Michael Sanders

**** ***** ******, ******** *******, TX 78620

512-***-**** acqf0j@r.postjobfree.com www.linkedin.com/in/MichaelSandersTX

Summary Process/DFM Engineer in electronics manufacturing in the US, China and Taiwan. Known for improving processes and cultivating new business.

Accomplished in:

Design for Manufacturing Engineering: served as DFM Engineer for 4 of the largest electronics contract manufacturers (CM).

Process Engineering: served as Process Engineer for OEM and 2 CMs.

Product Engineering: served as Product Engineer for two large CM’s.

Process Management: served as Process Manager for an OEM.

Experience:

2011 – Present Process Engineering Manager, Hubbell Building Automation, Austin, TX

A leading manufacturer of energy saving lighting controls. Division of Hubbell Inc., a $3.2B electrical products manufacturer.

Responsible for process engineering, safety, facilities, ESD and sustainability.

Oversaw transition of a full production line to HBA facility in Tijuana, Mexico.

oCoordinated riggers, electricians, HVAC and shipping, resulting in a smooth transition.

oHelped set up the line on-site, training engineers on running the equipment and building the products.

Supported introduction of new products:

oWrote programs for the Pick-and-Place and Wave Solder machines.

oDesigned and ordered solder paste stencils, wave solder pallets and in-circuit test (ICT) fixtures.

oHelped set up new programs for the screen printers, reflow ovens and through-hole stuff lines.

Oversaw maintenance, test and quality technicians.

Helped implement all production processes, procedures and policies.

oPursued new solder dross recycling quotes, saving over $50K/year with new vendor.

oResearched, recommended, purchased and installed new equipment for production and test.

oSpearheaded and orchestrated relighting of the entire production floor, replacing 400-watt metal-halide lamps with energy-efficient T5 fluorescents, employing both schedule and motion lighting controls. Saved $700/month.

2011 Product Engineer, Flextronics 2, Pflugerville, TX

$30B supply chain solutions company offering design, manufacturing, distribution and aftermarket services to OEMs. The Pflugerville facility closed 2011.

Provided customer support and ensured products met with their satisfaction.

Co-designed floor layout, process flow and custom workbenches; wrote instructions for manufacturing assemblers and supervisors, reducing unit production time by 25%.

Provided customers’ schematics, Bills of Materials (BOM’s) and assembly drawings to Test Engineers and manufacturing personnel.

Ordered equipment and supplies including soldering equipment, chemicals, ring lights and microscopes.

Conducted Out-of-Box audits on percentage of all material shipped out, reducing number of Return Material Authorizations (RMA’s).

2010 – 2011 Product Engineer, Celestica Aerospace Tech. Corp., Austin, TX

$5B multinational electronics manufacturing services (EMS) company offering design and engineering, electronics manufacturing and supply chain management services.

Supported the development and production of General Electric’s products.

Helped launch over 240 new products generating $MM revenue.

Performed internal reviews of GE products, driving improvements in design and production.

Wrote instructions used by manufacturing personnel to build all GE products.

Oversaw product builds on the factory floor, addressing questions and resolving issues in real-time, contributing to on-time deliveries.

As interim Quality Engineer, responsible for all quality issues, First Article Inspections and Certificates of Conformance.

Tracked and ordered over 30 consumables used in building products, including labels, wire, heat shrink, Teflon tubing, RTV and thermal compound.

2005 – 2010 Program Manager, Micro Star International, Austin, TX

2002 – 2003 $2.5B multinational information technology corporation that designs, develops and provides computer hardware and related products and services, including laptops and graphics cards.

Program Manager, Desktops (DT) & Graphics, 2006 – 2010

Early Supplier Involvement (ESI) Coordinator, DT and Graphics, 2005 - 2006

Component Engineer 2005

DFM Engineer 2002 - 2003

Coordinated Dell and MSI design teams in Taiwan and manufacturing teams in mainland China, contributing to increasing revenue to over $300MM.

Co-developed Design for Excellence (DFX) training course for Dell engineers.

