SCOTT BERGMAN

**** ********** **. *********, **** 43125 614-***-**** H

abl42h@r.postjobfree.com

PROFESSIONAL EXPERIENCE

Principle Process Engineer

Andrew Corporation (RF Power Amplifiers/Transceivers), Westerville, OH

2004-Present

Sr. Manufacturing Engineer/Project Manager

Celestica Corporation (Electronics Contract Manufacturer), Columbus, OH

2001-2004

SMT/NPI Manufacturing Engineer

Lucent Technologies (Wireless Communications), Columbus, OH 1996-

2001

Manufacturing Process Engineer

AT&T (Network Wireless Systems), Columbus, OH 1991-1996

PROFESSIONAL ACCOMPLISHMENTS

Process Development Engineering

o Developed efficient manufacturing processes for power amplifiers

(Andrew, Nortel, and Lucent products)

o Managed a technology timeline for production equipment to ensure

ongoing competitive process capabilities

o Led the transition of products and processes to comply to Pb-free/

RoHS customer requirements

o Contributed to the development of a corporate Design For

Manufacturing Guidelines for PCB Design

o Contributed to the process development of power transistor

soldering and bonded amplifier boards (patented)

o Developed a solder-less interconnection method for high mass power

modules (patented)

o Performed a DOE (design of experiments) to optimize pad layout

design for advanced SMT components

o Implemented a re-designed amplifier which reduced manual soldering

by 70% and manuf. interval by 25%

o Designed and implemented progressive assembly lines, shortening the

build times by 30-40%

NPI - New Product Introduction Lead

o Liaison during NPI between the design communities and volume

manufacturing facilities

o Coordinated DFM reviews, model builds, and post build reviews for

prototypes through pilot production

o Advanced the miniaturization of our products by

reviewing/qualifying new components available on market.

o Stayed informed of all new industry and technological advances;

Maintained our PCB Design DFM Guidelines and corporate

documentation in accordance with these advances

o Evaluated the advantages vs. assembly risks of utilizing newly

introduced electrical components

o Developed simulation software that accurately predicted volume

labor costs early in the prototyping phase

Global Manufacturing Technical Support - RF Power Amplifiers, Radios,

Digital products, and Filters

o Provided DFM analysis and technical process support to design teams

in Europe, Asia, and North America

o Provided new product introduction guidance, equipment training, and

troubleshooting assistance to many manufacturing sites around the

globe (Visited sites in Canada, Mexico, Brazil, China, Italy, and

U.S.)

o Contributed to the design and implementation of a new circuit board

assembly facility in Campinas, Brazil

o Joined several audit teams to benchmark and evaluate the

manufacturing capabilities of many electronic contract

manufacturers as well as glean best practices from other

manufacturing industries

o Supported global FMA and reliability groups in evaluating customer

returns and product failures.

SMT (Surface Mount Technology) Process Engineering Lead

o Subject matter expert in process areas of stencil printing, solder

paste, stencil design and oven reflow

o Partnered with MPM as a launch site for new technologies; UP3000

stencil printers, Rheometric pumphead

o Directed the specification, procurement, and installation of 17

automatic stencil printers

o Implemented a new formulation of solder paste which minimized the

effects of humidity and eliminated tombstoning solder defects

o Knowledgeable of key SMT processes; component placement, oven

reflow, robotic soldering, AOI, and SPC.

o Developed solder paste stencil designs for over 350 circuit boards,

including step, dual, and adhesive designs

Member of the AT&T High Velocity Factory Team - Lean Factory Layout Project

o Re-engineered and transformed a 500,000 sq ft factory floor into a

lean, JIT operation that reduced electronic product build intervals

from weeks to days while maintaining less than 5 days of WIP (work

in process)

o Developed computer simulation models of each assembly cell to

verify concepts before implementation (Witness)

o Directed tradesmen and contractors in a 24/7 coordinated effort to

clear floor space and install new equipment while maintaining the

current production operations

o Engineered and implemented a circuit board assembly kanban system

(inventory control system)

o Completed the project in just over 1 year from concept to full

implementation. Project was totally funded by the realized

efficiency savings of the following year

o Worked jointly with the Quality group to incorporate six sigma

strategies (control charts, paretos, design of experiments, Deming

methods, root cause analysis, and process capability)

Project Management / Product Engineering

o Directed New Product Introduction (NPI) for Nortel Networks'

Amplifier /Radio products, key components of their Wireless Base

Stations (800- 2100 MHz). Product engineering responsibilities

included: project scheduling, BOM's, model builds, ECO management,

certifications, and customer interfacing

o Led PWB commodity group's cost reduction efforts which reduced

their cost by 10% ($550K in 2010)

o Successfully transferred Nortel Networks' Amplifier and Radio

products from Toronto site into the Suzhou, China and Campinas,

Brazil sites within the targeted 5 month period

o Coordinated transfer of all NPI activities from Columbus to Toronto

upon closing of the facility (13 products)

EDUCATION

B.S. Mechanical Engineering - The Ohio State University, Columbus, OH

M.S. Industrial Engineering - Purdue University, West Lafayette, IN

TECHNICAL AWARDS / US PATENTS/ HONORS

Awards: Gold Award - AT&T Quality Council - Flex Connector QI Story,

1992

Gold Award - AT&T Quality Council - High Velocity Factory

Design, 1995

AT&T Award for Engineering Innovation - Design of High Velocity

Factory 1996

U.S. Patents: Apparatus and Method for Solder Attachment of High

Powered Transistors to Base Heatsink

2001 Patent #US 6,276,593 B1 (Joint Ownership)

Bottom entry interconnection element for connecting components

to a circuit board

2009 Patent # US 7,581,965 (Joint Ownership)

Honors: Valedictorian - Minster Local High School, Minster OH

ADDITIONAL TRAINING / SOFTWARE

Training: IPC 610C certification - ISO9000 - Process Capability -

Statistical Process Control

Equipment training - Advanced Application of MPM stencil

printers, UP Series, AP series

Software: MS Office - CAM350 - Mentor Graphics PADS - SAP

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