Post Job Free

Resume

Sign in

research assistant

Location:
Boulder, CO
Posted:
June 12, 2015

Contact this candidate

Original resume on Jobvertise

Resume:

QIAN LI

Department of Mechanical Engineering, Phone: 303-***-****

University of Colorado, Boulder, CO, 8030 9 Email:acp6q7@r.postjobfree.com

SUMMARY

Proficient in ANSYS (Multiphysics&Icepak), Origins, AutoCAD, L-Edit, Clewin, C, Matlab, Fortran,

Mathematica, Solidworks

Solid background in heat transfer, finite element analysis, fluid mechanics, and material mechanics

Excellent communication skills, team-player

Expert in temperature measurements, data acquisition, cleanroom tech, SEM, coating, soldering, and shop

skills

EDUCATION

Ph.D. in Mechanical Engineering 2014

Dept. of Mechanical Eng., University of Colorado-Boulder, Boulder, CO GPA: 3.87

Thesis Title: Enhancing Phase-Change Heat Transfer with Copper Nanowire-Structured Surfaces

M. S. in Mechanical Engineering, 2009

Inst. of Eng. Therm. Chinese Acad. of Sci., Beijing, China

B.S. in Thermal Science and Energy Engineering, 2006

Univ. of Sci. and Tech. of China (USTC), Hefei, China

COURSEWORK

Heat Transfer, Micro Scale Heat transfer, Finite Element Analysi s (Structure Analysis), Computational Heat

Transfer, Computational Fluid Dynamics, Fluid Dynamics, Thermodynamics, Micro -Electro-Mechanical System,

Material Mechanics

PROFESSIONAL EXPERIENCE

Research Assistant, with Prof. Ronggui Yang 08/2009-12/2014

University of Colorado, Boulder

Built FEA models with ANSYS to determine the thermal performance of flat heat pipe (FHP), revealing the

potential applications of FHP in high acceleration condition and mobile devices.

Determined a heat spreading structure for GaN high frequency RF device with ANSYS, useful for hot spot

cooling.

Developed high-temperature/vacuum experiment systems to study enhanced pool boiling and dropwise

condensation heat transfer on nanowire structured surfaces, enabling highly efficient apparatus with ultrahigh

heat flux removal capability.

Designed and fabricated patterned nanowire-array wicking structures for thermal ground planes capable to

remove ~200W/cm2 heat flux, beneficial for thermal management of energy concentrated electronic devices.

Research Assistant, with Prof. Dawei Tang 12/2006-07/2009

Institute of Engineering Thermophysics, Chinese Academy of Sciences

Measured and modeled thermal properties of carbon nanotube arrays using the 3 method for future thermal

interface material applications.

Wrote C language code to simulate the travelling of shock wave inside a tunnel, revealing the formation of Mach

stem and the interaction of shock waves.

Research Assistant, with Prof. Jianhua Wang 09/2005-07/2006

University of Science and Technology of China

Set up an experiment system to measure the velocity of complex internal flow with Particle Image Velocimetry

and studied the flow field with Fluent, providing gas flow improvement suggestions in a nozzle material.

HONORS

Winner, ASME IMECE Micro/Nano Technology Forum Travel Grant, San Diego, California, U.S.A. 2013

Best Presentation, GEAR2S Symposium, University of Colorado, Boulder 2013

Deans Outstanding Merit Fellowship, University of Colorado, Boulder 2009

Excellent Graduate Award, University of Science and Technology of China 2006

Scholarships for Academic Excellence, University of Science and Technology of China 2003-2005

JOURNAL PUBLICATIONS

1. Q. Li, W. Wang, C. Oshman, B. Latour, C. Li, V. Bright, Y.-C. Lee, R. Yang, Hierarchical Micro/Nano- Structured

Surfaces for Boiling Heat Transfer Enhancement, to be submitted

2. Q. Li, W. Wang, M. Tian, R. Yang, High Heat Flux Thermal Ground Planes with Patterned Nanowire Array

Wicking Structures, to be submitted

3. Q. Li, J. Wu, G. Wu, R. Yang, Dropwise Condensation Enhancement on Hydrophobic Nanowired Surfaces, to be

submitted

4. C. Oshman, Q. Li, L.-A. Liew, R. Yang, Y.-C. Lee, V. Bright, Flat Flexible Polymer Heat Pipes, Journal of

Micromechanics and Microengineering, Vol. 23, pp. 015001(1)-(6) 2013

5. C. Oshman, Q. Li, L.-A. Liew, R. Yang, Y.-C. Lee, V. Bright, D. Sharar, N. Jankowski, B. Morgan, Thermal

Performance of a Flat Polymer Heat Pipe Heat Spreader under High Acceleration, Journal of Micromechanics and

Microengineering, Vol. 22, pp. 045018(1)-(12) 2012

6. Q. Li, D. Tang, et al., Measurement of Longitudinal Thermal Conductivity of a Vertically Grown Carbon

NanoTubes Array on a Quartz Substrate, Journal of Engineering Thermophysics, Vol. 31(1), 2010

7. Q. Li, J. Wang, et al., An Investigation of Coolant Flow Performance within Laminated Plate (I Visualization of

Complex Flow Field Using PIV Technology), Journal of Experiments in Fluid Mechanics, Vol. 0(4), 2007

CONFERENCES

1. Q. Li, W. Wang, C. Oshman, B. Latour, C. Li, H. Li, V. Bright, Y.-C. Lee, G. Peterson, R. Yang, Enhanced Pool

Boiling on Micro-, Nano-, and Hybrid-Structured Surfaces (IMECE2011-64921), ASME 2011 International

Mechanical Engineering Congress & Exposition (IMECE2011), Denver, CO, 2011

2. Q. Li, W. Wang, M. Tian, R. Yang, High Heat Flux Thermal Ground Planes with Patterned Copper Nanowired

Wicking Structures (HT2013-17674), ASME 2013 Summer Heat Transfer Conference, Minneapolis, MN, 2013

3. Q. Li, J. Wu, G. Wu, R. Yang, Dropwise Condensation Enhancement on Hydrophobic Nanowired Surfaces

(IMECE2013-66447), ASME 2013 International Mechanical Engineering Congress & Exposition (IMECE2013),

San Diego, CA, 2013



Contact this candidate