Guy Harper

aca2dc@r.postjobfree.com

925-***-****

http://www.linkedin.com/in/guyharper

SUMMARY OF QUALIFICATIONS:

I am a leader of higher productivity towards profit via Engineering Project/Program Management, Industrial Engineering

and Lean Manufacturing. I have over 20 years of successes in semiconductor, data-storage, and solar wafer fab

engineering and operations leadership. I am a successful individual-contributor and manager and a great

communicator. I enjoy data analysis, problem solving, and driving concurrent technical project teams to success.

AREAS OF EXPERTISE AND VALUE ADD:

Project Management, PMP Factory Expansions and Relocations

Lean Manufacturing and Six Sigma Factory Layout and Equipment Installations

Capex Accounting and Reporting Staff Development, Team & Culture Building

Capital Budgeting and Management Cross-Functional Management

Due Diligence Management Capacity Modeling

Strategic Planning Domestic & International Technology Transfers

Internal and Supplier Quality Audits New Product Introduction

ISO 9001, extendable to GMP/FDA/TUV/CSA Excellent Communication Skills

PROFESSIONAL ACCOMPLISHMENTS:

Diamond Wire Materials Technology, Inc. (DMT), Colorado Springs, Colorado, July 2013 – Present

DMT is a member of the Meyer Burger Group of companies, headquartered in Switzerland, which manufactures equipment to

the photovoltaic solar energy manufacturing industry.

PROJECT MANAGER ON CONTRACT

Through my consultancy, Harper Project Management LLC, I am managing a project to develop an alternate supplier

for wire copper coatings.

The project involves cross-functional management of candidate suppliers of plated and clad copper processes and

services in multiple domestic and international time zones.

Harper Project Management LLC, Pleasanton, California, August 2012 – Present

Incorporating technical and organizational management skills acquired in my career, I began developing my own project

management consultancy, which I use to facilitate project management career opportunities until my next employee status.

PROJECT MANAGER/PMP

Summarized career project management examples and hours applied per process area for PMI approval.

Completed training hours from authorized provider. Studied and sat for PMI’s PMP credential exam.

SoloPower, Inc., Sunnyvale, California, December 2011 – January 2012

SoloPower is a thin film solar energy module manufacturer funded by the same VC as Calisolar. Calisolar’s CEO

recommended me to their executive staff.

PROJECT MANAGER

Project management of contractor qualification, budget, and selection process for factory build-out in Portland

Oregon.

Successfully managed the identification, evaluation, and selection project for mechanical, electrical, and general

contractors for SoloPower’s factory equipment installation project.

Calisolar, Inc., Sunnyvale, California, January 2010 – October 2011

Calisolar is a world leader in Photovoltaic silicon feedstock and solar cell technology.

ENGINEERING PROJECTS DIRECTOR

Co-management, authorship of successful $275M DOE loan guarantee and due diligence project

Manager of factory site selection and host government incentive process for factory expansion

Direction of factory expansion team and EPC design-build contractor

Productivity improvements and program management

Author and manager of annual capital budgets

Creation and use of capacity models for capital planning per business plan scenarios

Western Digital Corporation, Fremont, California, Sep 2003 - Dec 2008

Western Digital makes data storage disk drives for the desktop, laptop, enterprise and consumer electronics.

SR. MANAGER OF INDUSTRIAL ENGINEERING & STRATEGIC PLANNING

Managed factory expansion space planning and layout design from 65,000 to 105,000 square feet to accommodate

additional manufacturing and technology development resources.

Managed layout and design of new factory space and logistics for successful relocation of major manufacturing

equipment and offices between buildings.

Enabled annual business revenue growth from $3.5B to $8.2B between FQ204 and FQ109 via successful

management of 4X effective wafer-fab capacity increase.

Managed capital approvals/investments of up to $50M per quarter towards capacity and technology growth.

Authored and managed annual capital budgets up to $195M for timely procurement and integration of the required

manufacturing resources per business plan capacity and capability needs.

Successfully managed 51% in Capex reductions for FY09 capital budget (> $97M in cuts) in response to 2008

forecast reductions and economic downturn.

Successfully lead team investigating optimal “Greenfield” wafer fab host government subsidies and construction

project between Ireland, New York State, China, Malaysia and Singapore.

Communicant Semiconductor Technologies, AG, Berlin and Frankfurt (Oder), Gm. 2001-2003

Communicant was a $1.3B semiconductor start-up funded by Intel, the Brandenburg government, and Dubai. It specialized in

CMOS and SiGe:C BiCMOS process technologies at sub 0.25 um design rules.

DIRECTOR OF MANUFACTURING, START-UP CAPITAL PLANNING

I directed and ensured the proper process equipment selection, specification, line balancing and Manufacturing Department

infrastructure in order to meet business plan goals and forecast.

Co-directed the Wafer Fab Operations start-up: $700M process equipment capital budget, SMIF

Automation and line balancing activities for an international semiconductor foundry start-up (CST).

Co-directed and assisted the Equipment and Process Engineering teams in the definition,

specification and selection of wafer fab equipment resources

Directed Communicant’s Industrial Engineering department and third-party international industrial

engineering firm in the capacity-modeling and line-balancing project. Summarized the wafer fab capital-expenditure

requirements for different business plan and product/technology mix scenarios.

