Umakant Patel

**** ***** *****, *****, ** *****.

PH: 908-***-****

908-***-**** (Cell)

Email: abmdc5@r.postjobfree.com

SUMMARY

Highly motivated, confident and result oriented, with a proven track

record of developing a small to large scale of products from concept to

manufacturing in dynamic business environments.

( Excel in thermal and mechanical design, development and testing of

electronics systems particularly for telecommunication, microwave,

wireless networks, optical networks, television broadcasting, video

networking and video security industries.

( Extensive mechanical design and manufacturing experience in

electronics circuit and system level packaging, electronics enclosure

and sheet metal chassis design, fiber optic packaging, sheet metal NEMA

enclosure design, circuit pack hardware, electrical and optical cable

harnesses and backplane design.

( Expert in Flotherm and Flopack for thermal analysis, Solidworks and

Pro/Engineer wildfire and Creo for mechanical design and solid

modeling, Windchil for project management and product life cycle

management, PDMLink and Pro Intralink 3.4 for database management.

( Coordinated system level compliance and regulatory tests per

Telcordia NEBS GR-63-CORE, ETSI, CSA and UL for products qualification.

Closely worked with NRTL certified laboratories and conducted various

environmental tests.

( Knowledge of different manufacturing processes such as sheet metal

manufacturing, metal machining, forming, organic and inorganic

finishes, plastic injection molding, aluminum diecast. Broad experience

in manufacturing, Statistical Process Control (SPC), tolerance analysis

and quality engineering area.

( Coordinated and managed activities with contract manufacturer and

suppliers for smooth product transition to manufacturing.

EMPLOYMENT HISTORY

Ultra Electronics/3eTI, 9715 Key West Ave, Rockville, MD 20850.

Senior Mechanical Engineer (October 2009 - Present)

-Responsible for mechanical thermal design of secure wireless

communication network equipments for US Navy, Military, industrial and

commercial markets. Designed sheet metal and NEMA 4X indoor and outdoor

electronics enclosures.

-Electronics packaging system design in ruggedized military transport

cases and COTS enclosures.

Wipro Technologies, 2 Tower Center Blvd, 22nd Floor, East Brunswick, NJ

08816.

Senior Project Manager (March 2008 - July 2009)

-Worked onsite for a major telecommunication equipment manufacturer

client to manage new and sustain engineering projects and mechanical

design of fiber optics transmission equipments. Was responsible for

circuit and system level packaging design of telecom products. Achieved

a huge cost reduction by redesigning the existing high volume product

line.

-Effectively communicated with the offshore design team to develop

products at the offshore development center and managed product design

related activities with the offshore teams.

-Personnel management of small group of offshore development center at

client site.

Pelco, 10 Corporate Drive, Orangeburg, NY 10962

Mechanical Engineer IV (January 2006 - March 2008)

-Was responsible for mechanical and thermal design of various video

networking equipments such as HD video decoder, encoder, DVR, NVR, UTP

and fiber optic transmitter. Designed rack mount enclosures for 8-Ch,

16-Ch and 32-Ch active UTP receivers. Performed thermal analysis

utilizing Flotherm 7.2V and Flopack software for natural and forced

convection cooling criteria. Prepared detailed thermal report for each

simulation.

-Was responsible for cooling fan selection based on total system power

dissipation and performed flow simulation for systems considering fan

fail criteria. Selected heatsinks, thermal interface materials and gap

pads for critical electronics components.

-Documented piece part and assembly drawings using Pro/E Wildfire 3.0

and Pro Intralink 3.4. Generated engineering BOM and transferred design

documents to factory for production thru ECO. Monitored and shared

project progress by using Projectlink 8.0 and Windchill software.

Nucomm Inc., 101 Bilby Road, Hackettstown, NJ 07840.

Senior Mechanical Engineer (June 2004 - September 2005)

-Was responsible for mechanical design and electronics circuit

packaging of microwave and RF equipments for wireless and television

broadcasting industries.

-Designed mechanical piece parts and housing for digital and analog

wireless transmitters and booster amplifiers for 2 GHz and 7 GHz

frequencies.

Tx Rx Systems Inc., 8625 Industrial Pkwy, Angola, NY 14006.

Senior Mechanical Engineer (May 2003 - June 2004)

-Mechanical design and system packaging of bidirectional amplifier

(Signal Booster) for 800 MHz, 900 MHz, 400 MHz and NPSPAC frequencies

in NEMA box type 4 and 4X for wireless communication industries and

public safety sectors.

