David Snow

**** *********** ** #***

Houston, Tx. 77077

805-***-****

acsnff@r.postjobfree.com

Summary

Semiconductor IC Product Engineer / Manager with broad product exposure (RFIC, Analog, Digital, Mixed Signal, Optical, Military, and Medical applications). Experienced in all facets of the IC Product Engineering role, and responsibilities in the areas of: 1. NPI (New Product Introduction for release to manufacturing), and, 2. Cost/Yield management of production released products. Specific duties and responsibilities for each area are indicated below: NPI

Characterization – Char plan, split-lot fab/assy., ATE testing/data collection, analyze data

(ie. Dataconductor), identify potential design concerns, generate a parametric CPK margin report, generate test limits, publish char report, and chair char meeting. Project Management – Maintain weekly project team meetings, provide and update project schedules (mpp).

Reliability Qualification – Qual plan (per JEDEC). Manage qual sample assy. ATE testing of qual sublots (all readpoints) and manage data files. Htol/Hast board design, engage vendors for qual testing. Schedule /oversee qual testing. Determine and document qual results (FIT rate, MTTF, ESD level, etc.). Perform F/A as required. Publish qual reports.

Package/Assembly – Generate documentation (bond diagrams, marking specs, ROHS, etc). Manage pre-prod assembly builds and product allocation to meet marketing and engineering sample needs and provide parts for qual and char testing. Support Test Eng. – ATE test development (provide prod/char/qual test limits and data capture needs).

Production Product Management

Yield Management – By importing data from WAT, wafer probe, and final test into a data analysis tool (ie. DataConductor) enabling quick analysis of parametric or attributes data. Real time yield tracking as well as bin analysis, wafer maps, parametric analysis, correlation relationships, and other statistical views provide useful insight in quickly identifying yield issues and their root cause.

Yield Issue Indicators – SPC based yield tracking provides early detection of manufacturing or product quality issues.

COGS (Cost of Goods) – Pareto analysis for cost reduction of production released products. Production Flow Enhancement – Test time reduction, dual/quad site handlers, etc. Qual/Rel Monitors – Periodic reliability checks of production product. To help gage the depth of my experienced based knowledge of the IC Product Engineering function I can provide reference examples of the processes, procedures, plans, and reports referenced above. I also can provide a great example of a production yield issue that was identified early by the effective use of data analysis. I am proficient with DataConductor

(statistical analysis tool), MS Project, Excel, and other MS Office Tools. David Snow

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Experience

Sr. Product Engineer

Generation 2 Materials Technology (Current Contract Position) Sept 2014 – current Product design and development of electromagnetic sensors and imaging equipment for analyzing and detecting metallurgy integrity of piping and metal structures used in the oil/gas and related industries. (Houston, Tx.)

Engineering Office Manager

Optimation (temp position) Mar 2014 – Aug 2014

Engineering Office Management and Project Management for 6 man office for developing software (National Instruments LabView) based system solutions for the oil/gas and medical device industries. (Houston, Tx.)

Sr. Product Engineer

I/O Semiconductor (temp contract) Dec 2011 – Mar 2012 Temp assignment to provide the component/material sourcing, BOM ordering, vendor management, mechanical assembly, and electrical wiring for a custom designed RF Tester. (for mating to a prober to auto test a RF Switch IC.) (5 testers built). (San Diego, Ca.) Engineering Manager for Magnetic Solutions Procurement Solarflare Communications (Contract Position) Oct 2007 – Apr 2011 Managed the procurement and vendor supply chain of magnetic components used in Solarflare's 10G Base-T System Developments. Provided technical liaison and lab data to mag vendors in support of their new (and design modification) efforts for supplying SF’s 10G system performance requirements. (Irvine, Ca.)

Principal Product Engineer

Staccato Communications Jan 2006 – July 2007

New product development for RFIC's. Duties included: Vendor engagement, planning, and budgeting for prototype/production manufacture of IC based SIP modules/WLCSP products.

Product characterization for design debug, production release requirements, reports, datasheet compliance, and process margin capability.

Product reliability qualification (planning, budgeting, vendor management, BI schematics, FA, test data management, and publish qual reports) for release to production. Work with Test Eng. to resolve test issues, enhance test flows and test time, and establish limits for production release test solutions.

Create and maintain detailed project schedules for product development activities from tape out to production release.

Identifying issues and driving corrective actions related to yield, reliability, quality, cost improvements, and production issues. Also resolve operations issues with fab foundries, module and WLCSP package assembly vendors, and wafer test vendor. (San Diego, Ca.) Operations Manager

Motia Communications (Temp Contract Position) Sept 2005 – Jan 2006 Managed the Engineering Operations Dept. in support of Motia's RF IC product development projects. Duties included IC foundry interface/management for tape-in activities and David Snow

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coordinating product shuttle actions. I also managed the Product and Test Engineering Dept. activities to provide ATE and Bench test solutions, IC characterizations, Qual/Rel compliance testing, Yield and Mfg. Cost enhancements, and lead the Project Management team towards the goal of RTM (Release to Manufacturing) for Motia's RF IC product designs. (Pasadena, Ca.) Sr. RFIC Product Engineer

RF Magic (Contract Position) June 2004 – Aug 2005

Product Engineering duties in support of RF IC new product developments and cost management activities for released products. Performed split lot characterization and reliability quals (testing, data collection and analysis, char and qual reports) for RF5000 product release to full production. Managed the yield/cost of products in mid-volume production by utilizing real time data

(offshore final test yields, wafer probe yields and parametric data/maps, and PCM data) and Dataconductor (data analysis tool) to determine yield trends and provide an early warning of production or product quality issues. (San Diego, Ca.) Sr. RFIC Product Engineer

Primarion May 2003 – May 2004

IC Product Engineering duties for new product development and RTP of Primarion's power management IC's for use in the computer electronics market. Duties included product characterizations/reports, planning and coordinating reliability qualification testing/reports, working with test engineering to improve test capability thru statistical data analysis, and leading the project management team towards the goal of RTP (release to production). (Torrance, Ca.) Director of Product Engineering / Operations

Intel / Cognet April 2002 – May 2003

Managed the back-end operations in support of new IC product developments for Cognet's (a startup company acquired by Intel in 2002) CMOS based 10G Optical Interface IC's (OE products). Managed the operations activities by coordinating foundry tape-ins and shuttle activities of new IC designs. I also directed the validation lab activities and developed policies and requirements for lab operation regarding new product validation, testing, and reports. I directed the product engineering group's activities of characterization, coordinated Reliability Qual plans/activities, yield/cost enhancements, and incorporated a document control system.

(Calabasas, Ca.)

Education

University of Florida

MBA (Executive Program), Business Administration 1982 – 1983 University of Florida / Harris Corporate Program in Business Administration Purdue University

BSEE, Electrical Engineering 1977 – 1979

Groups and Associations:

US Navy AE2 VA-34 (Vietnam Veteran)

IEEE Member since 1991

Brevard Community College (Fla.), Adjunct Faculty Math Dept. (1984-1987) Brazosport Community College (Tx.), Adjunct Faculty Electronics Dept. (1993-1995)

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