T ERRY D . A BNER

**** ****** **** ****, ***** * C olorado Springs, Colorado 8 0907-2706

719-***-**** t acou9h@r.postjobfree.com

H ARDWARE ENGINEER II/ CAD DESIGNER

SKILL SUMMARY

• Cad experience. Altium, Pads, and all other design software.

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• Expertise in the design of quick-turn, high-speed digital and RF prototype printed circuit

boards (PCBs)

• Production PCB expertise for multi-layer digital cameras and RF designs that required phase-

matched lines for timing and controlled trace impedances for performance

• Maintained schematic capture and PCB layout libraries

• Good communication and interaction skills with electrical, mechanical and manufacturing

engineers.

• Expertise with Mentor Graphics PowerPcb (PADS), Orcad, Dx Designer and Altium

Designer.

W ORK EXPERIENCE

Cad/Test Engineer

Solidus Technologies 2010-2014

• Trouble shot the company’s main circuit boards.

• Tested MEM wafers, using the Electroglas prober.

• Cleaned and maintained probe cards as well as the prober.

• Worked with Alpha probes and Laser Spectrum professional companies that built

our probe cards and PCB assembles.

• Designed High Frequency Probe Cards.

Engineer II

ITT, Inc., Colorado Springs, Colorado 2008-2010

• Trouble shot various circuit boards that previously did not work.

• Served as a member of ITT’s Eglin Modernization Team.

• Proficient in Altium designer

• Designed RF circuit Boards for Radar Interface systems

• Prepared and documented Schematics, Assembly drawings and Bill of Materials for the

designs

• Assembled Coaxial cables for Antennas and for use between subsystems.

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Senior Designer 2004 - 2008

Dalsa Inc., Colorado Springs, Colorado

• PCB design of high-speed digital cameras, including the generation and maintenance of

production documentation

• Several multilayer PCB designs of high-density digital and analog systems operating in the

RF spectrum from 50 to 500 MHz

• Designed PCBs that required controlled impedances and phase-matched traces for

microprocessors, PROMs and high-speed digital to analog conversion.

• Designed PCB footprints for high-density ball grid array (BGA) and fine pitch (<0.025”)

parts.

• Designed high-density interconnect

• Interacted with the PCB assembly shop, Spectrum Laser, to tailor PCB footprints to meet

their assembly requirements.

Engineer/Designer 2002-2004

JM Engineering, Colorado Springs, Colorado

• Designed, assembled and tested turnkey products for companies in need of quick turn

engineering.

• Designed DUT boards, high speed interface boards, and flex cable systems

• Prepared schematics, mechanical detail, and assembly drawings

Engineer/ Designer 1995 – 2002

RadyneComstream, Phoenix, Arizona

• Designed Digital Video Broadcast modulators and demodulators or satellite modems

• Designed all of the companies RF cards

• Designed complex systems with both RF and high speed digital processing circuits

• Designed boards of up to 12 signal layers, complex impedance controlled routing, and

complex ground/ power layers for impedance matching

• Prepared build-by documentation for prototype boards

• Created, updated and maintained Schematics, part lists ECO’s, ECN’s, and associated

documentation

• Supervised repairs and revisions made to PCB’s in the field

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