-Designed heatsinks for power amplifier assemblies and designed

efficient layout of components for better thermal management of system.

-Housing designed for power amplifiers, band pass resonant filters and

cavity filters for different bandwidth and NPSPAC frequencies.

Mechanical layout of electrical backplane and designed multi slot sheet

metal enclosure.

-Designed common mechanical hardware for efficient layout to package

different system configuration in the same size NEMA enclosure for cost

savings and to offer compact product footprint.

-Managed and coordinated prototype program.

Photuris, Inc., 20 Corporate Place South, Piscataway, New Jersey 08854.

Mechanical Engineer (January 2001-June 2002)

-Designed optical backplane specifications, optical connectivity

matrix and fiber management elements.

( Designed custom fixtures and cleaning kit to clean MPX and LC optical

connector system from the front of subrack.

-Wrote detailed optical backplane installation and optical connector

cleaning procedures. Prepared requirements and cost estimate to inspect

optical backplane for IL and RL for final test.

-Interacted with the multifiber optical connector vendors and assisted

to evaluate the MPX and LC product qualification.

-Mechanical design of the hot swappable power supply units for ROADM

system.

-Created detailed design specification of molded connector for "Smart

Cable" and all electrical harnesses.

-Utilized Pro/Engineer CAD package to design enclosures, housings and

sheet metal components to package optical modules.

-Prepared complete Laser Safety product report as per 21CFR1040.10

specification to comply FDA/CDRH requirements for product

certification. Implemented model plan, coordinated purchasing of all

material, RFQ and delivery schedules.

Lucent Technologies (Bell Laboratories), New Jersey.

Member of Technical Staff (MTS) (February 1995-January 2001)

-Designed sheet metal chassis, electronics enclosure, circuit pack

hardware and rack mount products for network wireless, switching and

access systems for indoor and out door environment utilizing

Pro/Engineer CAD package.

-Performed thermal analysis and conducted thermal tests utilizing

thermal chamber. Designed heatsinks for high power critical components.

Maximized thermal performance by effective components placement on PCB.

-Designed basic board and sub-panels for very complex, highly dense

multilayer PCB. Interfaced with external PCB design houses, fabrication

and assembly vendors to maintain quality requirements and to ensure

schedule compliance. Coordinated with internal design group to transfer

artwork file (Gerber file), drill information, profile data and test

data files to vendor in timely fashion. Worked with PCB vendors to

obtain stack up information based on the control impedance

requirements. Submitted components foot print and specification into

library for new products. Reviewed component kits for completeness and

procured components for circuit packs for prototype models.

-Coordinated compliance and regulatory tests for EMC, ESD, thermal,

office vibration and earthquake test per Telcordia specifications such

as GR-63-CORE and GR-1089-CORE.

-Performed design engineering functions and responsibilities including

developing design specifications, final approval of drawings and

specifications utilizing Pro/Engineer. Assisted project management by

providing schedule, planning, status and cost information on designs.

-Interfaced with product engineers at factory to assure successful and

efficient introduction of product from development to manufacturing.

Participated in DFM review with factory and released ongoing change

controls to factory by issuing PDI. Performed comprehensive cost

analysis on existing project and suggested design and manufacturing

changes to reduce COGS.

ESNA Div. of Harvard Industries Inc., 2330 Vauxhall Road, Union, NJ

07083.

Manufacturing Engineer (April 1987-February 1995)

-Designed and implemented Process Certification Plan as per Boeing

D1/9000 guidelines.

-Designed and implemented JIT Work Cell for family of products to

reduce cost and improves productivity.

-Designed manufacturing fixtures, created 3D assemblies and detailed

drawings utilizing solid modeling CAD package.

-Designed, implemented and administered Statistical Process Control

System in all manufacturing departments. Monitored key process

characteristics dimensions and conducted process capability studies.

-Provided SPC training to management and shop floor personnel.

Nesor Alloy Corporation, 666 Passaic Ave., West Caldwell, New Jersey.

Quality Inspector (April 1986-March 1987)

-Inspected electrical and mechanical properties of different alloy

cables. Prepared complete QA report.

EDUCATION:

M. S. in Mechanical Engineering.

May 1991

New Jersey Institute of Technology, Newark, New Jersey.

B. S. in Mechanical Engineering.

July 1984

S. P. University, India.

PERSONAL: US Citizen, Married.

REFERENCES: Available upon request.

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