Defined and approved wafer fab design and layout via co-direction of General Contractor,

Architectural and Industrial Engineering resources.

Defined wafer fab material tracking logistics and wafer fab automation details with IT peers.

Defined Manufacturing organization infrastructure, staffing plans, materials and procedures.

Headway Technologies, Inc., A TDK Group Company, Milpitas, CA. 1997-2001

Headway is a designer and manufacturer of magnetic recording heads for the data storage industry.

DIRECTOR OF EQUIPMENT ENGINEERING AND INDUSTRIAL ENGINEERING

At Headway I developed and managed fab expansion capital budgets, future fab layout, capital equipment selection,

procurement, installation and integration. Equipment availability, MTBF, MTTR, OEE improvements.

Directed a successful wafer fab expansion project that increased overall fab space from 16,000 to approximately

60,000 square feet. Principal manager of capital equipment budget and timeline.

Successfully managed layout and traffic for all new and relocated manufacturing equipment.

Saved greater than $19M in capacity expansion capital equipment costs via procurement and refurbishment of

tools from the surplus equipment market.

Improved process capability and technology competitiveness via successful management of

substrate form factor conversion from 4.5” square to 6” round substrates.

Directed the successful procurement, installation and integration of > $150M in wafer fab manufacturing equipment

towards realizing company business plans for increased capacity.

Improved wafer fab capacity by > 200% and lowered cycle-time via direction of I.E. department

facilitization of cross-functional work teams.

Directed mechanical and electronic readiness for all wafer fab manufacturing equipment including

successful upgrades to over 270 tools from greater than 55 OEMs.

Inter-Connect Technology, Inc. Sunnyvale, CA 1/97-8/97

Inter-Connect Technology is a semiconductor fab now operating as 1stSilicon, Malaysia.

THIN FILMS ENGINEERING MANAGER, DIRECTOR OF MANUFACTURING

Managed the 0.35 um process technology transfer between InterConnect’s technology partner, Sharp Electronics Japan,

and InterConnect.

Defined the Manufacturing Operations department infrastructure, headcount and material budgets for major “Greenfield”

wafer fab start-up.

Defined 200 mm SMIF capital equipment selection & configuration for Kuching, Sarawak, Malaysia Mega Fab (ICT-1) for

0.25 um and 0.35 um business plans.

Established theoretical and target cycle-times for the 0.25 um and 0.35 um process flows along with their respective

equipment and direct labor resource requirements.

Wrote 5-year budgetary forecasts for the Manufacturing Departments and defined all costs and timelines for

manufacturing staffing and material needs based on business plans.

TESTIMONIALS AND PROFESSIONAL REFERENCES

Please see http://www.linkedin.com/in/guyharper

EDUCATION

California State University, East Bay

Lean Enterprise Master Certification

PMI Credentialed PMP

California State University, Hayward

Additional Technical Training:

Project Management. Skillpath Seminars

Cycle Time Management Styles. Fab-Time, Santa Clara

AutoCAD 2000i Training, Micro Solutions, Santa Clara

Supply Chain Management, Chance and Robinson seminar

Simulation Project Management, Chance and Robinson seminar

GMR Head Manufacturing, KnowledgeTek

Cleanroom Design, Layout and Construction for Submicron ULSI. Burtech

Statistical Process Control Workshop. Fred Khorasani, PhD

Statistical Design of Experiments (DOE). Richard Post, PhD

Effective Quality Auditing Workshop. Brewer-Kleckner Education

Taguchi Methods for Quality Engineering. American Supplier Institute

Management Training Accomplished:

Zenger-Miller Frontline Leadership Series

Organizational Development and Team Building, VLSI

Process Flow Mapping for Organizational Improvement, Rummler/Brache

Systematic Project Management, Business Processes, Inc.

Dale Carnegie Course

Developing Self-Managed Work Centers. AMES, Nashville, Tenn.

Behavioral Interviewing. Behavioral Technology, Inc.

Situational Leadership. Phoenix Associates, Inc.

Organizational Law and Ethics. Kinicki and Associates

Conflict and Communication. Chloe Ann Hanken Associates

Performance Management. Kinicki and Associates

Software and Hardware Expertise:

Microsoft Office Excel, Powerpoint, Word, Microsoft Project.

WWK Factory Explorer and AutoSched AP Capacity & Discrete Event Modeling Software

Workstream, Promis 5.0, Fastech FactoryWorks and Camstar MESA MES systems.

PATENTS AND PUBLICATIONS

U.S. Patent Number 5,019,234

“System and Method for Depositing Tungsten/Titanium Films”, Guy Harper.

U.S. Patent (Open patent activity)

“Adhesion Enhancement Shield” David Henderson and Guy Harper

“Optimized Metallization Processing for Improved Manufacturability” (with Chowdhurry, Brugge, et al) 1992 IEEE/SEMI

Advanced Semiconductor Manufacturing Conference.

“The Effect of HF-Last Clean Process Sequence on Gate Oxide Integrity” (with Dimetrellis, Kroonblawd, et al). 1992

Electrochemical Society Meeting, New Orleans.

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