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Product Development Engineer- RF Microwave Circuits & Fitlers Design

Location:
Montclair, New Jersey, United States
Posted:
October 28, 2013
Email:
acai1h@r.postjobfree.com
Contact Info:
*****.******@*****.***


ASRES SEYOUM
Montclair New Jersey (551) ***-****
acai1h@r.postjobfree.com

SUMMARY
Electronics System Design Engineer with over 14 years of experience in
designing Test & Measurement Instruments that consist of Analog, Mixed
Signal, RF circuits, voltage regulation circuits design, Signal Integrity,
Multi Layer Printed Circuit Boards, FPGA design methodology, EMI mitigation
techniques, along with extensive component, board and system level
troubleshooting experience. Proven capability with high speed design
methodology and with all aspects of board level design cycles including
research, design, schematic capture, layer stack-up definition, high speed
signal simulation, HFSS (3D Electromagnetic finite element analysis)
simulations, board layout and post layout analysis. Creative engineer with
a keen ability to assess and conceptualize new designs, and recognized as a
subject matter expert in support and mentoring of new team members.

TECHNICAL COMPETENCIES
Circuit Design: Analog & Mixed Signal, RF & Microwave, Microcontroller,
FPGA, Multi layer PCB Design, Power Supply design: - Low Dropout Regulators
(LDO) and DC-DC converters
Package Design: Flip Chip BGA, LGA, Ceramic and Organic Package
Simulation & Design Software: HFSS, Ansys Designer, SIwave, PSpice,
Hyperlynx, and Cadence Allegro
Lab Equipment: Oscilloscopes, Logic Analyzers, TDR, Vector Network
Analyzer, Spectrum Analyzer
Interface Protocols: Ethernet, USB, I2C, SPI, PCIE

PROFESSIONAL EXPERIENCE
TELEDYNE LECROY, Chestnut Ridge, NY. 1999 -
2013
Product Development Engineer
Designed, analyzed and debugged Analog, Mixed Signal, and RF
Electronics circuits. Managed projects, generated project plan,
verification & validation plans, and item specification, and cost
estimates. Schematic entry, guided PCB layout, and worked directly
with sub-system partners and contract manufacturers for design and
integration of technology components, manufacturing and assembly of
PCB, PCAs, and subsystem assemblies.

Relevant Projects Designed & Implemented
. Back plane for the purpose of evaluation and validation of a custom
high speed digital trigger chip. This board connects standard off
the shelf ADCs, DDR3 memory using the custom trigger chip to a
conventional microprocessor via PCIE link to create a complete
digital oscilloscope acquisition system. It also included power
regulation circuits, voltage monitoring circuits, and a
microcontroller. The result of this design is pending future
evaluation.

. Data acquisition multi layer PC boards up to 20GHz input BW and 80GSPS
sample rate per channel. These data acquisition boards consist of Low
Noise Track & Hold Amplifier, high-speed ADC, Acquisition Memory, DC-DC
converters, LDOs, and other monitoring devices. These acquisition boards
are being used in several LeCroy's high end digital oscilloscopes. (Seven
different projects)

. Evaluation testers for Front End Amplifiers, ADCs, Memory chips, Track &
Hold Amplifiers that included power supply regulation circuits and other
control circuits. These parts are used in various types of LeCroy
oscilloscopes, and the evaluation board designs were migrated to the
intended oscilloscope design saving the company design time, evaluation
effort, and money.

. Fast Edge Step signal source with a 40ps rise time and very low jitter.
This signal source is being used on every high speed scope that LeCroy
makes, and it helps the user from having to find a Fast Edge Signal
Generator.

. Logic Analyzer Active Probe that included State Mode Clock inputs with a
1 ns minimum pulse width specification as part of a Mixed Signal
Oscilloscope design and development.

. Scope Synchronization Trigger Module to synchronize two oscilloscopes by
providing a high speed common trigger signal to both instruments via this
module. This allowed (telecommunication) customers to effectively double
the available input channels by using two independent high bandwidth
oscilloscopes as one unit when they to capture need high speed optical
telecom signals.

. 10 GHz Clock module using a DRO, 100MHz reference crystal oscillator,
power amplifiers and Wilkinson power dividers meeting the strict jitter
and phase noise requirement. This effort led to a timely and successful
launch of the Wave Master 8620A Oscilloscope.

. High Speed BGA and LGA Ceramic Packages for High Frequency ADCs, Analog
Amplifiers, and Track & Hold Amplifiers that range in bandwidth from DC
to 40GHz which were used in LeCroy's high performance oscilloscopes,
WaveMaster 8Zi, WavePro 7Zi, SDA 8Zi, and LabMaster 9 & 10Zi series.

. Performed several signal integrity simulations and analysis on various
acquisition systems high speed boards on signal types similar to DDR3,
SATA, PCIE, and Gigabit Ethernet applying S-Parameters from HFSS
simulations results to TDR analysis that led to pristine system
performance in insertion loss, return loss, cross talk, rise time, and
jitter.

. Mentored new members of the product development engineering team which
brought them up to speed with the product development cycle, company
culture, and group dynamics.

AROMAT CORPORATION, San Jose, CA.
1997
Quality Control Inspector
Inspected and tested Electromechanical Relays from various product lines in
the quality control department, and performed failure analysis as needed.

PRIOR EXPERIENCE
IBM San Jose CA, Wafer processing
Micro Machine Shop, Sunnyvale CA, Machinist

EDUCATION & PROFESSIONAL DEVELOPMENT

B.S. Electrical Engineering, Cal Poly State University, San Luis Obispo, CA
High Speed Signal Integrity with Dr. Howard Johnson,
Power Integrity with Dr. Eric Bogatin

EMPLOYMENT STATUS

US Citizen