Nicholas C. Mescia

**** ********* ***** ***** *******, NC 27540

(C) 919-***-**** (H) 919-***-****

ab7ai2@r.postjobfree.com

SUMMARY

Experience hard working, hands-on, goal oriented multi-disciplined manager

and / or engineer with special in-depth and proven experience in process

development & manufacturing, including box build for both internal and

external customers. Team player who thrives on customer satisfaction and On-

Time-Delivery.

CORE COMPENTENCIES

New Product Development & Technology Introduction Implementation of NPI to

production

Quality Assurance in Assembly and PWB Fabrication Customer & Vendor

Management

BGA/LGA Development (Automotive) Program Management (Working on

PMP)

PROFESSIONAL EXPERIENCE

SMTNICK Associates, LLC 10/2009 -

Present

PROCESS / MANUFACTURING / INDUSTRIALIZATION CONSULTANT

. Process / manufacturing line auditing with associated recommendations

(comp., PCBA, & box).

. Developing procedures for ISO certification(s).

. Developing processes (BGA Underfilling) and products (Conformal

coating and encapsulation).

. Developing / mapping company Quality Manuals in regards to IPC-A-610

& IPC-A-600.

Digital Safety Technologies, RTP, NC

4/2009 - 8/2011 MANUFACTURING / INDUSTRIALIZATION ENGINEER

. CM interface for successful transfer of existing Non-RoHS product to

RoHS product.

. CM interface for successful manufacturing of new RoHS compliant

product, including box build.

Wavecom (Sierra Wireless), RTP, NC (Initially contract, then permanent,

consultant) 2006 - 2011

TECHNICAL PROGRAM MANAGER / INDUSTRIALIZATION CONSULTANT ENGINEER

. Team member for successful transfer of products from Mexico to China

(80% value add savings)

. Team member for successful domestic prototype builds (NPI) with

migration of high volume production to China (Denso awarded team

first non-Japanese vendor contract .

. Technical consultant for Pb free PCBA modules (PCB, SMT, PTH

(including Pb free wave soldering, BGA/LGA development with underfill

for automotive qualification), & box build.

Nanolytics, Raleigh, NC 2004 -

2006

GROUP LEADER: Micro-fabrication

. Engineering team for developing DNA detection "Lab-on-Chip" for Homeland

Security.

Celestica North Carolina, Morrisville, NC 2001

- 2004

ENGINEERING MANAGER (Data, Product, Process, Test, and Fiber Optics)

Manager of NPI Engineers for support for PCBA and Box, for Gateway / NPI

Tier 1 EMS

. Managed engineering team that was awarded several "Corporate Best

Practices".

. Researched, implemented, and qualified 0201 passive attachment, and Pb

free assemblies that extended PCA technical capabilities, to allow new

customer products and additional revenue.

. Implemented and qualified "Optical Value Add" that extended PCA technical

capabilities, to acquire new customer products and additional revenue.

. Assisted Corporate Sales and Marketing to secure greater than $300 M

annual corporate revenue.

Ciena, Columbia, MD Area

2001

PROCUREMENT ENGINEER / SMT SUPPLIER QUALITY ENGINEER

PWB / Backplane / Printed Circuit Board Assemblies (PCBA) Supply Line

Engineer for outsourcing

. Qualified and maintained outsourcing PCBA vendors including optical

value add for cost advantages due to increased workload to avoid

expensive capital expenditures.

. Audited and determined root cause analysis of vendor's poor quality of

flex assemblies, such that the first pass yield was drastically

improved, permitting required shipment of sub-assemblies to allow

product build achieving committed On-Time-Delivery dates.

General Dynamics ATS, Greensboro, NC

2000 - 2001

PRINCIPAL / PROCUREMENT / SUPPLY LINE ENGINEER (Member of the Technical

Staff)

Qualified outsourcing PWB / Backplanes / Printed Circuit Board Assemblies

(PCBA) vendors (Including military vendors), to acquire sub-assemblies

to allow product build avoiding severe penalties ($Millions) for

missing committed "On-Time-Delivery" dates.

. Worked with vendors to improve quality and delivery of sub-assemblies,

that enabled product build and delivery meeting committed On-Time-

Delivery that drastically improved customer satisfaction which

resulted in increased orders of $30 to $50 M.

Siemens Energy and Automation, Johnson City, TN 1995 - 2000

PROCESS DEVELOPMENT MANAGER / NEW PRODUCT INTRODUCTION MANAGER / SENIOR

MANUFACTURING ENGINEER / PWB & COMPONENT ENGINEERING CONSULTANT

. Developed and implemented DFM guidelines, component library, and

stencil guidelines for PCBA assemblies which provided lowest cost and

highest quality that resulted in higher profits.

. Increased site revenue, due to the timely execution of Design For

Manufacturability reviews, as the process / product engineering member

of the site's PCBA quoting team (including medical).

. Participated as the Siemens Representative, due to the "By Invitation

Only" on the BGA / CSP Reliability Consortium sponsored by JPL / NASA,

to understand the BGA / CSP detractors, which enhanced technical PCBA

capabilities which were required for medical products.

Intergraph Corporation, Huntsville, AL 1993 - 1995

PRINCIPAL MANUFACTURING CONCURRENT ENGINEER (Manufacturing Engineering

PCBA): Responsible for NPI as an interface between PCBA engineering and

manufacturing (including internal PWB fab) conducting formalized design

reviews (concurrent engineering).

. Developed and implemented DFM guidelines, component library for SMT /

PTH assemblies, resulting in higher quality, and lower product costs.

. Researched, implemented, and qualified CBGA / CCGA components that

extended PCA technical capabilities, to allow for new products and

additional revenue.

Summary of diverse experience prior to 1992:

IBM Corporation, Electronic Card Assembly and Test (ECAT), Charlotte, NC

and East Fishkill Facility (Components Division), Hopewell Junction, NY

SENIOR ENGINEER / SCIENTIST / TECHNICAL MANAGER / TEAM LEADER

(Adv. Manufacturing Engineering / Early Manufacturing

Involvement / Center of Competency)

. Implemented as lead engineer the installation and qualification of

IBM's first double-sided SMT assembly line, with SMT evolution (TAB,

Chip on Board, Chip on Glass(wire bonding)), and new type PWBs (flex,

molded card, etc.) for leading edge technologies.

. Participated as team member of IBM's installation and qualification of

Build Assembly Test (BAT) team (Flip chip on ceramic) to establish

leading edge technology, which permitted increased revenue due to

increased market share of IBM's mainframes.

. Developed and implemented metallization, plating baths (Electroless &

Electrolytic) and associated processes for leading edge, cost

competitive component and PWB fabrication.

MAJOR AWARDS: IBM Outstanding Technical Achievement, "SMT Qualification"

Two IPC Distinguished Committee Service Awards:

"Stencil Design IPC-7525 & Land

Patterns IPC-7351"

EDUCATION:

Syracuse University, Poughkeepsie, NY: M.S. Studies in Computer

Engineering

Marist College, Poughkeepsie, NY: B.A. in Chemistry (Obtained via

evening classes)

State University of N.Y., Farmingdale, NY: A.A.S. in Chemistry and

Metallurgy

Wake Tech, Raleigh, NC PMI Certification: Currently studying

Program Management

SOCIETY MEMBERSHIPS:

IPC: Example of various Task Groups Membership (including

chairman), IPC-SM-782A / IPC-7351, IPC-7525 & IPC-SM-7095; RTP IPC

Designers Council (Board of Directors)

SMTA / ISHM / IMAPS: National and Chapter offices (Vice-chairman &

committees).

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