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Designer Design

Location:
San Francisco, CA
Posted:
July 30, 2015

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Resume:

Howard G. Warshaw

***** ******** ***** *******

Brambleton, Va

Cell 443-***-****

acqz32@r.postjobfree.com

Profile

Highly experienced Printed Circuit Board Designer with an extensive background in analog, digital, multi-layer design power supplies. Effective leader adept in developing and motivating design teams to achieve improved accuracy and productivity. Enthusiastic learner able to rapidly master new skills and technology. Specialized expertise includes:

•Senior (PCB Designer) Mentor graphics Pads V9.3

•Power Supply’s

•High Speed signals

•FPGA Layout

•Dx Designer for Pads Flow 9.0.2 ( Mentor Graphics school)

•Pads Logic Schematic

•IPC Standards

•HIGH SPEED

•GERBOR FILES

•Follow rules of for signal integrity

•Stay current with high speed and controlled impedance routing.

•Dx Designer

•Dx Data Book

•View Logic

•Librarian

•Pads Router

•Support RF Design

•Support Design team

•Work with Engineer to meet all EMI Design requirements.

•Prepare All Documentation for outsourcing PCB

•Maintain Documentation File History

•Multilayer 2 to 24 Printed Circuit Boards for mixt technology

•Differential Pairs

•Bind/buried and filed Via

•ISO 9000

Experience ;

One for Tools, Bakersfield, Cal July 2014 to February 2015

Senior (PCB Designer) Mentor graphics Pads

1.Power Supply for Hand Held Unit

2.Multi voltage PCB Board ( 4 stack up)

3.All work was done at my home

Avionic Instruments, Avenel, NJ Oct 2013 to March 2014

Senior (PCB Designer) Mentor graphics Pads

1. Layout and ECO small Power Supply’s

2. All Components had heights inserted to made a 3-D PCB (EMM File) to be imported

into Mechanical program to check for clearance

3. Updated schematics (Pads Logic)

Fibertek, Inc Herndon, VA Aug 2009 to June 2013

Senior (PCB Designer) Mentor graphics Pads

Utilizing Mentor Graphics 9.3 and Pads logic. Worked with both FR4 and Ceramic. ulti-layer analog, high-speed digital engineering groups and related programs. The designs included multi-layer co-planer, power supplies, control modules and mixed signal backplanes. Delivered complete drawing packages, mechanical and electrical, including the schematic diagrams, assembly drawings, parts lists, board details, and artwork.

Spirent Communications, October 2008 to June 2009

Senior PCB Designer

Germantown MD, Contractor,

1.Designed Printed Circuit Board stack up Module. Four boards interconnected with components on both sides of various heights.

All Printed Circuit Boards are ROHS Compliant.

2.Made the Dx Designer symbols for the CAD (pads) as well as the foot print.

3.Test Schematic symbol and foot print to make sure they where correct so they can be loaded into Dx Data book. Then would layout both the schematic per engineer input and the PC board.

Bell Helicopter, Hurst Texas, Contactor August 2008 to Oct 2008

Senior (PCB Designer) Mentor graphics Pads

1. Designed Printed Circuit Boards to MILL-STD.

2. Wrote organized procedures for importing PADS

Into UNIGRAPHICS to make PWA and PWB drawings.

Fibertek, Inc Herndon, VA April 2006 to August 2008

Senior (PCB Designer) Mentor graphics Pads

1.Pads 5.01

2.Pads Power Logic

3.Designed PC Boards EMI, 18 Layer, mixed technology

LinkPlus, Columbia, MD March 2005 to March 2006

Senior (PCB Designer) Mentor graphics Pads and Librarian

1. Set up Dx Designer.

2. Set Library (Dx Data Book)

3. Trained the Engineers in the use of Dx Designer Schematic Capture

3. Trouble Shoot and check PCB Layout designs.

4. Layout RF boards with mix technology

Northrop Grumman, Annapolis, MD, Contractor, Feb 2004 to March 2005

Senior (PCB Designer) Mentor graphics Pads and Librarian

Set up library structure and procedures for Pads and Dx Designer.

1. Responsible for Training Designers for Pads PCB designs.

2. Trained Engineers in Dx Designer Schematic Capture.

3. Trouble Shoot and check PCB Layout designs.

4. Layout 16 layer boards with mix technology

Andrew, Warren NJ, Contractor, June 2002 to April 2003

Senior (PCB Designer) Mentor graphics Pads

I train 6 PCB Designers to use Pads. Trained and checked there designs for production.

Set up the library and DX Data book Laid out PCB Boards for RF Design

IBM- Fishkill, NY April 1999 to June 2002

Senior (PCB Designer) Mentor graphics Pads

Librarian and PCB designer 4 to 12 layer boards Pads and View draw

1. RF design

2. EMI design

BAYER DIAGNOSTICS, Tarrytown, New York June 1995 to April 1999Senior Printed Circuit Board Designer

Manage the total design process of printed circuit boards for a manufacturer of medical diagnostic equipment. Instructed designers in the layout of PCB and cabling for electromagnetic interference technology (EMI). Support staff in the design of all prototype and production boards and test features. Review schematic capture and ensure accuracy of data. Supervise the photo plotting of PCBs. Conduct final quality reviews. Recommend additional features to engineers to improve product performance. Interact with manufacturing regarding production concerns. Write and implement design rule changes. Attend management meetings to develop strategies for department operations.

•Restructured the PCB Department, introduced new technology and trained the entire engineering staff in the use of schematic capture and View draw CAD systems

•Created and manage library of several thousand parts, which has led to significant improvements in the efficiency and accuracy of PCB design.

•Developed standard operating procedures to enhance quality, cost-effectiveness and reduce subsequent design flaws.

•Recipient of Special Recognition Awards for leading the new ECAD project and for making outstanding personal contributions to the Division.

1. Design printed circuit boards using Pads Power V2.1

A. From 2 layer to 10 layer Printed Circuit Boards

B. Design all Printed circuit boards to pass (EMI)

Electro mechanical interference by implementing proper grounding

Of the PCB Board. In addition, shielding of all sensitive signals.

2. Set up Photo Plotting of the PCB Boards to be sent to Manufacturing.

3. Set up Documentation procedures for the Printed Circuit Board Department.

A. Archiving system for all Documentation.

B. Drawing system for all Schematic, Drill and Assembly Drawings.

C. Responsible in making sure that all DRC'S are written correctly and

Incorporated into all drawings that are part of the Printed Circuit board Department.

D. Responsible for EDR release of all PCB documentation.

4. Additional responsibly are to the Training of the Engineers and instructing them

On the new versions of View Logic V7.5 (Schematic Capture Software)

A. Maintaining a Library/ Part number system for there use.

B. Checking the Physical part of the Schematic (drawing, parts, part symbols)

C. Support Engineers with any Schematic problems.

CRESTON ELECTRONICS, INC., Cresskill, New Jersey 1991 to June1995

Printed Circuit Board Manager

Supervised the design of PCBs with RF technology for a manufacturer of electronic control equipment. Oversaw designers and engineers. Interacted with outside vendor on manufacturing process.

•Trained staff to properly utilize Pads-Perform (3.1 and Windows) and by using all program features reduced turnaround time from five weeks to one week.

•Designed and implemented policies and procedures that improved efficiency, cost-control and quality.

PRECISION PROTOTYPE, Garfield, New Jersey 1989 to 1991

Free Lance CAD Designer

Held Various Printed Circuit Board Design Positions from 1965 to 1989



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