Met weekly with Dell teams, hosted conference calls with MSI teams in Taiwan and China and ensured all programs/products met Dell’s aggressive schedules.

Improved MSI quoting activities, including working with technology providers, design kits, Gerber files, Bills of Materials and schematics, resulting in accurate quotes.

Collaborated with Dell Development Engineering Team to resolve Original Design Manufacturer (ODM) proposal issues including design cycles, excursions, approved component vendor lists, quality goals and test criteria.

Worked with Dell Quality Engineering to facilitate transition from immersion silver to lead-free organic solder preservative finish on printed circuit boards.

Expedited sources and delivery of components or printed circuit boards (PCBs) in critical shortage, resulting in on-time delivery of product.

Assisted in launch of critically acclaimed products including Dell/Alienware’s XPS line of high-end gaming computers.

Met with Dell’s engineers and program managers in China and Taiwan, including:

oOversaw product builds in Shenzhen, China. Delivered “Practical Processes for Pb-Free PCBA Manufacturing” presentation to MSI in China.

oTraveled to Guangzhou, China to discuss new technologies, design considerations and capacity restraints with global leader supplying PCBs, contributing to changes on Dell PCB’s.

oMet with Dell’s Senior Quality Engineers and Electrical Engineers in Taipei, Taiwan, resulting in better communication and reviews of the products.

Made radical changes in manufacturing in Shenzhen, China and presented changes to MSI’s top engineers in Taiwan, resulting in improvements to MSI’s production methods.

Based onsite within Dell Round Rock 5 Design Center.

2004 – 2005 Design for Excellence (DFX) Engineer, Quanta Computer, Austin, TX

The world’s largest manufacturer of notebook computers, with $29B revenue and 31% market share (2008).

As consultant to Dell’s electrical engineers (EE’s) and mechanical engineers (ME’s) on Designing for Manufacturability (DFM) and Design for Testing (DFT),

Recommended alternatives in layout, reviewed circuits in ECAD, wrote PCB fabrication, printed circuit board assembly (PCBA) notes and signed-off on finished printed circuit boards and assemblies.

Provided guidance on PCB traces and spaces, impedance coupons, PCBA components and component “keep outs”.

2003 – 2004 ESI Coordinator, Flextronics International, Austin, TX

$30B supply chain solutions company offering design, manufacturing, distribution and aftermarket services to OEMs.

As customer liaison between Dell’s design teams and Flex’s manufacturing teams,

Participated on committee to rewrite Dell’s Design Guidelines and fabrication and assembly notes used on all Dell assemblies worldwide.

Coordinated the efforts of technical, quality, engineering, manufacturing and purchasing from Design Phase through Production and Sustaining.

Communicated Dell’s design needs to manufacturing on-site in China.

Promoted from DFX Engineer, consulting on every aspect of DFM and testing.

1999 – 2002 DFM Engineer, Surface Mount Technology Centre, Austin, TX

End-to-end electronics manufacturing services (EMS) including product design, PCBA production and systems integration.

DFM Engineer 2001 – 2002

New Product Introduction (NPI) Engineer 2000 – 2001

Process Engineer 1999 – 2000

As DFM Engineer, served as SMTC’s “single point of contact” with Dell Computers.

As New Product Introduction (NPI) Engineer, responsible for prototype assembly. As Process Engineer, responsible for all aspects of manufacture.

Instrumental in implementing Line Balancing and Linear Continuous Flow Manufacturing, resulting in streamlining product flow and reducing takt time by over 25%.

Evaluated all major solder brands, recommending one no-clean solder paste to be used on all PCBAs worldwide.

Wrote Documentation Control, specified and ordered stencils, wrote screen printer programs, resolved machine issues, programmed reflow oven profiles, determined set-up and personnel on thru-hole “stuff” lines, programmed wave solder profiles, and oversaw boards through Post Solder Inspection, Rework, In Circuit Test, Functional Test and Final Visual Inspection.

Championed new improved profiles for the reflow ovens, selective soldering pallets, reduced flux and better profiles for the wave solder machines.

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