James Shen
*** ***** ***** *****, ****, NC *****
919-***-**** (H), abl9id@r.postjobfree.com
Qualification Summary
. Analog circuit design.
. Semiconductor process integration and device development of CMOS,
Bipolar, NVM, DMOS, HV devices, and various passives. Extensive bench
testing for device performance and reliability characterization. Yield
enhancement. Product failure analysis.
Semtech Corp., Sr. Process and Design Integration engineer Raleigh,
NC 2007 - 2008
Joined development of a 0.18um BCD process for power management with
a foundry, and joined setup of a new design kit (PDK):
Development of Low Rdson and low leakage CMOS, Bipolar, DMOS,
passives.
Design rules, DRC deck, LVS, Pcells, Calibre, EDR, Designed test
structures and circuits for PCM, for accurate SPICE and MC modeling
extraction and modeling validation, and for silicon debugging. Mask tape
out procedures.
Designed Buck converters for device and process development
evaluation. Product yield enhancement. Unix, C.
Atmel Corp., Sr. lvl Process Integration/Analog Design/Process Colo.
Springs, CO 1994 - 2007
Analog design
Designed a SAW oscillator of 433 MHz circuit with RF PA output in a
SiGe BiCMOS technology.
Designed capacitive based evaluation circuits for 8bit ADC and DAC in
a 0.18um technology.
Helped design activities on the technologies I have developed, and
circuit debugging.
Process Integration/Device Development
Were responsible for every thing needed to develop a new process
technology from beginning to its releasing to high volume production:
Process integration and Device development of CMOS, Bipolar, NVM and
memory cell design, DMOS, HV devices, and various passives. Process Flows.
Design rules. Process and Device simulation (Silvaco). Parametric test
structure design (I drew them by myself) and Parametric testing conditions
and limits for both development and for manufacturing (PCM). Test
structures for Spice modeling. Tape out procedures. Performed bench testing
extensively on silicon wafers for device performance and reliability
characterization.
As the principal development engineer for an embedded BiCMOS EERPOM
technology have developed the technology on 0.35um, and 0.18um process
nodes into high volume production.
Joined development of the technology on 0.5um mode.
Joined a SONOS Flash memory technology development on 0.13um node.
Jointly developed embedded CMOS EEPROM process technologies with DMOS
of supporting 40v and 100v.
Yield enhancement on products (technology drivers) of each technology
to reach yield goal of above 80% before releasing the technology to
manufacturing groups or to external foundries.
Optimized ATE test plan for yield enhancement.
Yield Enhancement in Process engineering
Have brought up the in-line defect inspection/reduction program for
the company. Correlated product probing results and parametric test results
to in-line measurements to identify process, technology, or design
problems. Characterized and solved process defect problems in etch, photo
lithography, metals, dielectric films, and CMP by inspections, and by
performing DOE, Statistical Process Control (SPC) and ANOVA to either
identify problems or to fix or to improve process and yield. Sometimes
acted as a module process engineer in etch and in photo to improve process
recipes. Evaluated, recommended and brought up inspection equipment of SEM,
X-ray chemical component analysis, KLA, Tencor, and yield analysis
programs. Jointly evaluated FIB, SIMS, Auger, and AFM with Failure Analysis
Lab.
National Semiconductor, Product engineer, Arlington, TX 1992
-1994
As the only college hire in the start up team, have joined the transfer of
a 0.8um CMOS process from the R&D center to a new fab and process/product
qualification of the fab. Improved a yield modeling package linking
electrical monitors to product layout.
Education:
M.S.E.E, Microelectronics Research Center, University of Texas at
Austin 1992
B.S., Physics, Tong-Ji University, Shanghai, China
1988
Computer Science, NC State, C++, Unix, Java I, Java II, SQL, Oracle
database 2009