BED P. SHARMA

**** *. ******* ******-*, Denton, TX, 76201 Phone: 940-***-****, Email: acdrqs@r.postjobfree.com

Citizenship status: Permanent Resident, USA

TECHNICAL SKILLS

Thin Film Deposition and Processing

Magnetron sputtering physical vapor deposition (PVD) (for metal, ceramic, and semiconductor)

Atomic layer deposition (ALD) (ZnO deposition)

Chemical vapor deposition (CVD) (graphene synthesis)

Ion beam implantation/irradiation

Plasma processing to thin film for surface modification

Rapid thermal processing (RTP) of semiconductor materials and high k dielectric

High and low temperature furnaces for thermal processing of materials

Thin Film Characterization

• Auger electron spectroscopy (AES)

X-ray diffraction (XRD),

• Scanning electron microscopy (SEM)

X-ray photoelectron spectroscopy (XPS)

• Energy dispersive X-ray spectroscopy (EDX)

Ultraviolet photoelectron spectroscopy (UPS)

• Rutherford backscattering spectroscopy (RBS)

Raman spectroscopy

• Profilometer, and four point probe

Ellipsometry

Atomic force microscopy (AFM)

Miscellaneous Technical Skills

Hard anodization and wet etching (electrochemical) for Si nanoholes, RCA cleaning of Si wafer, Ar ion etching

Reactive ion etching (RIE) to tailor size of polystyrene beads and to produce Si nanopillars by nanosphere lithography

Differential scanning calorimetry (DSC), Dynamic mechanical analyzer (DMA), 3- point bending, Horn sonicator

Ultrahigh Vacuum (UHV) system: UHV lab set up by assembling different UHV chambers, UHV tools, and sources to make an

insitu system for thin film deposition, processing, and characterization, He leak test (RGA)

Finding root cause of problems and troubleshooting to UHV chambers, characterization tools, and processing tools, strong

problem solver, self-starter, quick learner of principles, materials, and tools operations

Design of Experiments (DOE)

Computer Skills

Microsoft office (Word, Excel, PowerPoint), Origin, Sigma plot, SRIM/TRIM simulations, SIMNRA simulations, Multipack for

XPS data analysis, MDI JADE for XRD data analysis

Statistical data analysis

PROFESSIONAL EXPERIENCE

Laboratory for Electronic Materials and Devices, Department of Materials Science and Engineering, University of North

Texas, August 2009-December 2013

Magnetron sputter deposition (PVD) of Ruthenium (Ru) thin film and modification by surface plasma nitridation, and C -ion

beam irradiation to improve the diffusion barrier performance of Ru for advance copper metallization to be used at BEOL

of the transistors/CMOS

Reactive co-sputtered deposition of Ru-Al-N film for the purpose of diffusion barrier for copper to be used at BEOL of the

transistors/CMOS

Metal thin films (such as Al, Cu, Ta etc.,) and ceramic films (such as TaN, AlN, ZnO etc.,) deposition by PVD

Low temperature thermal processing of Cu/Ru/SiO2, Cu/N-plasma irradiated Ru/SiO2/Si, Cu/C-ion irradiated Ru/SiO2/Si,

Cu/Ru-Al-N/SiO2/Si, Cu/TaN/SiO2/Si structures, high temperature vacuum annealing of Si implanted SiO2 sample at the

temperature of 1100 oC for the synthesis of Si nano-crystals in SiO2 matrix, rapid thermal processing (RTP) of multiple

energy carbon ion implanted Si at 1100 oC for the synthesis of buried layer of β-SiC in silicon.

Thin films characterization by using XPS, XRD, RBS, EDX, AES, SEM, four point probe, profilometer etc.

Work function tuning of ITO with few monolayers of RuO2 deposition by means of reactive sputtering on top of it for the

application in solar cell, work function determination was performed with UPS measurement, and chemical analysis was

carried out with XPS.

Ultrathin silicon nitride deposition by using PVD and characterization using XPS for the application in gate die lectric for

semiconductor devices.

Mentored the first and second years’ graduate students, and trained them in vacuum technology, processing tools, and

characterization tools.

ACADEMIC BACKGROUND

Ph. D., Materials Science and Engineering, University of North Texas, Denton, TX, USA ( December, 2013), GPA: 4.0/4.0

Title of Dissertation: Nano-crystallization inhibition in 5 nm Ru thin film diffusion barriers for advanced copper interconnects

M.S., in Physics, Southern Illinois University, Carbondale, IL, USA (December, 2009), GPA: 3.93/4.0

Title of thesis: Effect of sonication on thermal, mechanical, and thermo -mechanical behavior of epoxy resin

M.Sc., in Physics, Tribhuvan University Nepal (2006), GPA: Distinction division (equivalent to 4.0/4.0)

Concentration: Solid state Physics

AWARDS, ACHIEVEMENTS, AND LEADERSHIP

Outstanding Poster and Presentation Award, 22nd International Conference on the Application of Accelerators in Research and Industry

(CAARI)

Masters Doctoral Fellowship Award 2009, University of North Texas, Denton TX.

Thesis and Dissertation Fellowship Award 2012, University of North Texas, Denton TX

Academic Achievement Scholarship, UNT (2009-2010)

Elected as a secretary in Nepalese Student Association University of North Texas (NSA -UNT) (2010-2011)

Elected as a treasurer in Nepalese Student Association (NSA-SIUC) (2008-2009)

PRESENTATIONS

C-ion irradiation of Ru ultra-thin films for enhanced Cu diffusion barrier

B.P. Sharma, V.C. Kummari, P.R. Poudel, B. Rout, F.D. Mcdaniel and M. El Bouanani, 22nd International Conference on the Application of

Accelerators in Research and Industry (CAARI), 2012

RBS and XPS studies of CH4 plasma irradiated TaN for Cu diffusion barriers

V. Ukirde, B.P. Sharma, and M. El Bouanani, (CAARI), 2012

RBS diffusion-like elemental profiles and the degradation of thermally processed RuO 2/HfO2/Si structures

V. Ukirde, C. Duk Lim, B. P. Sharma, and M. El Bouanani, (CAARI), 2012

Effects of C irradiation on the resistivity of Ru oxide thin films

C. Duk Lim, V. Ukirde, B. P. Sharma, F. D. Mcdaniel, and M. El Bouanani, (CAARI), 2012

PUBLICATIONS

B.P. Sharma, V.C. Kummari, P.R. Poudel, B. Rout, F.D. Mcdaniel and M. El Bouanani, Effect of low energy carbon irradiation

induced amorphization in Ru thin film for the diffusion barrier for advanced Cu-interconnect (to be submitted)

B. P. Sharma, and M. El. Bouanani, Effect of plasma surface amorphization and nitridation in 5 nm Ru thin film for the

application in barrier for advanced Cu-interconnect (to be submitted)

B. P. Sharma, and M. El. Bouanani, Investigation of low aluminum doping induced near amorphous nitrided Ru film growth

for the application of advanced copper metallization (to be submitted)

P. R. Poudel, P. P. Poudel, B.P. Sharma, J.Y. Hwang, B. Rout, M. El Bouanani, F.D. McDaniel, An investigation to synthesize

buried layer of β-SiC in Si (100) by multiple energy carbon ion implantations, Thin Solid Films, Volume 524, 1 December

2012, Pages 35-38

PROFESSIONAL AFFILIATIONS

Member American Physical Society

Life member of Nepal Physical Society

BED P SHARMA (acdrqs@r.postjobfree.com)

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