Mr. BHAKT PATEL (US Citizen)

E-mail: achaj2@r.postjobfree.com Cell: 714-***-****

POSITION SOUGHT

I am looking for an innovative company that can make use of my strong Engineering experience and key

leadership skills with board, FPGA and System level designs.

STRENGTHS

Extensive experience with: Audio/Video, Telecommunications and Medical System Designs.

Principle Engineer for Alcon Lab’s, a Major Eye Care Company with over $6Billion in annual sales.

Designed products based upon: CPU’s (PowerPC), Microcontrollers (ARM, PIC, MCU08), Custom

Video processors to DSP’s (Analog Devices, TI).

Designed products to meet DFM and DFT high volume manufacturing.

A 3Com product was manufactured by Flextronics in Guadalajara, Mexico

A Sigma product was manufactured by DEC in Singapore and Maine, USA

Past reviews: “Consistently exceeded goals and expectations”, “Takes initiative” and “Works very well

across support team’s, and is a valuable resource during meetings and discussions”

Design Tools: Orcad, Allegro, LTSpice, HyperLynx SI, ModelSim.

Microsoft Office tools: Word, Excel, PowerPoint, Project.

FPGA experience: Verilog, VHDL, Altera and Xilinx (CPLD’s to 1M gate Spartan 3, XC3S1000)

Programming language: “C”, HTML, JavaScript, CSS, Python. Write “C” to extensively test my designs.

DC/DC switcher design, test and debug. Board/system level hardware debug and verification.

Used HyperLynx SI for pre-layout and post layout simulations for signal integrity analysis.

Familiar with CAN, Flex Ray and ZigBee.

Further Education

Currently taking lynda.com online course: Python 3 and Modern Web Design Process.

Completed: DataBase Basics, PowerPoint 2013 Shortcuts, Supply Chain Management Fundamentals, PHP

with MySQL. Completed Reading: “High Speed Digital Design, by Hall, Hall & McCall”.

Responsibilities

Provide Hardware leadership within our group and was the “Lead technical signoff” for another group.

Required broad knowledge base and problem-solving skills.

Responsible for part/vendor selection, design, debug, validation, EMC/HALT/Safety, board stress

testing, thermal and reliability calculations - from early concept, prototype to production release.

Support Manufacturing, troubleshooting problems and improve production testing.

PROFESSIONAL EXPERIENCE

Sr. Hardware Engineer / Principle Engineer, Alcon Labs, Irvine, CA (over 7 years)

Principle Engineer

Strong multiple Project Management skills. Member of the “Hardware Center of Excellence Team”.

Lead Technical Reviewer for a new Cataract machine that contained a Motorola Automotive CPU with

CAN bus, Flex Ray and ZigBee interfaces.

AutoSert IOL Injector Product

Altera FPGA and ModelSim: Designed, simulated, defined timing constraints and wrote a test bench

in VHDL of a CPLD (contained PWM, counters and a SPI bus).

Laser Product

Managed a 3 member team to redesign the main controller board for a Laser Product, addressing

manufacturing and customer issues. The final solution saved the company over $100k/month. Lead

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team from concept, presentation to upper management, project management tools using MS Project,

hiring staff, development, holding design reviews, product approval to full production.

The design contained the “Kernel” block, listed below, with the addition of an audio codec, TEC

coolers, 20A Laser Diode driver (using MOSFET’s), SPI (eeprom), I2C (fan controller, Audio CODEC

and eeprom) interfaces. The FPGA was modified to add a new audio buffering scheme.

The “Kernel” block was a complete new layout with single sided ICT test points.

Hyperlynx SI was used to determine different chip placement options.

Ansys Icepak thermal modeling was used to optimize the heat dissipation paths.

Wrote and performed module/PCBA level verification & validation protocols.

Sr. Hardware Engineer. Constellation Product

HDMI HDTV 1080p Video Overlay: Contained a 400MHz TriMedia Video Processor with 2Gb DDR2.

Ran HyperLynx SI simulations on the DDR2 memory. It was my responsibility to oversee the complete

project, from 3rd party selection, wrote product spec, held design reviews, review PCBA layout,

product validation, EMI testing, component derating rating analysis, to first article testing.

Qualified a USB 802.11n internationally branded device.

Fluidics Module: A complex electro-mechanical module, with steppers, pneumatic valves, pressure,

optical and flow sensors. Solve thermal and EMI issues. Wrote pre-production test software in C.

Responsible for the Kernel block, consisting of a PowerPC MPC8270, SDRAM, Flash memory,

ADC’s, DAC’s, clock buffer, CPLD, Xilinx Spartan 3 FPGA, 10/100 Ethernet, RS232.

Used Hyperlynx SI to reduce EMI issues and check signal integrity on critical signals.

Oversaw root-cause analysis and solutions of field failures, such as CPU cold starts, frozen

touchscreen, intermittent low voltage switcher error, startup ADC ref issues, etc.

Hardware lead, 3Com Corporation. Santa Clara, CA (6 years)

NetworkJack

Member of the technical team that came up with various filed patents related to the NetworkJack - a

5port managed switch, electrical box outlet form factor, using Power over Ethernet.

Lead the hardware engineering team from conception, design to volume manufacturing.

Contained an Atmel ARM7 processor, flash, sram, 5port Ethernet switch and a MC68HC08

microcontroller.

Working at 3Com was a tremendous experience. I learnt how to design a high quality, high volume,

manufacturable products. The Network Jack sold over 60kunits per year.

Foresight Technology, Independent design consultant, Santa Clara, CA (4 years)

Helped with board and FPGA design needs for Philips HDTV reference platform.

Used Verilog, Synopsys to design the digital section of a full custom mixed signal Video overlay chip.

Designed a PCI bus interface using a Altera FPGA, for Quickturn emulation of a MPEG2 Audio/Video

silicon decoder.

Hardware Engineer

C-Cubed microsystems: helped bring up CL550B, the 1st JPEG still image coder/decoder chip in the

world. Designed MPEG2 PCI and PCMCIA cards.

Designed a 16bit audio card for the PC containing a $10 Analog Devices DSP (ADSP2105). Used

Audio Precision test equipment to measure many audio parameters. Wrote all the DSP code (in

assembly), including non-real time editing functions.

Compression Labs: Voice encoder/decoder for Video Conferencing, using two TI DSP chips.

Research Scientist, Philips Research Lab's, Surrey, England

Served on a two man project to complete a sequential to interlace picture converter.

EDUCATION

BSc. Electronics, University of Kent at Canterbury, Kent, England.

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