PRAVEEN K SEKAR

acr1hc@r.postjobfree.com 206-***-****

Masters graduate with experience in semiconductor devices based processing tools and techniques. “Hands on clean room processing experience with Washington Nanofabrication Facility (UW NNIN) and Center for Nanoscale Science and Engineering (CeNSE), Kentucky”

EDUCATION

* Master of Science in Mechanical Engineering (MEMS thesis)

University of Washington –Seattle, 2012-14

GPA - Coursework : 3.5, Research 4.0.

* Bachelor of Engineering in Mechanical

Indian Institute of Information Technology - Chennai, 2008-12

CGPA - 8.53/10.

Relevant experience : Clean room protocols, equipment maintenance, Mechanical/Thermal analysis of materials, Layout design, MEMS sensors validation, ANOVA, FEA, XRD, SEM .

Relevant coursework: Electronics packaging, Nano devices fabrication, MEMS, Material characterization, Advanced manufacturing techniques, Applied thermal engineering, Product life cycle management, FIB lift out, SPC, Electrical circuits and connectors, FMEA, PCB.

PROFESSIONAL EXPERIENCE

* Electrical Engineer Intern (SEM), Science Tomorrow LLC, Lexington KY (March’15 – May'15)

- Develop a prototype for a novel PIN diode based electron detector system for scanning electron microscope (SEM).

- Layout design for a 0.8 micron technology ASIC device.

* Research Technology Assistant – Center for MEMS research, UW (July’ 14 – Feb ‘ 15)

- Designed and fabricated a micro-fluidic PDMS chamber for single cell study in thermal cryopreservation and drug delivery.

- Mentored two undergraduate students on micro-fabrication tools and techniques with UW NNIN.

* Research Assistant- Center for MEMS research, (UW) - Master thesis (Sept’12 –June’14)

- Designed and fabricated a novel MEMS based thermal sensor for thermal conductivity measurement of semi-rigid samples and fluids with application in a variety of fields such as electronic cooling, HVAC, cryopreservation and cryosurgery.

- Characterized the sensors and standardized the procedure for conductivity measurement of any new semi-rigid or aqueous materials.

* Noise, Vibration and Harshness (NVH) Testing Intern- Mann and Hummel Filter (June –Aug’11)

- Modeled an experimental technique for impedance calculation of air-intake filters in heavy automotive engines using strategically positioned sensors.

PUBLICATIONS

* ‘High accuracy thermal conductivity determination of semi-rigid biological tissues using a micro-fabricated thermal sensor’- Journal of Scientific reports, Nature publication, 10377(5), 2015.

* ‘Measurement of thermal conductivity of fluids using single and dual wire transient technique’, Journal of Measurement, Elsevier publication, 46 (8), 2013.

* 'Experimental investigation on thermal conductivity enhancement of Copper (II) oxide - DI water nano-fluids', Journal of Engineering thermo-physics, 23(4), 2014.

SKILLS

* Instrumentation, Electrical & Electronics: Keithley Integra series data logger/digital multimeter, Signal generator, Oscilloscope, SEM.

* Semiconductor processing: DC Sputtering, E-Beam Evaporator, Mask Aligner, PECVD, Positive/Negative/Soft Lithography, Plasma Etching - DRIE, Mask writing, thermal furnaces.

* Semiconductor wafer fabrication tools

- Dry Etch: Oxford Instruments Plasma lab 100 ICP-380 (DRIE Bosch process), Tegal 901E Reactive Ion Etcher.

- Lithography and wet process: Suss Microtec Lab Spin 8 Bench mounted spin coater, EV Group (EVG) 620 automatic mask alignment, WAFAB Immersion develop and solvent lift-off and resist strip baths, WAFAB Piranha, RCA Clean, HF/BOE and general purpose wet process stations

- Mask Writing: Heidelberg Direct Write µPG101 Laser Mask Writer

- Physical Vapor deposition: CHA SEC-600 – electron beam evaporator, DC sputtering system.

- Chemical Vapor deposition: Oxford Plasma Lab 100 PECVD

- Metrology: Hitachi SEM 3500H

- Back End of Line: Disco DAD321 (semi-automatic dicing saw), Strausbaug 6 ec (CMP)

- Thermal Processing: Expertech Compact Thermal Reactors (CTR)

* Analytical: Analysis of Variance (ANOVA) - Excel

* Software: Pro-Engineer (PTC certified Wildfire 4.0 user), AutoCAD, Mat lab, COMSOL, Layout Editor, ANSYS

ACADEMIC PROJECTS

* “ Numerical simulation of mixed convection air cooling in electronic components (June – Sept’ 12)

- Objective is to enhance the air-cooling of miniaturized electronic components by studying the effect of Reynolds number, positioning and size of components in a flat channel.

- Finite volume method and SIMPLER algorithm were used to solve the conservation of mass, energy and momentum equations.

* Convective heat transfer characteristics of nanofluids in mini channels” B. Tech thesis (2010-12)

- Designed and fabricated an apparatus to measure the single phase convective heat transfer coefficient of nanofluids.

* “Thermal conductivity of nanofluids using transient dual hot wire technique” (2009 – 10)

- Designed and fabricated an apparatus to measure the thermal conductivity of nonvolatile liquids using a transient dual hot wire technique.

- Nano fluids were prepared by ultra-sonic vibrations and magnetic stirring

* “Prototype of a Robotic Sun tracking system for automotive cooling ” – robotics (June'10 - Aug '10)

- Designed and prototyped a device which automatically tracks the path of a light source using solar cells and a stepper motor with PIC micro-controller system.

- Solar power was used to rotate two blowers in opposite direction to facilitate air circulation.

Contact this candidate