanical engineering Vaccum System Design
Computer-Aided Design (CAD) Atomic Layer Deposition Knowledge
Technical problem-solving Schematics interpretation and design Application
Manufacturing systems integration Pneumatics
Component functions and testing requirements
Work history
Mechanical Design Engineer-Senior Jul 2011 - Current
Applied Materials India Pvt. Ltd. Bangalore
4years and 7 months of experience in identifying mechanical design requirements and developing solutions.
Designed and optimized mechanical components for ALD and CVD Vacuum Chambers.
Handled on different modules ranging from Chemical Delivery systems, Process kits, support frames, Injectors,
Showerheads, Susceptors/Heaters
Read and interpreted technical drawings, schematics, and computer-generated simulation reports.
Researched customer design proposals, specifications, and manuals to evaluate the feasibility, cost, and
maintenance requirements of designs.
Developed communication documentation to help convey key design aspects to clients.
Developed concept layout and design of ALD systems from product specifications using Unigraphics NX.
Read and interpreted blueprints and created engineering drawings and sketches.
Managed continuous improvement projects.
Education
B.E. (Hons.): Mechanical Engineering 2011
BITS Pilani K. K. Birla Goa Campus Goa
Accomplishments
Patent filed: Atomic Layer deposition Chamber with thermal Lid.
Project Development
Collaborating with team of Design Engineers, EC engineers & NPME in the Drawing error reduction project which
focus on reducing producibility error made during drafting.
Currently responsible for handling multiple customer configurations on chemical delivery system based on
different customer requirement in multi-wafer ALD platform.
Design
Responsible for design for RPS on Metal-ALD chambers
Responsible for design of low-cost Hotbox reducing the cost by 30%
Projects
1 - CCDS design for multiple Configurations in Olympia.
Duration: Jan 2014 - Present
Team Size: 3
Role Played: Mechanical Design Engineer - Senior
Skills Used: UG NX, Machine Design, Schematic Interpretation, Pneumatic systems
On the daily basis, Multi-wafer ALD platform handles different customers who test variety of precursors on system with
different temperature and pressure conditions. Each Project under this on-going assignment includes understanding of
chemical delivery schematic and designing the correct system based on their requirement put down in schematics.
2 - Drawing Error Reduction
Duration: Dec 2015 - Present
Team: 10
Role Played: Design Engineer
Skill Used: Drafting Standard and Drafting Process knowledge
This project is the collaboration of different teams coming together to bring down the whole error rate on drawings
going to release. It is a six-sigma project which focus on finding the major root causes of errors in engineering
drawings and then tackling those causes to improve the error rate on drawings. My responsibilities as a design
engineer is to actively participate in debates and give suggestion for drawing error analysis. I am also responsible for
organizing brown bag session within my ALD team to get the ideas to make sure there are less chances of making
error in drawings.
3 - HotBox Cost reduction project
Duration Jan 2015 - Mar 2015
Role Played: Design engineer
Hot box is a preinstalled assembly which keeps the gasline heated. Project was assigned to come up with different
heating mechanism which cost at least 30% lesser. In two months, from idea generation to procurement, I have
handled the project independently. New hardware shows better thermal budget with cost reduction more than 30 %.
4 - RPS (Remote plasma source) clean integration on ALD chamber
Main Objective of the project was to design the integration assembly to facilitate the plasma coming from outside
source to Vacuum chamber. Challenge here was to design the components keeping the thermal budget of assembly
lowest and selecting the material which is very easily available (AL 6061-T6 & SST was used.) One Patent has been
filed by the team for the full chamber.
Additional information
Other Independent projects I am currently working on:
Internet of things(IoT): Small smart home projects using Raspberry Pi 2
Searchable Database of Olympia modules to handle different configurations
Learning Javascript, yet to start on python.