L I-M I NG HSU (LEE)

*** ******* ****** ***. ***, Alameda, California 94501

+1-415-***-****, l acfypl@r.postjobfree.com

Skills Summa ry

• Combined 3 years in MEMS microelectronics and thin films architecture. Product/process development in

GaN/InGaN based active device and silica based arrayed waveguide passive optical device. Interfaces between

design and process manufacturing

• Specialized in photolithography, ICP-RIE, CVD process. Metrology for thin film characterization: SEM/EDX,

F TIR and XPS.

• Experience in C++ object oriented programming, data acquisition for equipment part testing, MS Access

database.

• SPC process control experience from equipment level, process level to product performance level.

• Product (prototype) development projects including r isk assessment of supply chain issue, manufacturability and

cost.

• L anguages: English, Mandarin

E XPER I ENCE

ENABLENCE F remont, CA

P rocess development Engineer, optical components 2013-present

• High refractive index silica glass development for DWDM waveguide division multiplexer device. Building up

advanced core layer of array waveguide device that serves as future infrastructure in data t ransportation. Precise

i ndex control with APCVD.

• Quality assurance from prototype development to final product. Identified potential r isk in supply chain and

bottle neck in production line at early stage. Conducted manufacturing planning to increase capacity for new

p roducts.

• Integration experience in MEMS thin film architecture and quality control. Closed loop control from wafer level

fabrication to back-end device testing level. Established and quality check point throughout wafer production line.

• Production data management with MS access database. Established inputs with graphic user interface and

correlated process data to device testing data.

D ICON F IBEROPT ICS

P rocess Engineer, H igh Brightness LE D R ichmond, CA

2011-2013

• Improved the company’s High Brightness LED (HB-LED) wafers production yield by 30% by identifying root

cause in original process design that leads to high operating voltage. Designed new process that improved LED

chips production with better manufacturability and reliability.

• Was assigned to build up production line in company’s subsidiary site in Kaohsiung, Taiwan.(6 months after

working with the company). Identified the root cause and worked together with senior managers to resolve the

p roblem.

E DUCAT IO N

U N I VERSI TY OF F LOR I DA Gainesville, FL

M aster of Science in M ate rials Science and Engineering 2009-2011

Recipient of Achievement award from College of engineering

N AT IO NAL TS I NG H UA U N I VERS I TY(N T H U) Hsinchu, Taiwan

Bachelor of Science in Physics 2004-2008

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