John M. Brennan

*** **** **** ****

Vero Beach, FL 32963

accm7u@r.postjobfree.com

1-585-***-****

Objective: As a senior level manufacturing engineering and new product introduction manager with ex-patriot experience,

I am seeking a position where I can install manufacturing capacity and build process development and new

product introduction capabilities.

Expertise:

Back end semiconductor assembly and test processing for IC, optoelectronic, and microelectronic devices.

Air cavity semiconductor package design for optoelectronics and MEMS devices

Process development, process and product change management, and new product i ntroduction

MILSTD, JEDEC, Telcordia, and AEC-Q100 device testing standards

Manufacturing control and optimization techniques including SPC, 5S, Lean, DMAIC, DOE

W orldwide supply chain development and qualification

Factory build out, clean room facilitaization, construction management

Capital and expense project management

Subcontract manufacturing management in the US and Asia

Production supervision in unionized and non -union environments, organizational development

Ability to achieve results and communicate across cultures and in ambiguous environments

Ability to work in complex matrix organization and international regulatory environment

Professional

Highlights: Corning Incorporated, Corning NY

Corning provides keystone components for high technology products in the areas of glass substrates for

display technologies, Environmental Technologies, Life Sciences, Telecommunications, and Specialty

Materials.

Project Manager, Fairport, NY, June 2013 to November 2013

I managed the closure of the Thai manufacturing site that I had built up over the previous five years and

transferred the remaining operations to existing Corning locations in NY. The decision to close the Thai

site was driven by the need to consolidate operations worldwide.

Thailand Operations Manager, Bangkok, Thailand, June 2009 to June 2013

W orking in Corning’s Science and Technology division, I built and managed an eighteen person

Manufacturing Development, New Product Introduction, and Subcontract Manufacturing Management

organization in Thailand. This organization was responsible for working with product development groups

in the US to manage innovation programs from early stage development through turnkey subcontract

manufacturing. Throughout this period I was Corning’s senior manager stationed in Thailand.

Installed and qualified hybrid production line for semiconductor laser module which achieved all

quality, capacity, and yield targets within budget and schedule. This module was developed for the

consumer electronics market.

Developed package, supply chain, and assembly and test process for high power fiber laser

module that achieved all technical specifications for efficiency and reliability and provided line of

sight to high volume.

Developed process and supply chain for medical device including required automated data tracking

and component traceability.

Manufacturing Engineering Manager, Corning, NY, September 2008 to June 2009

I developed assembly methods, improved manufacturability and reduced product cost through design and

process changes of semiconductor laser modules built for the consumer electronics market at sites in NY

and Thailand.

John Brennan - Resume

Sonavation Incorporated, Palm Beach Gardens, FL

Sonavation was a fabless start-up company that developed ultrasonic biometric sensors, ASIC’s and software

for the mobile device market and smart cards.

Manufacturing Operations Manager, December 2007 to August 2008

Reporting to the Vice-President of Operations, I planned and executed a volume manufacturing strategy

for the swipe sensor module I previously developed. This included transferring the technology developed

in the US to subcontractors in Asia. During this period I had four direct reports.

Microelectronics Packaging Engineer, August 2006 to December 2007

Reporting to the Vice-President of Engineering, I designed a multi-chip biometric swipe sensor package

for the mobile device and smart card market.

Tooled internal pilot assembly lab for multi-chip module microelectronics assembly. Developed and

tooled 1:3 PZT composite substrate manufacture that included precision PZT dicing, encapsulation, and

grinding at Florida design center. Part of a team that developed thick film metallization process for PZT

substrates.

Eastman Kodak Company, Image Sensor Solutions, Rochester, NY

Kodak’s Image Sensor Business Unit designed fabricated, assembled, and tested CCD image sensors in

Rochester, NY. CMOS image sensors were designed internally but were manufactured though subcontractors

in the US and Asia.

Microelectronics Packaging Engineer, September 2004 – June 2006

I designed microelectronic packages and assembly process for CMOS and CCD image sensors and

improved yield, uptime, and throughput for internal CCD image sensor assembly.

CCD assembly line yield improved from ~ 70% to greater than 98%. Over 15 ceramic air cavity package

designs in both ceramic and plastic. Developed high reliability (AEC-Q100) over molded QFN plastic

package for CMOS image sensors.

Agere Systems, Allentown and Reading, PA

Formerly the Microelectronics Group of Lucent Technolo gies, Agere was the world’s largest producer of

semiconductor devices for communication. Agere exited the optoelectronics business in 2002 and the RF

Power Amplifier business in 2004.

Semiconductor Device Development Engineer, January 2003 to September 2004

First ex patriot assignment in Asia. W orking for the Analog Products Group I developed in Allentown

and transferred to Agere’s facility in Thailand a hybrid semiconductor assembly process for RFLDMOS

power amplifiers.

Optoelectronics Packaging Engineer, December 2000 to December 2002

I developed and maintained optoelectronic die bond, wire bond, and lid sealing process for

optoelectronic transceivers, detectors, and laser pump s for Datacom and Telecom applications. I

transferred manufacturing process from the development labs in the US to production in US and

Mexico.

AMTX / Xerox Corporation, Canandaigua, NY

Xerox’s Ink Jet Business Unit in Canandaigua produced monochrome and color thermal ink jet print heads and

ink tanks for the consumer market that competed with H -P, Cannon, Epson, and Lexmark. Xerox discontinued

the ink jet business in early 2001.

Manufacturing Engineering Supervisor, November 1998 to November 2000

I supervised a twelve person technical team responsible for the yield, uptime, and throughput of a

three shift, high volume (100K units per month) ink jet print head assembly operation. I acted as plant

receiver for new products and technology from the development organization.

Other engineering and management position s in the conveyor industry

Patents: Ten US patents in the area of semiconductor packag e design and assembly process. US Patent numbers

7235422, 7086148, 7164200, 7242090, 7075174, 7109589, 7214568, 7637414, 7465655, and 7443042.

Education: BS Industrial and Systems Engineering, Ohio University, Athens, OH

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