BERNARDO BESARIO SALIBAY

Home Address: ***** * **** ***** **. Phone: 602-***-****

Queen Creek AZ 85142-3298

E-mail Address:acs685@r.postjobfree.com

SKILLS

ŸChemical Analysis: Gravimetric; Volumetric, Colorimetric; Qualitative and Quantitative

ŸDetermination of particle size distribution, average surface area using Reynold’s Particle Analyzer

ŸPreparation of inorganic slurry/pastes using Hobart mixer then Ross Three Roll Mill Grinder

ŸDeveloped Efficient / Carbon Free and Cost Reduced Polymer/Solvent Systems as Binders

ŸCalibration of flame type Atomic Absorption/flame less Molecular,(UV/VISIBLE) Spectrometers

ŸSpin/Roller Coating Photo resist on Silicon Wafers/Thin Boro & Sodium Silicate Glasses

ŸPhoto lithography/Developing/Etching/Doping

ŸChemical Vapor Deposition of Al, Au, Ni, Ag on Silicon Wafers/Boro & Sodium Silicate Glasses

ŸDocumentation of the Materials Preparation/ Specifications/Safety Data Sheets

ŸStatistical Process Control/Design of Experiments/ Total Quality Management

ŸMicrosoft Words/Excel/Templates/ JMP/Windows NT /Materials LabWiz

EMPLOYMENT HISTORY

Advanced Circuits, Inc. Chemist

229S Clark Dr. (2009- Present)

Tempe, AZ 85281

ŸResponsible for the in coming qualification of the solder masking paste in terms of its % solids, consistency of flow when it squeegees through a one mil opening, particle size distribution using Tyler sieve mess, the average surface density using Reynold Particle analyzer.

ŸDeveloped and sustain the availability of the 1.0 and 6.0 microns alumina slurry used as a polishing agent of the epoxy mounted micro section of the circuitry of the printed circuit board for the inspection of defects under high powered microscope.

ŸResponsible to sustain the operating conditions of the plating line to include copper deposition into the micro thru-holes of the boards, plating & etching to effectuate the desired circuitry such as; pH, temperature, relative density, atomic/molecular concentrations using analytical techniques flame Atomic (Perkin-Elmer),& flame less Molecular (Genesys 5) Spectrometers & Refraction meters.

ŸResponsible for the periodic calibrations of the Omega Meter Cleanliness Test of the PCB, Perkin Elmer Atomic, flame type and Genesys molecular, flame less Spectrometers, volumetric flow rates of all the components in the electro- less Cu/Ni/Au plating baths, the brighteners/wetters/levelers in each of the Cu electroplating baths..

ŸResponsible for testing hardness, % moisture, tensile strength & thickness of all in-coming fiber

glass, epoxy and polyimide laminates.

ŸSustain the formulations and standardizations of the in house prepared titrating solutions instead of

Ÿ buying for immediate availability, better traceability and low cost.

ŸSustain a low cost, more efficient means of recycling high cost maintenance electro less Ni plating solutions which saves the company approximately $12,225.00 annually.

ŸContinue finding a low cost, efficient and environmentally friendly chemicals alternatives without compromising quality PCB in conformance with the OSHA regulations and the company’s goal.

ŸDocumentations of the material specifications, safety data sheets and manufacturing procedures concurred and approved by all the department managers involved.

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ŸResponsible for the up dating SPC charts, and recommend operating ranges of the parameters based upon the computed Cps and Cpks.

Protek Devices Process Engineer/Chemist

2929S Fairlane (2005 - 2009)

Tempe, AZ 85282

ŸDeveloped the electro less Ni and Au plating process as a means of depositing low resistive bias Ni and Au interconnected arrays of integrated circuits on silicon wafers.

ŸMaintained the operating conditions of the bath by measuring metallic concentrations, pH, and chelators and made additions before turning the line to Production.

ŸDid the in coming qualifications of the boric acid and phosphorus pent oxide by determining the particle size distribution be 2.00 + 0.05 and purity be 99.5 + 0.4% for they are used as high energy ions doping materials in the manufacture of integrated circuits.

ŸDeveloped a low firing temperature, low dielectric constant, and conductive Ag filled thick film composites used as bumps, and reduced direct material cost by 13.00%.

ŸSustained and met production schedule of printed either Pb or Ag filled bumps on arrays of IC patterns on 7”x7” oxides seeded silicon wafers.

ŸSeeded 11,000+500 dioxide on 7”x7”silicon wafers in a controlled high temperature crystal furnace by introduction of water vapor and dry nitrogen.

ŸSustained the production of array of chips of coated silicon wafers and sputtered conductive thin layers Al, Au, Ag, Ni interconnects of the circuitry by repeated application of photo lithography.

ŸDid the implantation of high energy ions of either Boron or Phosphorus on the patterned wafer to create a robust and electrically conductive region.

ŸInspected visually chips patterned silicon wafers for voids, blisters, shorts, haloing, over & under etched, & poor registrations, and tested electrical properties using 4-point probe.

ŸReplaced high cost electro less Ni and Au plating baths with low cost by eliminating Palladium as a catalyst with Ruthenium developed by McDermid, thus realized reduction time and chemical costs.

ŸDocumented material data and standard operating sheets of all the in house developed materials.

ŸUsed SPC as means to monitor periodically operating parameters to establish a working process.

Ÿ Process Controls such as Cps & Cpks charts & materials specifications & data sheets were up dated at all times as mandated by ISO guidelines.

EDUCATION & AWARDS

ŸBS Physics, University of San Carlos, Cebu City, Philippines Graduated with Honors- Cum Laude. Top 1% in the College of Arts & Sciences

ŸBS Chemical Engineering, University of San Carlos, Cebu City, Philippines

ŸTaken Advanced Ceramics & Materials Film Characterization Courses at Arizona State University

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