Yudong Ming

**** ****** ******

847-***-****

Hoffman Estates, IL 60192

Email: abquou@r.postjobfree.com

SUMMARY

Accomplished professional with proven expertise in Manufacturing

Engineering, Quality Assurance, Micromachining (MEMS), Nanotechnology and

Semiconductor industries. Member of numerous teams that improved

throughput, product quality and customer satisfaction. Led or participated

in capital projects, engineering and new product development teams. Worked

well with both internal and external suppliers and customers. Effective

collaborator with major strengths in developing production processes,

identifying and implementing quality and yield improvements,

troubleshooting and problem solving using structured and effective methods.

PROFESSIONAL EXPERIENCE/ SELECTED ACCOMPLISHMENTS

Nanoink, Inc, Skokie, IL

2010 - 2013

NanoInk, Inc. is a nanotechnology company specializing in nanometer-scale

manufacturing and applications development for the life sciences,

engineering, pharmaceutical, and education industries.

Manufacturing Engineer

. Developed and improved manufacturing processes for NanoGuardian and

NanoFabrication product lines.

o Developed and improved epoxy stenciling process, reduced failure to

0% from 20%.

o Investigated root cause and reduced die leveling failure to 0.6%

from 10%

o Reduced 40% of cycle time and 50% of materials for micromachining

process.

. Developed and implemented inspection tests and methods for

nanofabrication.

o Established and implemented inspection tests and methods for

incoming electrical and mechanical components.

o Developed and conducted electrical, mechanical and operational in-

process tests and inspection methods including adhesion,

planarization, stenciling processes and load cell operations.

o Extensive use of microscopy methods for problem and cause

identification.

. Initiated and enhanced procedures for operation of micromachining,

nanofabrication processes, instrument assemblies and production testing.

. Introduced new products, processes, assemblies from engineering phase to

production.

. Worked with suppliers and customers to improve process and product

quality.

o Significantly improved laser cut uniformity for dicing process.

o Identified root cause and improved process to prevent recurrence

for die adhesion failure.

. Processes, assembly, test and analysis involved: silicon etch, gold etch,

critical cleaning of components, stenciling, dicing, pick & place, die

attach, fixture assembly, instrument assembly, surface analysis

(profilometry, SEM, SIMS), EDX analysis, adhesion strength test, laser

die leveling test, contact angle.

. Trained and certified manufacturing personnel in micromachining and

nanofabrication.

Continental Automotive System, Northbrook, IL

2006 - 2009

Motorola, Inc, Northbrook, IL

1997 - 2006

Continental is one of the world's top automotive suppliers. Northbrook

facility (Sensor Element Manufacturing) supports the business

by providing elements for the pressure sensor products. This facility was

a former division of Motorola, Inc until its spin-off in 2006.

Senior MEMS Process and Manufacturing Engineer

. Designed, developed and maintained micromachining (MEMS) equipment, tools

(etch fixtures) and etch processes for ECE (electro-chemical etch stop)

and HF strip.

Yudong Ming

. Improved and sustained micromachining process, quality and yield.

o Improved discrete product yield to over 99% from 70%.

o Saved $1.2 million annually with new front protect process for IC

product.

o Reduced low span fallouts to 4000 PPM from 20000 PPM on IC product.

. Documented and updated procedures for operation, inspection and

maintenance of micromachining process.

. Launched production on several new products and worked closely with new

suppliers to qualify existing products.

o Ensured documentation complete, staff trained and materials,

processes and quality assurance measurements communicated and

followed throughout launch of new production.

. Processes involved: wafer clean, coat, align, develop, RIE, plasma

photoresist strip, wet chemical etch, HF strip, fixture assembly, thin

film measurement, wafer and diaphragm thickness measurement (FTIR),

defect inspection and failure analysis.

. Worked with suppliers and customers to address product quality.

o Reduced fallout of PECVD silicon oxynitride to 2% from 40%.

o Improved nonlinearity to 0.5% from 2-8% for discrete DPF Ford

product.

. Implemented cost reductions; improved quality and yields by 30%, reduced

cycle time by 10% and decreased chemical usage by 60%.

. Set up models for machine capacity and labor calculation; provide

information to management for budget forecast of capital and labor.

. Trained and certified operators in completion of job duties.

University of Illinois at Chicago, Chicago, IL

1994 - 1996

Chartered in 1867, the Chicago campus opened in 1965. The Nanotechnology

Core Facility (NCF was

called MAL, Microfabrication Applications Laboratory) is a versatile

MEMS/Nano facility.

Research Assistant (Microfabrication Applications Laboratory, Electrical

Engineering Department)

. Researched growth and morphology of ultrathin metal film immunosensor for

detection of toxins in food using Atomic Force Microscope (AFM) imaging.

o Defined platinum and gold deposition conditions. Documented

stability of morphology of films evaluated by electrical resistance

changes on films.

o Processes involved wafer clean, dry and wet oxidation, diffusion,

photolithography (coat, develop, align, photo resist strip), metal

wet etch, metal lift-off, metal deposition (e-beam evaporation,

sputtering), annealing, AutoCAD (mask design) and AFM.

. Other projects involved: Design project for CMOS devices (Cadence used),

Pressure sensor (bulk micromachining including wafer bonding), Comb drive

and microstage (surface micromachining) and Mucus sensor.

. Coursework: Introduction to VLSI design, Integrated circuit engineering,

Semiconductor physics and Microelectronic fabrication devices.

The University of Central Oklahoma, Edmond, OK

1992 - 1993

Founded in 1890, the oldest institution of higher learning in Oklahoma. UCO

is a thriving, metropolitan university with a current enrollment of

approximately 16,000 students.

Research Assistant (Physics Department)

. Investigated light scattering by spherical particles for the purpose of

understanding how a laser beam refracts when hitting rounded tissue.

o Research included calculation of angular distribution functions of

light scattered by spherical particles as a model for light

propagation in tissue using mathematical and physical methods.

Yudong Ming

The results used to calculate attenuation in the light intensity

due to scattering of light in any direction.

Shanghai Radio Factory, Shanghai, China

1988 - 1991

A wafer fabrication manufacturer producing low to medium power bipolar

transistors.

Assistant Wafer Fabrication Engineer

. Completed assignments in sustaining wafer fabrication processes (wafer

clean, oxidation, diffusion, and photolithography) which affected yield

and product quality.

o Tested common-emitter current gain and breakdown voltage after

processing and ensured product specifications met and

maintained.

PROFESSIONAL DEVELOPMENT

8D Problem Solving (Root cause investigation)

Process: MEMS, Nanotechnology and Semiconductor

Quality System: Process Flow, Control Plan, FMEA, CARs, TS16949, ISO9001

Statistics: Basic Statistics (ANOVA, regression and so on), Six Sigma,

Process Capability (Cpk, Ppk), Statistical Process Control (SPC),

Measurement System Analysis (GR&R and Gage BLS), Design of Experiments

(DOE)

Statistical Software Tools: Minitab and JMP

Others: MS Word, Excel, PPT, ImageJ, Cadence, Silvaco, Cycle Time, Machine

Capacity, Labor Calculation

EDUCATION

Master of Science in Electrical Engineering from the University of Illinois

at Chicago

Master of Science in Applied and Industrial Physics from the University of

Central Oklahoma

Bachelor of Science in Semiconductor Physics and Device, Shanghai

University of Science and Technology

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